Abstract: A connector for lightwave guides with release levers attached at the narrow sides thereof, which, when lateral pressure is applied, actuate detents. Simultaneously at the narrow sides of the connector casing recesses are provided for the release levers such that the release levers do not rise more than a small amount above the edge of the recess; whereby, the connector can be pulled by manual actuation of the release lever through the recess.

Abstract: A process and a device for substantially eliminating tolerance-dependent variations of a preselectable space between the components of an optical communication apparatus is described. U-shaped recesses are provided in a metal casing for pressing in flange-type necks of, for example, optical transmitting and receiving devices. The parallel arranged devices are so spaced from each other that they are not subject to tolerance-dependent variations. For this purpose the metallic necks are coated with a plastic layer, and ribs provided at the lateral walls of the U-shaped recesses dig into the plastic layer. The necks are pressed in precisely at a predetermined spacing by means of a gauge. By the application of varying degrees of pressure when the ribs are pressed in on one side and the other side of the neck, one of the U-shaped recesses can be off-center.

Abstract: Adjacent lying plug-connector halves, the front ends of which exhibit pin or sleeve shaped plug elements, are provided with first and second supporting bodies, of which the first supporting body, with a sleeve shaped plug element, may be connected by means of a joinable groove-tenon-interconnect lying crosswise to the plug insertion direction, and exhibits an entrance channel for a plug connector half with a pin shaped plug element. The second supporting body with a concentric guiding tube for the insertion of pin shaped plug elements from both directions exhibits a tenon-groove-interlock contour at both ends that matches that of a sleeve shaped plug element. The first supporting body can therefore be interlocked with second supporting bodies or sleeve shaped plug elements at choice, whereby light wave guides single or double plugs may be connected to transmit- and/or receive modules and light wave guides single or double plugs may be inter-connected.

Abstract: A semiconductor chip is so designed that the signal and power terminals are brought to one edge of the integrated circuit chip. The integrated circuit chip is then mounted vertically on a substrate which provides signal interconnection and power distribution to the integrated circuit chips as well as a thermal path for conducting heat away from the chips. The electrical connection from the semiconductor chip to the substrate may be by solder reflow or thermal compression bonding techniques. The package is particularly advantageous for memory integrated circuit chips. The vertical integrated circuit chips may alternatively be carried by a tape carrier which is formed into a convoluted form with all integrated circuit chips positioned substantially vertically thereon.

Abstract: A semiconductor chip is so designed that the signal and power terminals are brought to one edge of the integrated circuit chip. The integrated circuit chip is then mounted vertically on a substrate which provides signal interconnection and power distribution to the integrated circuit chips as well as a thermal path for conducting heat away from the chips. The electrical connection from the semiconductor chip to the substrate may be by solder reflow or thermal compression bonding techniques. The package is particularly advantageous for memory integrated circuit chips. The vertical integrated circuit chips may alternatively be carried by a tape carrier which is formed into a convoluted form with all integrated circuit chips positioned substantially vertically thereon.

Abstract: A method of fabricating a semiconductor device mounting element embodying a wire fan-out wherein the ends of a plurality of insulated wires are supported in a spatial parallel arrangement of columns and rows between two spaced apertured die elements, the spacing of the wires is reduced at a first location between the die elements while maintaining the spatial arrangement of columns and rows, forming an enclosure about the wire portions positioned adjacent one of the die elements and the location where the spacing of the wires is reduced, injecting an organic hardenable resin material into the enclosure thereby encapsulating the wires positioned within, severing the wires, and removing the die.

Abstract: An apertured wafer of semi-conductive material having at least one circuit thereon is mounted on a substrate having alternating layers of insulating and conductive material. Wiring connections between the circuit and the layers of conductive material extend through the aperture as well as over the periphery to shorten the length of the wiring connections.