Patents by Inventor Alfred Hannerl

Alfred Hannerl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Component and Production Method
    Publication number: 20080220567
    Abstract: A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam.
    Type: Application
    Filed: February 20, 2006
    Publication date: September 11, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Alfred Hannerl, Michael Bauer, Angela Kessler, Wolfgang Schober