Abstract: A U.V. curable coating composition useful for electronics manufacture comprising an acrylated or methacrylated oligomer and a mixture of a multifunctional and monofunctional monomer. When further combined with an elongated filler, the U.V. curable composition is suitable for use as a permanent solder mask that adheres to metals conventionally used in electronics manufacture following wave soldering.

Abstract: This invention is for an immersion tin plating composition capable of depositing tin over metallic surfaces displaceable by tin and to processes using the same. The composition is characterized by an inhibitor that improves the plating characteristics of the solution and permits an increased ratio of thiourea to tin at a relatively high tin concentration without formation of "black tin". The tin plating compositions of this invention are capable of providing an increased yield of good quality tin compared to prior art tin plating compositions.

Abstract: This invention is directed to processes for using a light sensitive photoresist material in the manufacture of an article having a surface permanently modified in an image pattern. The process comprises applying the photoresist to a substrate through a screen, preferably as a continuous, incompletely imaged layer and thereafter, imaging and developing to provide a relief image in the photoresist layer and treating the substrate to provide a permanent image in the finished article. The process is particularly useful in the manufacture of printed circuits. The process is believed to be a departure from conventional processes in the step of screening a light sensitive photoresist material over a substrate.