Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor. The thermoelectric management system can be integrated with the management system of the electrical device on a printed circuit substrate.

Abstract: Disclosed embodiments include thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader in thermal communication with a temperature sensitive region of the electrical device. The heat spreader can include the one or more pyrolytic graphite sheets. The heat spreader can include thermal/electrical elevators connecting the one or more pyrolytic graphite sheets. The systems can include a thermoelectric device in thermal communication with the heat spreader. Electric power can be directed to the heat spreader and/or thermoelectric device to provide controlled heating and/or cooling of the electrical device.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor. The thermoelectric management system can be integrated with the management system of the electrical device on a printed circuit substrate.

Abstract: A chiller system includes an intercooler configured to cool compressed charge air received from a turbocharger or a supercharger, a low temperature cooling circuit fluidly coupled to the intercooler, the low temperature cooling circuit circulating a coolant to provide cooling to the intercooler and including a low temperature radiator configured to cool the coolant, a chiller-accumulator loop having a combined chiller-accumulator, a chiller bypass line bypassing the chiller-accumulator, and a charging valve configured to selectively provide coolant to at least one of the chiller-accumulator loop and the chiller bypass line, and an air conditioner circuit circulating a refrigerant and having a primary circuit and a bypass circuit.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor. The thermoelectric management system can be integrated with the management system of the electrical device on a printed circuit substrate.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader positioned near a localized heat general of the electrical device. A fin can be connected to the heat spreader with a thermoelectric device positioned on the fin. Electric power can be directed to the thermoelectric device to provide controlled heating and/or cooling to the electrical device.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: Disclosed embodiments include thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader in thermal communication with a temperature sensitive region of the electrical device. The heat spreader can include the one or more pyrolytic graphite sheets. The heat spreader can include thermal/electrical elevators connecting the one or more pyrolytic graphite sheets. The systems can include a thermoelectric device in thermal communication with the heat spreader. Electric power can be directed to the heat spreader and/or thermoelectric device to provide controlled heating and/or cooling of the electrical device.

Abstract: A chiller system includes an intercooler configured to cool compressed charge air received from a turbocharger or a supercharger, a low temperature cooling circuit fluidly coupled to the intercooler, the low temperature cooling circuit circulating a coolant to provide cooling to the intercooler and including a low temperature radiator configured to cool the coolant, a chiller-accumulator loop having a combined chiller-accumulator, a chiller bypass line bypassing the chiller-accumulator, and a charging valve configured to selectively provide coolant to at least one of the chiller-accumulator loop and the chiller bypass line, and an air conditioner circuit circulating a refrigerant and having a primary circuit and a bypass circuit.

Abstract: Disclosed embodiments include thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader in thermal communication with a temperature sensitive region of the electrical device. The heat spreader can include the one or more pyrolytic graphite sheets. The heat spreader can include thermal/electrical elevators connecting the one or more pyrolytic graphite sheets. The systems can include a thermoelectric device in thermal communication with the heat spreader. Electric power can be directed to the heat spreader and/or thermoelectric device to provide controlled heating and/or cooling of the electrical device.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader positioned near a localized heat general of the electrical device. A fin can be connected to the heat spreader with a thermoelectric device positioned on the fin. Electric power can be directed to the thermoelectric device to provide controlled heating and/or cooling to the electrical device.

Abstract: Disclosed embodiments include thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader in thermal communication with a temperature sensitive region of the electrical device. The heat spreader can include the one or more pyrolytic graphite sheets. The heat spreader can include thermal/electrical elevators connecting the one or more pyrolytic graphite sheets. The systems can include a thermoelectric device in thermal communication with the heat spreader. Electric power can be directed to the heat spreader and/or thermoelectric device to provide controlled heating and/or cooling of the electrical device.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader positioned near a localized heat general of the electrical device. A fin can be connected to the heat spreader with a thermoelectric device positioned on the fin. Electric power can be directed to the thermoelectric device to provide controlled heating and/or cooling to the electrical device.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader positioned near a localized heat general of the electrical device. A fin can be connected to the heat spreader with a thermoelectric device positioned on the fin. Electric power can be directed to the thermoelectric device to provide controlled heating and/or cooling to the electrical device.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.