Abstract: The invention relates to a module (1) in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, with an electrically insulating carrier (2), with a connection means (3) which has a material thickness greater than 0.3 mm and is connected to the carrier (2) via a metallization area (4) which is delimited by a first end (23) and a second end (24), with electronic components (19, 20) which are connected to the connection means (3) as required, and with cooling means (14). In order that the power is supplied from the outside via the connection means (3) directly to the module and thus the bonding processes that are customary in the prior art are omitted and parasitic inductances on the power supply are avoided, the invention proposes that the connection means (3) protrudes beyond one end (23, 24) of the metallization area (4) at least at one point, is not fixed to the carrier (2) in this area (9) and has contact means (22).

Abstract: The invention relates to a module (1) in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, with an electrically insulating carrier (2), with a connection means (3) which has a material thickness greater than 0.3 mm and is connected to the carrier (2) via a metallization area (4) which is delimited by a first end (23) and a second end (24), with electronic components (19, 20) which are connected to the connection means (3) as required, and with cooling means (14). In order that the power is supplied from the outside via the connection means (3) directly to the module and thus the bonding processes that are customary in the prior art are omitted and parasitic inductances on the power supply are avoided, the invention proposes that the connection means (3) protrudes beyond one end (23, 24) of the metallization area (4) at least at one point, is not fixed to the carrier (2) in this area (9) and has contact means (22).

Abstract: A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al2O3. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.

Abstract: A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Abstract: A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

Abstract: A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al2O3. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.

Abstract: The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.

Abstract: A liquid-cooled heat sink includes a top plate having an array of circuitous liquid channels, each channel having a separate channel inlet and a common central outlet channel. The heat sink further includes a bottom plate having an inlet port and an outlet port. The heat sink further includes an intermediate plate having inlet guide channels providing fluid communication between the inlet port of the bottom plate and channel inlets of the top plate, said intermediate plate further including an outlet guide channel providing fluid communication between the common central outlet channel of the top plate and the outlet port of the bottom plate.

Abstract: The invention relates to molded functional bodies made of highly thermally conductive materials, namely aluminum nitride, to a method for the production thereof by way of extrusion, and to the use thereof.

Abstract: A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Abstract: In order to supply power and control the power supplied to an LED (43), in particular an LED (43) comprising a ceramic support element (4, 32), an LED driver circuit (17) is designed to regulate the supply current for the LED (43) in accordance with the temperature of the support element (4, 32).

Abstract: The invention relates to a method for producing a copper multi-level metallization on a ceramic substrate (4) consisting of AIN or Al2O3. High power regions (1) with metallization having a high current-carrying capacity and low power regions (2) with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate (4). According to the invention, the metallization is printed multiple times in the high power range.

Abstract: A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

Abstract: A ceramic substrate (1) with an upper side (4) and an under side (5) opposite to said upper side (4), wherein a metallization (2) is applied to the upper side (4), said metallization being connected in an electrically conducting manner to the electrical connecting elements of at least one LED (3). In order to permanently increase the reflection, according to the invention a layer (6) reflecting light towards the LED (3) or the LEDs (3) is arranged on the underside (5).

Abstract: A non-conductive ceramic material contains a base ceramic material and at least one other ceramic material having a lower coefficient of thermal expansion than that of the base material so that the coefficient of thermal expansion of the non-conductive ceramic material is identical to that of a metallic material to which it will be matched. Methods of making and using same are disclosed.

Abstract: The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and level, i.e. plate-shaped, substrates. According to the invention, this is achieved in that trenches and/or recesses are dug into the substrate using laser technology, and the metal structures are then produced in the trenches and/or recesses.

Abstract: The invention relates to an LED lamp comprising at least one LED as the luminaire, a ceramic base and a ceramic supporting body, arranged on the base and having a supporting surface for accommodating the LEDs, and further comprising a light-permeable lampshade which is fixed on the supporting body and put on the supporting surface, sintered metalized sections, which form a circuit board, being arranged on the supporting surface for the LEDs to be soldered to and optionally for applying a corresponding circuit thereto. In order for the light emitted by the LEDs to be influenced and guided by simple means, the lampshade has a cupola, dome or bonnet design and consists of glass or plastic.

Abstract: The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.

Abstract: In order to extend the life and reduce the fitting complexity involved, what is proposed is: the light-emitting unit comprises a plurality of individual identical cooling apparatus/light-emitting means modules (3), which are connected for form clusters (5), wherein each cooling apparatus/light-emitting means module (3) comprises a ceramic carrier body (1), which has, on one or more of its surfaces, sintered metallization regions (7), said metallization regions (9) forming a printed circuit board, to which one or more LEDs (2) is/are electrically conductively connected.

Abstract: Coil bodies having a ceramic core.