Abstract: A foundation pile has an innermost element, a structural tubular element surrounding the innermost element and composed of a non-metallic material, a tubular layer of a composite material surrounding the structural tubular element and connected with the later, and a friction coating applied on an outer surface of the layer of composite material.

Abstract: A foundation pile, has at least one tensioning tendon which is elongated. A tubular wall forms a hollow conduit located around the at least one tendon so that a space remains between the tensioning tendon and the hollow conduit. A structural tubular element is located around the hollow conduit and composed of a non-metallic material. A tubular layer of a composite material is located around the structural tubular element and connected with the latter. A friction coating applied on an outer surface of the layer of composite material.

Abstract: A method of transferring a plurality of road elements includes the steps of arranging a plurality of roller units on each of the road elements substantially centrally of each road element, pivotally connecting end portions of the adjacent road elements with one another, engaging the roller units of the road elements by a guiding element having a channel shape and two ends spaced from one another in a longitudinal direction and in a transverse direction, so that the roller units guidingly move inside the guiding element along the guiding element from one of the ends to the other of the ends and at the same time slightly pivot relative to one another, so that the road elements are transferred from a location at one end of the guiding element to the location at the other end of the guiding element.

Abstract: Solder paste is automatically applied to circuit boards, in predetermined amounts at predetermined positions by providing a plurality of holes in a nylon, "Delrin," "Teflon" or other plastic-metal plate, the holes being in a predetermined pattern, filling solder paste into the holes which are facing in an upward direction pivoting the plate over the circuit board, and ejecting the solder paste onto a circuit board. Conveniently the solder paste is ejected by pins mounted on a further plate and reciprocated in the holes. The position of the pins in the holes during filling determines the amount of solder paste filled into the holes.

Abstract: Solder paste is automatically applied to circuit boards, in predetermined amounts at predetermined positions by providing a plurality of holes in a nylon, "Delrin," "Teflon" or other plastic-metal plate, the holes being in a predetermined pattern, filling solder paste into the holes which are facing in an upward direction pivoting the plate over the circuit board, and ejecting the solder paste onto a circuit board. Conveniently the solder paste is ejected by pins mounted on a further plate and reciprocated in the holes. The position of the pins in the holes during filling determines the amount of solder paste filled into the holes.