Abstract: Techniques and mechanisms for providing connectivity to an integrated circuit device via a hardware interface. In an embodiment, the hardware interface includes contacts forming an array of nodes. Some or all such nodes are arranged in cells, wherein the respective node types of each cell's nodes are according to the same cell pattern. The cell pattern includes eight B nodes for the exchange of data bits, four strobe S nodes for the exchange of strobe signals, and ground (G) nodes for the providing of one or more reference potentials. The cell pattern enables formation of a lattice structure including node-contiguous G nodes each of a respective one of the multiple cells. In another embodiment, a ratio of bi-level nodes (including all S nodes and all G nodes) of the cell pattern to a total number of G nodes of the cell pattern is 12:8 or more.

Abstract: Techniques and mechanisms for providing connectivity to an integrated circuit device via a hardware interface. In an embodiment, the hardware interface includes contacts forming an array of nodes. Some or all such nodes are arranged in cells, wherein the respective node types of each cell's nodes are according to the same cell pattern. The cell pattern includes eight B nodes for the exchange of data bits, four strobe S nodes for the exchange of strobe signals, and ground (G) nodes for the providing of one or more reference potentials. The cell pattern enables formation of a lattice structure including node-contiguous G nodes each of a respective one of the multiple cells. In another embodiment, a ratio of bi-level nodes (including all S nodes and all G nodes) of the cell pattern to a total number of G nodes of the cell pattern is 12:8 or more.

Abstract: A system and method of communicating among electronic devices on a platform. The method includes inducing, at a first device coupled to a substrate, mechanical vibrations in the substrate. Then the method further includes receiving the mechanical vibrations through the substrate at a second device coupled to the substrate. The mechanical vibrations are interpreted as a command to the second device. The second device acts on the command.

Abstract: The present disclosure is generally related to power management in a circuit on a circuit board of a processor. The circuit includes a first power connector coupled to a first power input rail. The circuit includes a second power connector and a second power input rail. The circuit includes a control module. The control module is configured to determine a power specification of the circuit board. The control module is configured to detect a power cable connected to the first control connector. The control module is configured to sense a voltage at the second power connector. The control module is configured to couple the second power input rail with the first power connector or the second power connector in response to the determined power specification of the circuit board and the sensed voltage at the second power connector.

Abstract: The present disclosure is generally related to power management in a circuit on a circuit board of a processor. The circuit includes a first power connector coupled to a first power input rail. The circuit includes a second power connector and a second power input rail. The circuit includes a control module. The control module is configured to determine a power specification of the circuit board. The control module is configured to detect a power cable connected to the first control connector. The control module is configured to sense a voltage at the second power connector. The control module is configured to couple the second power input rail with the first power connector or the second power connector in response to the determined power specification of the circuit board and the sensed voltage at the second power connector.