Patents by Inventor Alfredo Mendoza

Alfredo Mendoza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11299209
    Abstract: The present disclosure describes a vehicle including an inner wheelbase panel, a first panel, a second panel and a pillar that is coupled to the wheelbase panel. The pillar includes a wall, a first flange, a second flange, and a tunnel. The wall defines an inner cavity and an outer cavity. The first flange extends outwardly from the wall and the second flange extends inwardly from the wall. The vehicle includes baffle which extends through the tunnel and is sized and shaped to seal both the inner cavity and the outer cavity.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: April 12, 2022
    Assignee: Ford Global Technologies, LLC
    Inventors: Maciej Bednarek, Aakash Patel, Chienhom Lee, Jesús Alfredo Mendoza González
  • Publication number: 20210306175
    Abstract: Methods, systems, and computer readable media can be operable to facilitate a gathering and transmission of monitoring data from a sensor module to a telemetry control center. One or more sensor modules may be attached or otherwise connected to one or more devices that are included within an HFC infrastructure. Each sensor module may include one or more sensors that capture monitoring signals. The sensor module may interface with a communication link that is associated with the device to which it is connected. The sensor module may process the captured monitoring signals and output the processed signals to a telemetry control center, the processed signals being output over a reverse signal path that is utilized by the device to which the sensor module is connected.
    Type: Application
    Filed: May 8, 2019
    Publication date: September 30, 2021
    Inventors: Sergio Alfredo Mendoza Aguirre, Joaquin Beas
  • Publication number: 20190364347
    Abstract: Methods, systems, and computer readable media can be operable to facilitate a gathering and transmission of monitoring data from a sensor module to a telemetry control center. One or more sensor modules may be attached or otherwise connected to one or more devices that are included within an HFC infrastructure. Each sensor module may include one or more sensors that capture monitoring signals. The sensor module may interface with a communication link that is associated with the device to which it is connected. The sensor module may process the captured monitoring signals and output the processed signals to a telemetry control center, the processed signals being output over a reverse signal path that is utilized by the device to which the sensor module is connected.
    Type: Application
    Filed: May 8, 2019
    Publication date: November 28, 2019
    Inventors: Sergio Alfredo Mendoza Aguirre, Joaquin Beas
  • Patent number: 10033121
    Abstract: A system (100) includes a threaded boss (101) defining a central axis (104), a metal panel (102), and a fastener (103) to couple the metal panel to the threaded boss. The fastener includes a threaded shaft (105) terminating at a paddle (106), which can be oblong. The metal panel can define an oblong aperture (112), where the paddle is to pass through the oblong aperture when rotated (115) to a first rotational alignment (113) about the central axis. The metal panel can also include one or more retention contours (116,117) disposed adjacent to the oblong aperture. Each retention contour can include a ramp (118,120) defined by a curved central axis (305) and a retention bridge (119,121) defining a recess (122,123) to receive the oblong paddle when rotated to a second rotational alignment (114) about the central axis.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: July 24, 2018
    Assignee: ARRIS Enterprises LLC
    Inventors: Sergio Alfredo Mendoza Aguirre, Carlos Gonzalez Inda, Julio Cesar Ayala Vera
  • Publication number: 20180204672
    Abstract: An inductive coil or High Q antenna apparatus, method and computer readable media for a wireless system comprises two or more adjacent conductor traces on a substrate. The two or more adjacent conductor traces are arranged parallel to each other and electrically connected at proximal and distal ends. The two or more adjacent conductor traces are displaced from each other by a preselected fixed distance and are arranged in a single layer on one side of the substrate. Advantageously, the two or more adjacent conductor traces effectively reduce the Effective Series Resistance (ESR) and have the effect of improving the Quality Factor Q of the inductive coil enabling data transmission over large distances.
    Type: Application
    Filed: January 13, 2017
    Publication date: July 19, 2018
    Inventor: Sergio Alfredo Mendoza Aguirre
  • Patent number: 9800338
    Abstract: A diplex filter having tunable inductors. Preferably the tunable inductors include pads that may each selectively receive one end of a jumper.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: October 24, 2017
    Assignee: ARRIS Enterprises LLC
    Inventors: Sergio Alfredo Mendoza Aguirre, LuisJavier Aguirre
  • Publication number: 20170141555
    Abstract: A system (100) includes a threaded boss (101) defining a central axis (104), a metal panel (102), and a fastener (103) to couple the metal panel to the threaded boss. The fastener includes a threaded shaft (105) terminating at a paddle (106), which can be oblong. The metal panel can define an oblong aperture (112), where the paddle is to pass through the oblong aperture when rotated (115) to a first rotational alignment (113) about the central axis. The metal panel can also include one or more retention contours (116,117) disposed adjacent to the oblong aperture. Each retention contour can include a ramp (118,120) defined by a curved central axis (305) and a retention bridge (119,121) defining a recess (122,123) to receive the oblong paddle when rotated to a second rotational alignment (114) about the central axis.
    Type: Application
    Filed: November 12, 2015
    Publication date: May 18, 2017
    Inventors: Sergio Alfredo Mendoza Aguirre, Carlos Gonzalez Inda, Julio Cesar Ayala Vera
  • Patent number: 9485021
    Abstract: Systems, devices, and methods for hybrid anti-clipping in optical links in hybrid fiber-coaxial (HFC) networks are disclosed. A hybrid anti-clipping circuit can be included in both the uplink and downlink paths of the HFC network to avoid driving the laser in the optical link above a clipping threshold. The anti-clipping circuit can compare the average, or RMS, input power level and the power envelope of a RF input signal to a clipping threshold associated with the particular laser module being used. If the average power is above the clipping threshold, then the input signal can be attenuated proportionally to avoid clipping. If peaks in the power envelope are above the clipping threshold, then the bias current of the laser module can be adjusted to avoid clipping. Accordingly, the modes of anti-clipping circuit operation include applying attenuation to the input signal and/or adjusting the laser module bias current.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: November 1, 2016
    Assignee: ARRIS Enterprises, Inc.
    Inventors: Joaquin Beas Bujanos, Sergio Alfredo Mendoza Aguirre
  • Publication number: 20160028482
    Abstract: Systems, devices, and methods for hybrid anti-clipping in optical links in hybrid fiber-coaxial (HFC) networks are disclosed. A hybrid anti-clipping circuit can be included in both the uplink and downlink paths of the HFC network to avoid driving the laser in the optical link above a clipping threshold. The anti-clipping circuit can compare the average, or RMS, input power level and the power envelope of a RF input signal to a clipping threshold associated with the particular laser module being used. If the average power is above the clipping threshold, then the input signal can be attenuated proportionally to avoid clipping. If peaks in the power envelope are above the clipping threshold, then the bias current of the laser module can be adjusted to avoid clipping. Accordingly, the modes of anti-clipping circuit operation include applying attenuation to the input signal and/or adjusting the laser module bias current.
    Type: Application
    Filed: July 25, 2014
    Publication date: January 28, 2016
    Inventors: Joaquin Beas Bujanos, Sergio Alfredo Mendoza Aguirre
  • Publication number: 20070234285
    Abstract: Providing the developer porting an application program from a source operating system platform to a target operating system platform with a list of API functions supported by the source operating system platform on which the application program is running but unsupported by the target platform. The implementation includes generating a list of interface functions in said application program supported by the source platform and comparing this list of source supported application program functions with a list of prototype application program functions supported by the target platform. As a result of the comparison, there is generated an output list of the application program interface functions supported by said source platform but unsupported by said target platform.
    Type: Application
    Filed: February 28, 2006
    Publication date: October 4, 2007
    Inventors: Alfredo Mendoza, Chakarat Skawratananond
  • Publication number: 20070220348
    Abstract: A computer implemented method, computer program product, and computer usable program code for preventing execution of program components having errors. First, a software application is executed. The software application interacts with a number of programs. Next, an error message is received. The error message indicates an error has occurred in a first program within the number of programs. The first program is then isolated such that the first program no longer interacts with the software application.
    Type: Application
    Filed: February 28, 2006
    Publication date: September 20, 2007
    Inventors: Alfredo Mendoza, Stephen Peckham, Clifford Spinac, Tiffany Winman
  • Patent number: 7208841
    Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: April 24, 2007
    Assignee: Motorola, Inc.
    Inventors: James Jen-Ho Wang, Jin-Wook Jang, Alfredo Mendoza, Rajashi Runton, Russell Shumway
  • Publication number: 20070038708
    Abstract: Sending E-Mail including the conventional implementation enabling the sender of an electronic mail document to specify users to receive the document; but, in addition, the process invites the sender creating the E-Mail to prompt the sender with more potential recipients as the sender, proceeds with the creation of the E-Mail message. An address book is maintained including the E-Mail addresses of a set of names of selected recipients who regularly receive E-Mail from the sender. Then, there is monitoring the text being entered for words with initial capital letters combined with an implementation responsive to the monitoring for determining if a located word with an initial capital corresponds to a name in said address book. The corresponding name to the designated recipients of the E-Mail message provided the sender interactively agrees to do so.
    Type: Application
    Filed: August 11, 2005
    Publication date: February 15, 2007
    Inventors: Balaji Atyam, Franck Barillaud, Matthew Cali, Anita Govindjee, Alfredo Mendoza
  • Publication number: 20060069621
    Abstract: A system for allocating resources which are anticipated to be available in an on-demand computing at some time in the future, wherein a producer trending agent (PTA) lists resources according to a trend prediction of resource availability in the past, a consumer trending agent (CTA) places bids for listed resources according to previous resource usage trends, and an arbitration system (REAS) matches the bids with the listings to determine if a match exists. If so, a binding contract for consumption of the matched listed resources is established. The PTA also produce tier-based dynamic incentive (TDI) schema which divides potential bidders into tiers, and offers additional resource incentives according to the tiers. Both PTA and CTA dynamically update their available/usage trends, listings and bids, over time.
    Type: Application
    Filed: August 19, 2004
    Publication date: March 30, 2006
    Applicant: International Business Machines Corporation
    Inventors: Kyusun Chang, Jagadish Dasari, John Falkl, Alfredo Mendoza
  • Publication number: 20050188345
    Abstract: An example of a solution provided here comprises assessing readiness for transformation, based on a number of desirable application attributes; planning development work (which may involve mapping desirable application attributes to kinds of help); generating a proposal for transformation, and outputting the proposal.
    Type: Application
    Filed: February 19, 2004
    Publication date: August 25, 2005
    Applicant: International Business Machines Corporation
    Inventors: Kyusun Chang, Jagadish Dasari, Hari Madduri, Alfredo Mendoza, John Mims
  • Publication number: 20050023680
    Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.
    Type: Application
    Filed: July 30, 2004
    Publication date: February 3, 2005
    Inventors: James Wang, Jin-Wook Jang, Alfredo Mendoza, Rajashi Runton, Russell Shumway
  • Patent number: 6790759
    Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: September 14, 2004
    Assignee: Freescale Semiconductor, Inc.
    Inventors: James Jen-Ho Wang, Jin-Wook Jang, Alfredo Mendoza, Rajashi Runton, Russell Shumway