Patents by Inventor Alfredo Mendoza
Alfredo Mendoza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230060495Abstract: A fixture for testing electrical equipment. The fixture may have a tool header shaped to releasably engage the test equipment and a plunger that moves generally linearly between a first position and a second position, the first position engaging the test equipment and the second position releasing the test equipment. In some embodiments the tool is header rotatable relative to the plunger. In some embodiments, the tool header is movable relative to the plunger over at least a range of motion of the plunger.Type: ApplicationFiled: July 11, 2022Publication date: March 2, 2023Applicant: ARRIS Enterprises LLCInventors: Sergio Alfredo Mendoza AGUIRRE, Sergio Antonio Delon CANSECO, Carlos Paul Gonzalez INDA
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Publication number: 20220337313Abstract: An optical communication fiber link including a monitoring system connected to an optical fiber transmitting electromagnetic radiation including a communication. The monitoring system includes a detection system detecting a scattering of the electromagnetic radiation from the optical fiber. The monitoring system monitors the scattering for an abnormal change and determines, from the abnormal change, an absence or a presence of a fault in the optical fiber.Type: ApplicationFiled: April 19, 2022Publication date: October 20, 2022Applicant: ARRIS Enterprises LLCInventors: Sergio Alfredo Mendoza AGUIRRE, Jose A. TORRES ZUGAIDE, Emilio Rodriquez DOMINGUEZ
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Patent number: 11299209Abstract: The present disclosure describes a vehicle including an inner wheelbase panel, a first panel, a second panel and a pillar that is coupled to the wheelbase panel. The pillar includes a wall, a first flange, a second flange, and a tunnel. The wall defines an inner cavity and an outer cavity. The first flange extends outwardly from the wall and the second flange extends inwardly from the wall. The vehicle includes baffle which extends through the tunnel and is sized and shaped to seal both the inner cavity and the outer cavity.Type: GrantFiled: November 10, 2020Date of Patent: April 12, 2022Assignee: Ford Global Technologies, LLCInventors: Maciej Bednarek, Aakash Patel, Chienhom Lee, Jesús Alfredo Mendoza González
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Publication number: 20210306175Abstract: Methods, systems, and computer readable media can be operable to facilitate a gathering and transmission of monitoring data from a sensor module to a telemetry control center. One or more sensor modules may be attached or otherwise connected to one or more devices that are included within an HFC infrastructure. Each sensor module may include one or more sensors that capture monitoring signals. The sensor module may interface with a communication link that is associated with the device to which it is connected. The sensor module may process the captured monitoring signals and output the processed signals to a telemetry control center, the processed signals being output over a reverse signal path that is utilized by the device to which the sensor module is connected.Type: ApplicationFiled: May 8, 2019Publication date: September 30, 2021Inventors: Sergio Alfredo Mendoza Aguirre, Joaquin Beas
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Publication number: 20190364347Abstract: Methods, systems, and computer readable media can be operable to facilitate a gathering and transmission of monitoring data from a sensor module to a telemetry control center. One or more sensor modules may be attached or otherwise connected to one or more devices that are included within an HFC infrastructure. Each sensor module may include one or more sensors that capture monitoring signals. The sensor module may interface with a communication link that is associated with the device to which it is connected. The sensor module may process the captured monitoring signals and output the processed signals to a telemetry control center, the processed signals being output over a reverse signal path that is utilized by the device to which the sensor module is connected.Type: ApplicationFiled: May 8, 2019Publication date: November 28, 2019Inventors: Sergio Alfredo Mendoza Aguirre, Joaquin Beas
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Patent number: 10033121Abstract: A system (100) includes a threaded boss (101) defining a central axis (104), a metal panel (102), and a fastener (103) to couple the metal panel to the threaded boss. The fastener includes a threaded shaft (105) terminating at a paddle (106), which can be oblong. The metal panel can define an oblong aperture (112), where the paddle is to pass through the oblong aperture when rotated (115) to a first rotational alignment (113) about the central axis. The metal panel can also include one or more retention contours (116,117) disposed adjacent to the oblong aperture. Each retention contour can include a ramp (118,120) defined by a curved central axis (305) and a retention bridge (119,121) defining a recess (122,123) to receive the oblong paddle when rotated to a second rotational alignment (114) about the central axis.Type: GrantFiled: November 12, 2015Date of Patent: July 24, 2018Assignee: ARRIS Enterprises LLCInventors: Sergio Alfredo Mendoza Aguirre, Carlos Gonzalez Inda, Julio Cesar Ayala Vera
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Publication number: 20180204672Abstract: An inductive coil or High Q antenna apparatus, method and computer readable media for a wireless system comprises two or more adjacent conductor traces on a substrate. The two or more adjacent conductor traces are arranged parallel to each other and electrically connected at proximal and distal ends. The two or more adjacent conductor traces are displaced from each other by a preselected fixed distance and are arranged in a single layer on one side of the substrate. Advantageously, the two or more adjacent conductor traces effectively reduce the Effective Series Resistance (ESR) and have the effect of improving the Quality Factor Q of the inductive coil enabling data transmission over large distances.Type: ApplicationFiled: January 13, 2017Publication date: July 19, 2018Inventor: Sergio Alfredo Mendoza Aguirre
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Patent number: 9800338Abstract: A diplex filter having tunable inductors. Preferably the tunable inductors include pads that may each selectively receive one end of a jumper.Type: GrantFiled: July 25, 2014Date of Patent: October 24, 2017Assignee: ARRIS Enterprises LLCInventors: Sergio Alfredo Mendoza Aguirre, LuisJavier Aguirre
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Publication number: 20170141555Abstract: A system (100) includes a threaded boss (101) defining a central axis (104), a metal panel (102), and a fastener (103) to couple the metal panel to the threaded boss. The fastener includes a threaded shaft (105) terminating at a paddle (106), which can be oblong. The metal panel can define an oblong aperture (112), where the paddle is to pass through the oblong aperture when rotated (115) to a first rotational alignment (113) about the central axis. The metal panel can also include one or more retention contours (116,117) disposed adjacent to the oblong aperture. Each retention contour can include a ramp (118,120) defined by a curved central axis (305) and a retention bridge (119,121) defining a recess (122,123) to receive the oblong paddle when rotated to a second rotational alignment (114) about the central axis.Type: ApplicationFiled: November 12, 2015Publication date: May 18, 2017Inventors: Sergio Alfredo Mendoza Aguirre, Carlos Gonzalez Inda, Julio Cesar Ayala Vera
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Patent number: 9485021Abstract: Systems, devices, and methods for hybrid anti-clipping in optical links in hybrid fiber-coaxial (HFC) networks are disclosed. A hybrid anti-clipping circuit can be included in both the uplink and downlink paths of the HFC network to avoid driving the laser in the optical link above a clipping threshold. The anti-clipping circuit can compare the average, or RMS, input power level and the power envelope of a RF input signal to a clipping threshold associated with the particular laser module being used. If the average power is above the clipping threshold, then the input signal can be attenuated proportionally to avoid clipping. If peaks in the power envelope are above the clipping threshold, then the bias current of the laser module can be adjusted to avoid clipping. Accordingly, the modes of anti-clipping circuit operation include applying attenuation to the input signal and/or adjusting the laser module bias current.Type: GrantFiled: July 25, 2014Date of Patent: November 1, 2016Assignee: ARRIS Enterprises, Inc.Inventors: Joaquin Beas Bujanos, Sergio Alfredo Mendoza Aguirre
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Publication number: 20160028482Abstract: Systems, devices, and methods for hybrid anti-clipping in optical links in hybrid fiber-coaxial (HFC) networks are disclosed. A hybrid anti-clipping circuit can be included in both the uplink and downlink paths of the HFC network to avoid driving the laser in the optical link above a clipping threshold. The anti-clipping circuit can compare the average, or RMS, input power level and the power envelope of a RF input signal to a clipping threshold associated with the particular laser module being used. If the average power is above the clipping threshold, then the input signal can be attenuated proportionally to avoid clipping. If peaks in the power envelope are above the clipping threshold, then the bias current of the laser module can be adjusted to avoid clipping. Accordingly, the modes of anti-clipping circuit operation include applying attenuation to the input signal and/or adjusting the laser module bias current.Type: ApplicationFiled: July 25, 2014Publication date: January 28, 2016Inventors: Joaquin Beas Bujanos, Sergio Alfredo Mendoza Aguirre
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Publication number: 20070234285Abstract: Providing the developer porting an application program from a source operating system platform to a target operating system platform with a list of API functions supported by the source operating system platform on which the application program is running but unsupported by the target platform. The implementation includes generating a list of interface functions in said application program supported by the source platform and comparing this list of source supported application program functions with a list of prototype application program functions supported by the target platform. As a result of the comparison, there is generated an output list of the application program interface functions supported by said source platform but unsupported by said target platform.Type: ApplicationFiled: February 28, 2006Publication date: October 4, 2007Inventors: Alfredo Mendoza, Chakarat Skawratananond
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Publication number: 20070220348Abstract: A computer implemented method, computer program product, and computer usable program code for preventing execution of program components having errors. First, a software application is executed. The software application interacts with a number of programs. Next, an error message is received. The error message indicates an error has occurred in a first program within the number of programs. The first program is then isolated such that the first program no longer interacts with the software application.Type: ApplicationFiled: February 28, 2006Publication date: September 20, 2007Inventors: Alfredo Mendoza, Stephen Peckham, Clifford Spinac, Tiffany Winman
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Patent number: 7208841Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.Type: GrantFiled: July 30, 2004Date of Patent: April 24, 2007Assignee: Motorola, Inc.Inventors: James Jen-Ho Wang, Jin-Wook Jang, Alfredo Mendoza, Rajashi Runton, Russell Shumway
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Publication number: 20070038708Abstract: Sending E-Mail including the conventional implementation enabling the sender of an electronic mail document to specify users to receive the document; but, in addition, the process invites the sender creating the E-Mail to prompt the sender with more potential recipients as the sender, proceeds with the creation of the E-Mail message. An address book is maintained including the E-Mail addresses of a set of names of selected recipients who regularly receive E-Mail from the sender. Then, there is monitoring the text being entered for words with initial capital letters combined with an implementation responsive to the monitoring for determining if a located word with an initial capital corresponds to a name in said address book. The corresponding name to the designated recipients of the E-Mail message provided the sender interactively agrees to do so.Type: ApplicationFiled: August 11, 2005Publication date: February 15, 2007Inventors: Balaji Atyam, Franck Barillaud, Matthew Cali, Anita Govindjee, Alfredo Mendoza
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Publication number: 20060069621Abstract: A system for allocating resources which are anticipated to be available in an on-demand computing at some time in the future, wherein a producer trending agent (PTA) lists resources according to a trend prediction of resource availability in the past, a consumer trending agent (CTA) places bids for listed resources according to previous resource usage trends, and an arbitration system (REAS) matches the bids with the listings to determine if a match exists. If so, a binding contract for consumption of the matched listed resources is established. The PTA also produce tier-based dynamic incentive (TDI) schema which divides potential bidders into tiers, and offers additional resource incentives according to the tiers. Both PTA and CTA dynamically update their available/usage trends, listings and bids, over time.Type: ApplicationFiled: August 19, 2004Publication date: March 30, 2006Applicant: International Business Machines CorporationInventors: Kyusun Chang, Jagadish Dasari, John Falkl, Alfredo Mendoza
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Publication number: 20050188345Abstract: An example of a solution provided here comprises assessing readiness for transformation, based on a number of desirable application attributes; planning development work (which may involve mapping desirable application attributes to kinds of help); generating a proposal for transformation, and outputting the proposal.Type: ApplicationFiled: February 19, 2004Publication date: August 25, 2005Applicant: International Business Machines CorporationInventors: Kyusun Chang, Jagadish Dasari, Hari Madduri, Alfredo Mendoza, John Mims
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Publication number: 20050023680Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.Type: ApplicationFiled: July 30, 2004Publication date: February 3, 2005Inventors: James Wang, Jin-Wook Jang, Alfredo Mendoza, Rajashi Runton, Russell Shumway
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Patent number: 6790759Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.Type: GrantFiled: July 31, 2003Date of Patent: September 14, 2004Assignee: Freescale Semiconductor, Inc.Inventors: James Jen-Ho Wang, Jin-Wook Jang, Alfredo Mendoza, Rajashi Runton, Russell Shumway