Abstract: An electronic component such as a ceramic capacitor is coupled to a dielectric substrate package. Encapsulant material substantially surrounding the sides of the component, develops cracks therein, particularly near the corners of the component where CTE stresses are greatest. The cracks propagate downward into the dielectric substrate material and sever circuit lines in the substrate causing failure. A mounting pad for the component is extended from beneath the component to substantially beyond the outer periphery of the encapsulant material to prevent cracks from propagating into the dielectric material.