Patents by Inventor Alfredo Moncayo

Alfredo Moncayo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10366045
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: July 30, 2019
    Assignee: Rambus Inc.
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Publication number: 20190163661
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Application
    Filed: November 15, 2017
    Publication date: May 30, 2019
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Patent number: 10212807
    Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: February 19, 2019
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventor: Alfredo Moncayo
  • Publication number: 20180157615
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Application
    Filed: November 15, 2017
    Publication date: June 7, 2018
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Publication number: 20180103541
    Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.
    Type: Application
    Filed: November 29, 2017
    Publication date: April 12, 2018
    Inventor: Alfredo Moncayo
  • Patent number: 9852105
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: December 26, 2017
    Assignee: Rambus Inc.
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Publication number: 20170367177
    Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 21, 2017
    Inventor: Alfredo Moncayo
  • Patent number: 9848488
    Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: December 19, 2017
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventor: Alfredo Moncayo
  • Publication number: 20170031864
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 2, 2017
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Patent number: 9433083
    Abstract: An electrical interface on a circuit board is disclosed for electrically connecting the circuit board to a connector to reduce reflections and impedance mismatch and increase power transfer from the connector to the signal path of the circuit board. The signal interface includes a signal conductor including a signal pad configured to connect to a connector pin and a waveguide section extending from the signal pad. The waveguide narrows from a signal pad width to connect to a microstrip conductor. A first ground section is spaced rightward from the signal conductor such that the inner edge of the first ground section, angles in correspondence with the narrowing of the waveguide to generally track an outer right edge of the waveguide. A second ground section is spaced leftward from the signal conductor and configured generally similarly to the first ground section.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: August 30, 2016
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventors: Alfredo Moncayo, Brian Hostetter, Luis F. Armenta
  • Patent number: 9411767
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: August 9, 2016
    Assignee: Rambus Inc.
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Patent number: 9323711
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: April 26, 2016
    Assignee: Rambus Inc.
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Publication number: 20160026599
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Application
    Filed: October 5, 2015
    Publication date: January 28, 2016
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Publication number: 20150288085
    Abstract: An electrical interface on a circuit board is disclosed for electrically connecting the circuit board to a connector to reduce reflections and impedance mismatch and increase power transfer from the connector to the signal path of the circuit board. The signal interface includes a signal conductor including a signal pad configured to connect to a connector pin and a waveguide section extending from the signal pad. The waveguide narrows from a signal pad width to connect to a microstrip conductor. A first ground section is spaced rightward from the signal conductor such that the inner edge of the first ground section, angles in correspondence with the narrowing of the waveguide to generally track an outer right edge of the waveguide. A second ground section is spaced leftward from the signal conductor and configured generally similarly to the first ground section.
    Type: Application
    Filed: April 6, 2015
    Publication date: October 8, 2015
    Inventors: Alfredo Moncayo, Brian Hostetter, Luis F. Armenta
  • Patent number: 9152581
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: October 6, 2015
    Assignee: Rambus Inc.
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Patent number: 9135967
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: September 15, 2015
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Patent number: 9135186
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: September 15, 2015
    Assignee: Rambus Inc.
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Patent number: 9110828
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: August 18, 2015
    Assignee: Rambus Inc.
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Publication number: 20150220270
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Application
    Filed: April 14, 2015
    Publication date: August 6, 2015
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
  • Publication number: 20150212968
    Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.
    Type: Application
    Filed: April 10, 2015
    Publication date: July 30, 2015
    Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe