Patents by Inventor Alfredo Moncayo
Alfredo Moncayo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10366045Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: GrantFiled: November 15, 2017Date of Patent: July 30, 2019Assignee: Rambus Inc.Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Publication number: 20190163661Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: ApplicationFiled: November 15, 2017Publication date: May 30, 2019Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Patent number: 10212807Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.Type: GrantFiled: November 29, 2017Date of Patent: February 19, 2019Assignee: MACOM Technology Solutions Holdings, Inc.Inventor: Alfredo Moncayo
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Publication number: 20180157615Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: ApplicationFiled: November 15, 2017Publication date: June 7, 2018Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Publication number: 20180103541Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.Type: ApplicationFiled: November 29, 2017Publication date: April 12, 2018Inventor: Alfredo Moncayo
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Patent number: 9852105Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: GrantFiled: August 4, 2016Date of Patent: December 26, 2017Assignee: Rambus Inc.Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Publication number: 20170367177Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.Type: ApplicationFiled: June 17, 2016Publication date: December 21, 2017Inventor: Alfredo Moncayo
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Patent number: 9848488Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.Type: GrantFiled: June 17, 2016Date of Patent: December 19, 2017Assignee: MACOM Technology Solutions Holdings, Inc.Inventor: Alfredo Moncayo
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Publication number: 20170031864Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: ApplicationFiled: August 4, 2016Publication date: February 2, 2017Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Patent number: 9433083Abstract: An electrical interface on a circuit board is disclosed for electrically connecting the circuit board to a connector to reduce reflections and impedance mismatch and increase power transfer from the connector to the signal path of the circuit board. The signal interface includes a signal conductor including a signal pad configured to connect to a connector pin and a waveguide section extending from the signal pad. The waveguide narrows from a signal pad width to connect to a microstrip conductor. A first ground section is spaced rightward from the signal conductor such that the inner edge of the first ground section, angles in correspondence with the narrowing of the waveguide to generally track an outer right edge of the waveguide. A second ground section is spaced leftward from the signal conductor and configured generally similarly to the first ground section.Type: GrantFiled: April 6, 2015Date of Patent: August 30, 2016Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: Alfredo Moncayo, Brian Hostetter, Luis F. Armenta
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Patent number: 9411767Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: GrantFiled: October 5, 2015Date of Patent: August 9, 2016Assignee: Rambus Inc.Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Patent number: 9323711Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: GrantFiled: April 9, 2015Date of Patent: April 26, 2016Assignee: Rambus Inc.Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Publication number: 20160026599Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: ApplicationFiled: October 5, 2015Publication date: January 28, 2016Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Publication number: 20150288085Abstract: An electrical interface on a circuit board is disclosed for electrically connecting the circuit board to a connector to reduce reflections and impedance mismatch and increase power transfer from the connector to the signal path of the circuit board. The signal interface includes a signal conductor including a signal pad configured to connect to a connector pin and a waveguide section extending from the signal pad. The waveguide narrows from a signal pad width to connect to a microstrip conductor. A first ground section is spaced rightward from the signal conductor such that the inner edge of the first ground section, angles in correspondence with the narrowing of the waveguide to generally track an outer right edge of the waveguide. A second ground section is spaced leftward from the signal conductor and configured generally similarly to the first ground section.Type: ApplicationFiled: April 6, 2015Publication date: October 8, 2015Inventors: Alfredo Moncayo, Brian Hostetter, Luis F. Armenta
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Patent number: 9152581Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: GrantFiled: April 14, 2015Date of Patent: October 6, 2015Assignee: Rambus Inc.Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Patent number: 9135967Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: GrantFiled: April 10, 2015Date of Patent: September 15, 2015Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Patent number: 9135186Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: GrantFiled: April 10, 2015Date of Patent: September 15, 2015Assignee: Rambus Inc.Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Patent number: 9110828Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: GrantFiled: July 1, 2014Date of Patent: August 18, 2015Assignee: Rambus Inc.Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Publication number: 20150220270Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: ApplicationFiled: April 14, 2015Publication date: August 6, 2015Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe
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Publication number: 20150212968Abstract: An integrated circuit device includes a transmitter circuit including an output driver. The integrated circuit device includes a first register to store a value representative of a drive strength setting associated with the transmitter circuit such that the output driver outputs data in accordance with the drive strength setting. The integrated circuit device also includes a second register to store a value representative of an equalization setting associated with the transmitter circuit such that the output driver outputs data in accordance with the equalization setting. The integrated circuit device further includes a third register to store a value representative of a slew rate setting associated with the transmitter circuit such that the output driver outputs data in accordance with the slew rate setting.Type: ApplicationFiled: April 10, 2015Publication date: July 30, 2015Inventors: Mark A. Horowitz, Craig E. Hampel, Alfredo Moncayo, Kevin S. Donnelly, Jared L. Zerbe