Patents by Inventor Algirdas Vaskelis

Algirdas Vaskelis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless deposition of cobalt alloys
    Patent number: 7988774
    Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: August 2, 2011
    Assignee: Lam Research Corporation
    Inventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
  • ELECTROLESS DEPOSITION OF COBALT ALLOYS
    Publication number: 20100304562
    Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
    Type: Application
    Filed: August 10, 2010
    Publication date: December 2, 2010
    Applicant: Lam Research Corporation
    Inventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
  • Electroless deposition of cobalt alloys
    Patent number: 7794530
    Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: September 14, 2010
    Assignee: Lam Research Corporation
    Inventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
  • Plating solutions for electroless deposition of ruthenium
    Patent number: 7682431
    Abstract: An electroless ruthenium plating solution is disclosed herein. The solution includes a ruthenium source, a polyamino polycarboxylic acid complexing agent, a reducing agent, a stabilizing agent, and a pH-modifying substance. A method of preparing an electroless ruthenium plating solution is also provided.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: March 23, 2010
    Assignee: Lam Research Corporation
    Inventors: Albina Zieliene, Algirdas Vaskelis, Eugenijus Norkus
  • Electroless deposition of cobalt alloys
    Publication number: 20080152822
    Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
    Type: Application
    Filed: December 22, 2006
    Publication date: June 26, 2008
    Inventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
  • Plating solution for electroless deposition of copper
    Patent number: 7306662
    Abstract: An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: December 11, 2007
    Assignee: Lam Research Corporation
    Inventors: Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene
  • Plating solutions for electroless deposition of copper
    Patent number: 7297190
    Abstract: An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: November 20, 2007
    Assignee: Lam Research Corporation
    Inventors: Yezdi Dordi, William Thie, Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene
  • PLATING SOLUTION FOR ELECTROLESS DEPOSITION OF COPPER
    Publication number: 20070261594
    Abstract: An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.
    Type: Application
    Filed: May 11, 2006
    Publication date: November 15, 2007
    Applicant: LAM RESEARCH CORPORATION
    Inventors: Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene