Abstract: There is disclosed a fluid cooling system for a datacenter, wherein the fluid cooling system comprises a leakage detection device, comprising a leakage sensor, the leakage sensor comprising an electrical circuit configured to be open in normal use conditions of the fluid cooling system and to be closed in case of liquid leak, the leakage detection device comprising said control valve as an inlet shut off actuator when a liquid leakage is detected, and a check valve to act as the outlet shut off actuator when a liquid leakage is detected.

Abstract: The disclosed embodiments are provide a liquid cooling arrangement and method for a server rack including input and output temperature sensors of the server rack, a liquid cooling subsystem comprising a pump unit to forcibly urge the cooling liquid flow, a liquid distribution circuit fluidly-coupled to the liquid cooling subsystem and the server rack and configured to convey the cooling liquid to/from the server rack, input and output pressure sensors configured to measure the pressure of the cooling liquid flow received, and issued, by the pump unit, and a control unit. The control unit is configured to direct the pump unit to operate at full capacity, quantify pressure differences between the input/output pressure sensor measurements, determine an optimal volume flow rate based on a desired predetermined temperature difference between the input/output temperatures and empirical pump operational characteristics, and adjust the pump unit speed based on the determined optimal flow rate.

Abstract: A liquid cooling arrangement system for cooling a plurality of server clusters is disclosed. The plurality of server clusters each contain heat generating devices with liquid cooling units, comprising: a cooling circuit configured to circulate a cooling liquid and to circulate a heated liquid from the plurality of server clusters back to a dry cooler unit; the plurality of server clusters including: a first cluster and a second cluster connected in series by the cooling circuit, the first cluster including a first set of liquid cooling units connected in parallel by the cooling circuit, the first set having a first number of liquid cooling units, the second cluster including a second set of liquid cooling units connected in parallel by the cooling circuit, the second set having a second number of liquid cooling units, wherein the first number being above the second number.

Abstract: A method for controlling a speed of a fan of a dry cooling unit of a datacenter, the method comprising: estimating a thermal load (Q) of the rack-mounted data processing assemblies, estimating an air flow (AF) depending on the thermal load (Q) and an ambient temperature of the air flow (Tamb), estimating a fan rotation speed of said at least one fan assembly depending on the estimated air flow (AF), and controlling a voltage of said at least one fan assembly depending on the estimated fan rotation speed (nfan), wherein the process comprises a step of modeling the air flow (AF) as a polynomial function of the ambient temperature.

Abstract: A method for controlling a speed of a fan of a dry cooling unit of a datacenter, the method comprising: estimating a thermal load (Q) of the rack-mounted data processing assemblies, estimating an air flow (AF) depending on the thermal load (Q) and an ambient temperature of the air flow (Tamb), estimating a rotation speed fan of said at least one fan assembly depending on the estimated air flow (AF), and controlling a voltage of said at least one fan assembly depending on the estimated rotation speed fan (nfan), wherein the process comprises a step of modeling the air flow (AF) as a polynomial function of the ambient temperature.

Abstract: A datacenter dry cooling arrangement and method for cooling a heat-generating source containing a heat exchanger panel with an evaporative cooling pad. The arrangement and method incorporates temperature-, humidity-, and water flow-related data detected by respective sensors and a controller configured with executable instructions to process the received data to generate operational parameters, determine whether a thermal load, input temperatures and outside ambient temperatures comply with specified operational thresholds and operatively adjust the cooling water flow rate applied to the evaporative cooling pad to optimal levels in view of prevailing ambient weather conditions.

Abstract: A liquid cooling device for mounting onto a heat-generating electronic component submerged in an immersion cooling liquid, is presented. The cooling device body having a first surface disposed on a bottommost side for mounting onto an upper surface of the electronic component in which the first surface is configured with a open recess formed along an outer periphery of the first surface, a thermal interface material (TIM) interposed between the first surface and the upper surface of the electronic component, and a resiliently deformable gasket mounted on, and seated within, the open recess along the outer periphery of the first surface. The gasket configured to deformably expand horizontally or vertically to establish a protective fluid-proof seal for the first surface of the cooling device body, the upper surface of the electronic component, and the TIM from the immersion cooling liquid.

Abstract: An immersion tank storage system for a data center, includes: a frame defining a plurality of storage levels disposed above one another; a plurality of immersion tanks supported by the frame, each immersion tank configured to contain electronic devices and an immersion cooling liquid for cooling thereof, each storage level being configured to house first and second immersion tanks; and means for synchronously moving the first and second immersion tanks housed in at least one of the storage levels between: a storage position in which the first and second immersion tanks are spaced from each other by a first distance; and an access position in which the first and second immersion tanks are spaced from each other by a second distance greater than the first distance, wherein in the access position, the first and second immersion tanks are accessible by an operator for accessing the electronic devices contained therein.

Abstract: A cooling block includes a body having a thermal transfer surface configured to be in thermal contact with a heat-generating electronic component. The body defines a fluid conduit having a plurality of channels such that the cooling fluid flows in parallel along the channels. Each channel is defined between first and second internal sidewalls; and top and bottom walls. Each channel has either: a first dimensional configuration including first height and width values; or a second dimensional configuration including second height and width values. The first height value is greater than the second height value. The second width value is greater than the first width value. A thickness of a material of the body between the thermal transfer surface and a first channel is less than a thickness of the material of the body between the thermal transfer surface and a second channel.

Abstract: A rack system for a data center includes: a plurality of racks configured to house electronic equipment therein, at least one rack column being formed by at least some of the racks being disposed above one another, each rack having a rack depth measured in a front-to-rear direction; and at least one supporting pedestal disposed below the at least one rack column in order to support the at least one rack column, the at least one supporting pedestal being configured to be positioned on a ground surface of the data center to distribute a load of the at least one rack column on the ground surface, each of the at least one supporting pedestal having a pedestal depth measured in the front-to-rear direction.

Abstract: The disclosed systems, structures, and methods are directed to providing a rack-mounted fluid immersion cooling (IC) configuration. The rack-mounted fluid IC configuration comprises a rack-mounted immersion reservoir containing a volume of thermally cooled non-dielectric fluid and at least one electronic processing assembly comprising one or more electronic processing components. The at least one electronic processing assembly being encased within a hermetic sealed bag configured to provide a water-and air-tight seal of the at least one electronic processing assembly to shield against the direct exposure of the electronic processing components to fluids. The at least one hermetic sealed electronic processing assembly is submerged within the volume of thermally cooled fluid contained by the rack-mounted immersion reservoir.

Abstract: A cooling system and a method for cooling an electronic device are disclosed. The electronic device includes a heat-generating component. The cooling arrangement includes an immersion casing that contains a dielectric cooling liquid, the electronic device being, at least in part, immersed in the dielectric cooling liquid such that the dielectric cooling liquid collects, in use, at least a first portion of a thermal energy generated by the heat-generating component, and a photovoltaic device proximate to the immersion casing and configured to convert at least in part a second portion of the thermal energy generated by the heat-generating component into electric energy, the second portion having radiated from the dielectric cooling liquid and through the immersion casing.

Abstract: A cooling assembly and method for cooling a plurality of heat-generating components. The cooling assembly includes a main liquid inlet for receiving a heat-transfer liquid, a main liquid outlet for discharging the heat-transfer liquid and a plurality of liquid cooling units. Each liquid cooling unit is in thermal contact with a corresponding heat-generating component and includes an internal liquid conduit, the heat-transfer liquid flowing in the internal liquid conduit collecting thermal energy from the corresponding heat-generating component. The liquid cooling units are arranged in a plurality of groups, each group comprising one or more liquid cooling units fluidly connected in parallel to one another. The groups are arranged in at least one cluster, each cluster comprising two or more groups fluidly connected in series.

Abstract: A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.

Abstract: A method for assembling a rack column assembly including: positioning a first data center rack on a support surface; stacking a second data center rack atop the first data center rack; placing a first vertical column on a first lateral side of the data center racks; after said stacking, placing a second vertical column on a second lateral side of the data center racks; connecting the first vertical column to the data center racks by fastening first lateral side attachment brackets to the data center racks; and connecting the second vertical column to the data center racks by fastening second lateral side attachment brackets to the data center racks, the first lateral side attachment brackets and the second lateral side attachment brackets limiting movement of the data center racks in a depth direction of the rack column assembly.

Abstract: A method for controlling a cooling system of a rack, the rack comprising a heat generating component. The method comprises receiving, by a controller, at least one first temperature indications indicative of temperature variations of at least one heat transfer fluid circulating in at least one respective liquid channel of the cooling system; receiving, by the controller, at least one second temperature indications indicative of a temperature of an air flow of ambient air within the rack, the air flow being generated by at least one fan of the cooling system; and adjusting, based on the at least one first and second temperature indications, a rotational speed of the at least one fan and a rotational speed of at least one pump configured for causing the at least one heat transfer fluid to flow in at least one respective liquid channel.

Abstract: A datacenter rack assembly providing a liquid cooling arrangement to service an autonomous rack and an immersion cooling rack coexisting within the datacenter rack assembly is presented. The datacenter rack assembly comprises an autonomous rack containing at least one electronic processing assembly and at least one liquid cooling block while the immersion cooling rack comprises a dielectric immersion cooling fluid at least one electronic processing assembly immersed in the dielectric immersion cooling fluid, and at least one liquid cooling block. The datacenter rack assembly incorporates a liquid cooling distribution arrangement to control distribution of liquid for cooling of the autonomous and IC racks through various liquid flow distribution channel segments, temperature sensors, and communication-enabled flow control valves based on detected temperature conditions.

Abstract: A cooling block assembly for cooling a heat-generating electronic component includes: an upper block portion defining at least one internal fluid conduit and having a lower surface configured to face toward the heat-generating electronic component; a boss spaced from the lower surface and having a thermal transfer surface configured to be in thermal contact with the heat-generating electronic component, the thermal transfer surface being offset from the lower surface, a periphery of the thermal transfer surface being smaller than a periphery of the upper block portion, the periphery of the thermal transfer surface being contained within the periphery of the upper block portion in a projection thereof on a plane parallel to the thermal transfer surface; and heat distributing devices for distributing heat through a phase change of a working substance contained therein, each heat distributing device being disposed partially between the boss and the lower surface.

Abstract: An immersive cooling system is described. The system includes an immersive cooling container, including: a first reservoir; a second reservoir; numerous slots, each configured to hold a casing; a reservoir connector corresponding to each slot, and configured to provide fluid communication with the first reservoir; and a pump configured to convey a dielectric immersion cooling liquid from the second reservoir to the first reservoir. The immersive cooling system also includes a casing, configured to contain an electronic device and to fit within a slot of the container. The casing includes an inlet configured to be in fluid communication with the reservoir connector of the slot within which the casing is disposed to facilitate flow of the cooling liquid into an interior of the casing through the reservoir connector and an outlet configured to facilitate flow of the cooling liquid from the interior of the casing into the second reservoir.

Abstract: An immersion tank storage system for a data center, includes: a frame defining a plurality of storage levels disposed above one another; a plurality of immersion tanks supported by the frame, each immersion tank configured to contain electronic devices and an immersion cooling liquid for cooling thereof, each storage level being configured to house first and second immersion tanks; and means for synchronously moving the first and second immersion tanks housed in at least one of the storage levels between: a storage position in which the first and second immersion tanks are spaced from each other by a first distance; and an access position in which the first and second immersion tanks are spaced from each other by a second distance greater than the first distance, wherein in the access position, the first and second immersion tanks are accessible by an operator for accessing the electronic devices contained therein.