Abstract: An immersion tank storage system for a data center, includes: a frame defining a plurality of storage levels disposed above one another; a plurality of immersion tanks supported by the frame, each immersion tank configured to contain electronic devices and an immersion cooling liquid for cooling thereof, each storage level being configured to house first and second immersion tanks; and means for synchronously moving the first and second immersion tanks housed in at least one of the storage levels between: a storage position in which the first and second immersion tanks are spaced from each other by a first distance; and an access position in which the first and second immersion tanks are spaced from each other by a second distance greater than the first distance, wherein in the access position, the first and second immersion tanks are accessible by an operator for accessing the electronic devices contained therein.

Abstract: A cooling block includes a body having a thermal transfer surface configured to be in thermal contact with a heat-generating electronic component. The body defines a fluid conduit having a plurality of channels such that the cooling fluid flows in parallel along the channels. Each channel is defined between first and second internal sidewalls; and top and bottom walls. Each channel has either: a first dimensional configuration including first height and width values; or a second dimensional configuration including second height and width values. The first height value is greater than the second height value. The second width value is greater than the first width value. A thickness of a material of the body between the thermal transfer surface and a first channel is less than a thickness of the material of the body between the thermal transfer surface and a second channel.

Abstract: A rack system for a data center includes: a plurality of racks configured to house electronic equipment therein, at least one rack column being formed by at least some of the racks being disposed above one another, each rack having a rack depth measured in a front-to-rear direction; and at least one supporting pedestal disposed below the at least one rack column in order to support the at least one rack column, the at least one supporting pedestal being configured to be positioned on a ground surface of the data center to distribute a load of the at least one rack column on the ground surface, each of the at least one supporting pedestal having a pedestal depth measured in the front-to-rear direction.

Abstract: The disclosed systems, structures, and methods are directed to providing a rack-mounted fluid immersion cooling (IC) configuration. The rack-mounted fluid IC configuration comprises a rack-mounted immersion reservoir containing a volume of thermally cooled non-dielectric fluid and at least one electronic processing assembly comprising one or more electronic processing components. The at least one electronic processing assembly being encased within a hermetic sealed bag configured to provide a water-and air-tight seal of the at least one electronic processing assembly to shield against the direct exposure of the electronic processing components to fluids. The at least one hermetic sealed electronic processing assembly is submerged within the volume of thermally cooled fluid contained by the rack-mounted immersion reservoir.

Abstract: A cooling system and a method for cooling an electronic device are disclosed. The electronic device includes a heat-generating component. The cooling arrangement includes an immersion casing that contains a dielectric cooling liquid, the electronic device being, at least in part, immersed in the dielectric cooling liquid such that the dielectric cooling liquid collects, in use, at least a first portion of a thermal energy generated by the heat-generating component, and a photovoltaic device proximate to the immersion casing and configured to convert at least in part a second portion of the thermal energy generated by the heat-generating component into electric energy, the second portion having radiated from the dielectric cooling liquid and through the immersion casing.

Abstract: A cooling assembly and method for cooling a plurality of heat-generating components. The cooling assembly includes a main liquid inlet for receiving a heat-transfer liquid, a main liquid outlet for discharging the heat-transfer liquid and a plurality of liquid cooling units. Each liquid cooling unit is in thermal contact with a corresponding heat-generating component and includes an internal liquid conduit, the heat-transfer liquid flowing in the internal liquid conduit collecting thermal energy from the corresponding heat-generating component. The liquid cooling units are arranged in a plurality of groups, each group comprising one or more liquid cooling units fluidly connected in parallel to one another. The groups are arranged in at least one cluster, each cluster comprising two or more groups fluidly connected in series.

Abstract: A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.

Abstract: A method for assembling a rack column assembly including: positioning a first data center rack on a support surface; stacking a second data center rack atop the first data center rack; placing a first vertical column on a first lateral side of the data center racks; after said stacking, placing a second vertical column on a second lateral side of the data center racks; connecting the first vertical column to the data center racks by fastening first lateral side attachment brackets to the data center racks; and connecting the second vertical column to the data center racks by fastening second lateral side attachment brackets to the data center racks, the first lateral side attachment brackets and the second lateral side attachment brackets limiting movement of the data center racks in a depth direction of the rack column assembly.

Abstract: A method for controlling a cooling system of a rack, the rack comprising a heat generating component. The method comprises receiving, by a controller, at least one first temperature indications indicative of temperature variations of at least one heat transfer fluid circulating in at least one respective liquid channel of the cooling system; receiving, by the controller, at least one second temperature indications indicative of a temperature of an air flow of ambient air within the rack, the air flow being generated by at least one fan of the cooling system; and adjusting, based on the at least one first and second temperature indications, a rotational speed of the at least one fan and a rotational speed of at least one pump configured for causing the at least one heat transfer fluid to flow in at least one respective liquid channel.

Abstract: A datacenter rack assembly providing a liquid cooling arrangement to service an autonomous rack and an immersion cooling rack coexisting within the datacenter rack assembly is presented. The datacenter rack assembly comprises an autonomous rack containing at least one electronic processing assembly and at least one liquid cooling block while the immersion cooling rack comprises a dielectric immersion cooling fluid at least one electronic processing assembly immersed in the dielectric immersion cooling fluid, and at least one liquid cooling block. The datacenter rack assembly incorporates a liquid cooling distribution arrangement to control distribution of liquid for cooling of the autonomous and IC racks through various liquid flow distribution channel segments, temperature sensors, and communication-enabled flow control valves based on detected temperature conditions.

Abstract: A cooling block assembly for cooling a heat-generating electronic component includes: an upper block portion defining at least one internal fluid conduit and having a lower surface configured to face toward the heat-generating electronic component; a boss spaced from the lower surface and having a thermal transfer surface configured to be in thermal contact with the heat-generating electronic component, the thermal transfer surface being offset from the lower surface, a periphery of the thermal transfer surface being smaller than a periphery of the upper block portion, the periphery of the thermal transfer surface being contained within the periphery of the upper block portion in a projection thereof on a plane parallel to the thermal transfer surface; and heat distributing devices for distributing heat through a phase change of a working substance contained therein, each heat distributing device being disposed partially between the boss and the lower surface.

Abstract: An immersive cooling system is described. The system includes an immersive cooling container, including: a first reservoir; a second reservoir; numerous slots, each configured to hold a casing; a reservoir connector corresponding to each slot, and configured to provide fluid communication with the first reservoir; and a pump configured to convey a dielectric immersion cooling liquid from the second reservoir to the first reservoir. The immersive cooling system also includes a casing, configured to contain an electronic device and to fit within a slot of the container. The casing includes an inlet configured to be in fluid communication with the reservoir connector of the slot within which the casing is disposed to facilitate flow of the cooling liquid into an interior of the casing through the reservoir connector and an outlet configured to facilitate flow of the cooling liquid from the interior of the casing into the second reservoir.

Abstract: An immersion tank storage system for a data center, includes: a frame defining a plurality of storage levels disposed above one another; a plurality of immersion tanks supported by the frame, each immersion tank configured to contain electronic devices and an immersion cooling liquid for cooling thereof, each storage level being configured to house first and second immersion tanks; and means for synchronously moving the first and second immersion tanks housed in at least one of the storage levels between: a storage position in which the first and second immersion tanks are spaced from each other by a first distance; and an access position in which the first and second immersion tanks are spaced from each other by a second distance greater than the first distance, wherein in the access position, the first and second immersion tanks are accessible by an operator for accessing the electronic devices contained therein.

Abstract: A rack system for a data center includes: a plurality of racks configured to house electronic equipment therein, at least one rack column being formed by at least some of the racks being disposed above one another, each rack having a rack depth measured in a front-to-rear direction; and at least one supporting pedestal disposed below the at least one rack column in order to support the at least one rack column, the at least one supporting pedestal being configured to be positioned on a ground surface of the data center to distribute a load of the at least one rack column on the ground surface, each of the at least one supporting pedestal having a pedestal depth measured in the front-to-rear direction, the pedestal depth being greater than the rack depth, a ratio of the pedestal depth over the rack depth being between 1.2 and 2.5 inclusively.

Abstract: The instant disclosure relates to a cooling block for cooling a heat-generating electronic component, comprising: a body having an external surface, called thermal transfer surface, configured to be placed in thermal contact with the heat-generating electronic component, the body defining a fluid conduit for circulating a cooling fluid therein, the fluid conduit having at least an inlet for receiving the cooling fluid and at least an outlet for discharging the cooling fluid, the cooling block further comprising at least one acoustic wave generator, called vibrations element, configured to generate a field of vibrations of the cooling liquid in the fluid conduit, called vibrations area.

Abstract: Autonomous rack system configurations for datacenter operations are presented that include a combination of a first rack structure incorporating front-mounted heat exchanger and a second rack structure incorporating a rear-mounted heat exchanger, such that liquid-cooled heat-generating electronic components that are less tolerant to higher temperatures are disposed within the first rack structure and liquid-cooled heat-generating electronic components that are more tolerant to higher temperatures are disposed within the second rack structure. These configurations utilize the residual air flow that passes through the less temperature tolerant electronic components of the first rack structure and redirect it to the second rack structure to cool the more temperature tolerant electronic components of the second rack structure.

Abstract: A water block assembly comprising a water block unit and an insulating housing, and a method for insulating a water block unit are provided. The water block unit has an external thermal transfer surface configured to be in contact with a heat generating component to be cooled, and defines an internal fluid conduit for circulating fluid therein, a fluid inlet for feeding fluid into the internal fluid conduit, and a fluid outlet for discharging fluid from the internal fluid conduit. The insulating housing at least partly embeds the water block unit therein to limit heat transfer from the water block unit to a surrounding environment thereof, the insulating housing having an internal surface in contact with the water block unit.

Abstract: A datacenter dry cooling system and method for cooling a heat-generating source are provided and directed to maximizing the absorption of cooling water applied to an evaporating pad for evaporation and ambient air cooling while eliminating any leakages. The evaporating pad is disposed on an air-to-liquid heat exchanger panel supplied by an evaporating cooling water distribution arrangement for applying the controlled amount of cooling water to the evaporating pad. The applied cooling water is to be completely evaporated while being exposed to ambient airflow to dissipate the thermal energy of the heat-generating sources. The evaporating pad includes corresponding temperature and/or humidity sensors for detecting temperature/humidity levels at an air outlet surface and a temperature and humidity sensor at an air inlet surface.

Abstract: The invention relates to a fluid cooling method for rack-mounted processing assemblies, comprising measuring internal temperatures of said at least one air cooled electronic processing element and, when internal temperatures of rack-mounted processing assembly are less than a predetermined limit, and, determining whether at the current input cooling liquid temperature, internal temperatures of said at least one air cooled electronic processing element are less than a predetermined limit.

Abstract: The invention relates to an immersion case for a liquid cooling arrangement of a datacenter server rack, comprising a plurality of electric components, some of them generating heat when is use, called heat-generating components, the immersion case comprising a housing provided with a bottom and a longitudinal wall, delimiting an internal volume (V), and at least one heat-generating component arranged in the internal volume of the housing, the immersion case further comprising heat-transfer liquid wherein said heat-generating component is at least partially submerged, wherein the immersion case comprises at least one acoustic wave generator (200), called vibrations element, configured to generate a field of vibrations of the heat-transfer liquid in the internal volume of the housing, called vibrations area.