Abstract: A kit and a method for a dry cooler assembly is provided. The kit includes a first frame and a second frame, each being configured to support a heat exchanger. The kit further includes a base component and a roof component. The frames, the base component, and the roof component are configured to be assembled to an assembled configuration, such that the base component supports the frames in a spaced apart configuration, and the frames support the roof component. The method includes securing the base component to a surface, obtaining the first frame and the second frame, each frame being configured to support the heat exchanger, and positioning the frames such that they abut an abutment member of the base component such that the frames are supported in a spaced apart configuration.

Abstract: A multi-level modular datacenter for data processing equipment comprising a lower containment unit configured to house at least one uninterruptible power supply unit, a power distribution cabinet system, and one upper porthole disposed on a roof surface of the lower containment unit; an upper containment unit aligned and vertically disposed directly above the lower containment unit, the upper containment unit configured to house a battery assembly, a transformer, and a one lower porthole disposed on a floor surface of the upper containment unit; an electrical distribution infrastructure comprising electrically-communicative cabling to service the lower and upper containment units and the components disposed therein; and at least one electric conduit component, disposed between the lower and upper containment units configured to be aligned with the upper portholes and the lower portholes to accommodate routing of the electrically-communicative cabling and piping between the lower and upper containment units.

Abstract: Systems for cooling one or more electronic devices are disclosed, each of the one or more electronic devices including one or more heat-generating components. An immersion cooling includes a first container adapted for receiving a first heat-transfer liquid, the one or more electronic devices being, at least in part, immersed in the first heat-transfer liquid such that the first heat-transfer liquid collects, in use, at least a portion of a thermal energy generated by the one or more heat-generating components and a second container adapted for receiving a second heat-transfer liquid, the first container being, at least in part, immersed in the second container cooling system.

Abstract: A datacenter dry cooling system for cooling a heat generating source is presented that incorporates a first closed loop arrangement including an air-to-liquid heat exchanger to re-cool heat imparted onto the first cooling fluid, and a first pump that forwards the re-cooled first cooling fluid to the heat generating source. A second cooling fluid open loop arrangement that conveys a second cooling fluid via a second pump to supply the second cooling fluid onto an evaporating pad of an air-to-liquid heat exchanger for cooling dampening. The system also incorporates at least one fan to cause an air flow through the evaporating pad and the first air-to-liquid heat exchanger along with an electronic controller to manage and control the flow rates of the first and second pumps, the flow rate of the second cooling fluid valve, and/or a rotation speed of the at least one fan.

Abstract: The present invention describes an intelligent power management system designed for optimizing energy use in data center server assemblies. It can use various coolants, like liquid or gas, and adjusts to changing processor loads. The system integrates a coolant loop, a variable flow coolant circulator, and an advanced control unit. The advanced control unit dynamically regulates coolant flow, server temperature, and total power consumption, and receives temperature data from each server's baseboard management controller and power data from a power distribution unit. The advanced control unit computes the best coolant flow rate to minimize total power use while keeping server temperature below a safety limit, and uses either a static or a machine learning model with reinforcement learning and a reward mechanism to enhance real-time calculations and overall efficiency over time.

Abstract: There is disclosed a fluid cooling system for a datacenter, wherein the fluid cooling system comprises a leakage detection device, comprising a leakage sensor, the leakage sensor comprising an electrical circuit configured to be open in normal use conditions of the fluid cooling system and to be closed in case of liquid leak, the leakage detection device comprising said control valve as an inlet shut off actuator when a liquid leakage is detected, and a check valve to act as the outlet shut off actuator when a liquid leakage is detected.

Abstract: The disclosed embodiments are provide a liquid cooling arrangement and method for a server rack including input and output temperature sensors of the server rack, a liquid cooling subsystem comprising a pump unit to forcibly urge the cooling liquid flow, a liquid distribution circuit fluidly-coupled to the liquid cooling subsystem and the server rack and configured to convey the cooling liquid to/from the server rack, input and output pressure sensors configured to measure the pressure of the cooling liquid flow received, and issued, by the pump unit, and a control unit. The control unit is configured to direct the pump unit to operate at full capacity, quantify pressure differences between the input/output pressure sensor measurements, determine an optimal volume flow rate based on a desired predetermined temperature difference between the input/output temperatures and empirical pump operational characteristics, and adjust the pump unit speed based on the determined optimal flow rate.

Abstract: A liquid cooling arrangement system for cooling a plurality of server clusters is disclosed. The plurality of server clusters each contain heat generating devices with liquid cooling units, comprising: a cooling circuit configured to circulate a cooling liquid and to circulate a heated liquid from the plurality of server clusters back to a dry cooler unit; the plurality of server clusters including: a first cluster and a second cluster connected in series by the cooling circuit, the first cluster including a first set of liquid cooling units connected in parallel by the cooling circuit, the first set having a first number of liquid cooling units, the second cluster including a second set of liquid cooling units connected in parallel by the cooling circuit, the second set having a second number of liquid cooling units, wherein the first number being above the second number.

Abstract: A method for controlling a speed of a fan of a dry cooling unit of a datacenter, the method comprising: estimating a thermal load (Q) of the rack-mounted data processing assemblies, estimating an air flow (AF) depending on the thermal load (Q) and an ambient temperature of the air flow (Tamb), estimating a fan rotation speed of said at least one fan assembly depending on the estimated air flow (AF), and controlling a voltage of said at least one fan assembly depending on the estimated fan rotation speed (nfan), wherein the process comprises a step of modeling the air flow (AF) as a polynomial function of the ambient temperature.

Abstract: A method for controlling a speed of a fan of a dry cooling unit of a datacenter, the method comprising: estimating a thermal load (Q) of the rack-mounted data processing assemblies, estimating an air flow (AF) depending on the thermal load (Q) and an ambient temperature of the air flow (Tamb), estimating a rotation speed fan of said at least one fan assembly depending on the estimated air flow (AF), and controlling a voltage of said at least one fan assembly depending on the estimated rotation speed fan (nfan), wherein the process comprises a step of modeling the air flow (AF) as a polynomial function of the ambient temperature.

Abstract: A datacenter dry cooling arrangement and method for cooling a heat-generating source containing a heat exchanger panel with an evaporative cooling pad. The arrangement and method incorporates temperature-, humidity-, and water flow-related data detected by respective sensors and a controller configured with executable instructions to process the received data to generate operational parameters, determine whether a thermal load, input temperatures and outside ambient temperatures comply with specified operational thresholds and operatively adjust the cooling water flow rate applied to the evaporative cooling pad to optimal levels in view of prevailing ambient weather conditions.

Abstract: A liquid cooling device for mounting onto a heat-generating electronic component submerged in an immersion cooling liquid, is presented. The cooling device body having a first surface disposed on a bottommost side for mounting onto an upper surface of the electronic component in which the first surface is configured with a open recess formed along an outer periphery of the first surface, a thermal interface material (TIM) interposed between the first surface and the upper surface of the electronic component, and a resiliently deformable gasket mounted on, and seated within, the open recess along the outer periphery of the first surface. The gasket configured to deformably expand horizontally or vertically to establish a protective fluid-proof seal for the first surface of the cooling device body, the upper surface of the electronic component, and the TIM from the immersion cooling liquid.

Abstract: An immersion tank storage system for a data center, includes: a frame defining a plurality of storage levels disposed above one another; a plurality of immersion tanks supported by the frame, each immersion tank configured to contain electronic devices and an immersion cooling liquid for cooling thereof, each storage level being configured to house first and second immersion tanks; and means for synchronously moving the first and second immersion tanks housed in at least one of the storage levels between: a storage position in which the first and second immersion tanks are spaced from each other by a first distance; and an access position in which the first and second immersion tanks are spaced from each other by a second distance greater than the first distance, wherein in the access position, the first and second immersion tanks are accessible by an operator for accessing the electronic devices contained therein.

Abstract: A cooling block includes a body having a thermal transfer surface configured to be in thermal contact with a heat-generating electronic component. The body defines a fluid conduit having a plurality of channels such that the cooling fluid flows in parallel along the channels. Each channel is defined between first and second internal sidewalls; and top and bottom walls. Each channel has either: a first dimensional configuration including first height and width values; or a second dimensional configuration including second height and width values. The first height value is greater than the second height value. The second width value is greater than the first width value. A thickness of a material of the body between the thermal transfer surface and a first channel is less than a thickness of the material of the body between the thermal transfer surface and a second channel.

Abstract: A rack system for a data center includes: a plurality of racks configured to house electronic equipment therein, at least one rack column being formed by at least some of the racks being disposed above one another, each rack having a rack depth measured in a front-to-rear direction; and at least one supporting pedestal disposed below the at least one rack column in order to support the at least one rack column, the at least one supporting pedestal being configured to be positioned on a ground surface of the data center to distribute a load of the at least one rack column on the ground surface, each of the at least one supporting pedestal having a pedestal depth measured in the front-to-rear direction.

Abstract: The disclosed systems, structures, and methods are directed to providing a rack-mounted fluid immersion cooling (IC) configuration. The rack-mounted fluid IC configuration comprises a rack-mounted immersion reservoir containing a volume of thermally cooled non-dielectric fluid and at least one electronic processing assembly comprising one or more electronic processing components. The at least one electronic processing assembly being encased within a hermetic sealed bag configured to provide a water-and air-tight seal of the at least one electronic processing assembly to shield against the direct exposure of the electronic processing components to fluids. The at least one hermetic sealed electronic processing assembly is submerged within the volume of thermally cooled fluid contained by the rack-mounted immersion reservoir.

Abstract: A cooling system and a method for cooling an electronic device are disclosed. The electronic device includes a heat-generating component. The cooling arrangement includes an immersion casing that contains a dielectric cooling liquid, the electronic device being, at least in part, immersed in the dielectric cooling liquid such that the dielectric cooling liquid collects, in use, at least a first portion of a thermal energy generated by the heat-generating component, and a photovoltaic device proximate to the immersion casing and configured to convert at least in part a second portion of the thermal energy generated by the heat-generating component into electric energy, the second portion having radiated from the dielectric cooling liquid and through the immersion casing.

Abstract: A cooling assembly and method for cooling a plurality of heat-generating components. The cooling assembly includes a main liquid inlet for receiving a heat-transfer liquid, a main liquid outlet for discharging the heat-transfer liquid and a plurality of liquid cooling units. Each liquid cooling unit is in thermal contact with a corresponding heat-generating component and includes an internal liquid conduit, the heat-transfer liquid flowing in the internal liquid conduit collecting thermal energy from the corresponding heat-generating component. The liquid cooling units are arranged in a plurality of groups, each group comprising one or more liquid cooling units fluidly connected in parallel to one another. The groups are arranged in at least one cluster, each cluster comprising two or more groups fluidly connected in series.

Abstract: A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.

Abstract: A method for assembling a rack column assembly including: positioning a first data center rack on a support surface; stacking a second data center rack atop the first data center rack; placing a first vertical column on a first lateral side of the data center racks; after said stacking, placing a second vertical column on a second lateral side of the data center racks; connecting the first vertical column to the data center racks by fastening first lateral side attachment brackets to the data center racks; and connecting the second vertical column to the data center racks by fastening second lateral side attachment brackets to the data center racks, the first lateral side attachment brackets and the second lateral side attachment brackets limiting movement of the data center racks in a depth direction of the rack column assembly.