Abstract: A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

Abstract: The disclosed systems and structures are directed to providing a hybrid liquid-cooling system for at least one rack-mounted immersion case containing at least one electronic assembly submerged in dielectric immersion cooling liquid. The hybrid liquid cooling system comprises a closed-loop fluid distribution arrangement configured to circulate channelized fluid, an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement, a serpentine convection coil structured to internally convey channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid, and one or more fluid cooling blocks arranged to be in direct thermal contact with one or more heat-generating electronic processing components of the at least one electronic assembly.

Abstract: A cooling arrangement for cooling of a rack hosting an electronic device includes a first loop including a liquid cooling unit thermally coupled to a heat-generating component of the electronic device, a primary side of a liquid-to-liquid heat exchanger fluidly connected to the liquid cooling unit; and a pump fluidly connected between the primary side and the liquid cooling unit. A second loop includes a secondary side of the liquid-to-liquid heat exchanger thermally coupled to the primary side for transfer of heat from the primary side to the secondary side. A relief line selectively fluidly connects the first and second loops and is operable in: (i) a closed state whereby the relief line does not allow cooling liquid flow therethrough, and (ii) an open state whereby the relief line fluidly connects the first and second loops.

Abstract: A cooling assembly and method for cooling a plurality of heat-generating components. The cooling assembly includes a main liquid inlet for receiving a heat-transfer liquid, a main liquid outlet for discharging the heat-transfer liquid and a plurality of liquid cooling units. Each liquid cooling unit is in thermal contact with a corresponding heat-generating component and includes an internal liquid conduit, the heat-transfer liquid flowing in the internal liquid conduit collecting thermal energy from the corresponding heat-generating component. The liquid cooling units are arranged in a plurality of groups, each group comprising one or more liquid cooling units fluidly connected in parallel to one another. The groups are arranged in at least one cluster, each cluster comprising two or more groups fluidly connected in series.

Abstract: A cooling block includes a body having a thermal transfer surface configured to be in thermal contact with a heat-generating electronic component. The body defines a fluid conduit having a plurality of channels such that the cooling fluid flows in parallel along the channels. Each channel is defined between first and second internal sidewalls; and top and bottom walls. Each channel has either: a first dimensional configuration including first height and width values; or a second dimensional configuration including second height and width values. The first height value is greater than the second height value. The second width value is greater than the first width value. A thickness of a material of the body between the thermal transfer surface and a first channel is less than a thickness of the material of the body between the thermal transfer surface and a second channel.

Abstract: A datacenter rack assembly providing a liquid cooling arrangement to service an autonomous rack and an immersion cooling rack coexisting within the datacenter rack assembly is presented. The datacenter rack assembly comprises an autonomous rack containing at least one electronic processing assembly, an integrated heat exchanger, and at least one liquid cooling block while the immersion cooling rack comprises a dielectric immersion cooling fluid at least one electronic processing assembly immersed in the dielectric immersion cooling fluid, and at least one liquid cooling block. The datacenter rack assembly incorporates a liquid cooling distribution arrangement to control distribution of liquid for cooling of the autonomous and IC racks through various liquid flow distribution channel segments, temperature sensors, and communication-enabled flow control valves based on detected temperature conditions.

Abstract: A cooling block for cooling a heat-generating electronic component includes a body having a thermal transfer surface and defining a fluid conduit for circulating a cooling fluid therein. The fluid conduit has a passage extending from a first point to a second point along a longitudinal direction. The passage is defined in part by first and second internal sidewalls, each having a scalloped or undulating shape. A width of the passage is measured between the internal sidewalls in a lateral direction. The passage is defined in part by a pin row disposed between the internal sidewalls, the pin row including multiple pins. The pins of the pin row are spaced apart along the longitudinal direction and are aligned with each other in the lateral direction such that a linear pin axis extending in the longitudinal direction traverses each pin. A method for manufacturing a cooling block is also disclosed.

Abstract: A cooling block for cooling a heat-generating electronic component includes a body defining a fluid conduit. The body includes a plurality of pins for deflecting cooling fluid flowing within the fluid conduit. The fluid conduit has a passage extending in a longitudinal direction from an inlet point to an outlet point. Each passage is defined by: first and second internal sidewalls facing each other from the inlet point to the outlet point; a pin row disposed between the first and second internal sidewalls, the pin row including a multitude of pins spaced apart from each other in the longitudinal direction, the pins of the pin row being aligned with each other in a lateral direction of the cooling block, each pin having a lacrimiform shape and having a rounded end and a pointed end, each pin being oriented such that the pointed end is downstream from the rounded end.

Abstract: The disclosed systems, structures, and methods are directed to providing a rack-mounted fluid immersion cooling (IC) configuration. The rack-mounted fluid IC configuration comprises a rack-mounted immersion reservoir containing a volume of thermally cooled non-dielectric fluid and at least one electronic processing assembly comprising one or more electronic processing components. The at least one electronic processing assembly being encased within a hermetic sealed bag configured to provide a water- and air-tight seal of the at least one electronic processing assembly to shield against the direct exposure of the electronic processing components to fluids. The at least one hermetic sealed electronic processing assembly is submerged within the volume of thermally cooled fluid contained by the rack-mounted immersion reservoir.

Abstract: A method for assembling a rack column assembly comprising: positioning a first data center rack on a support surface; stacking a second data center rack atop the first data center rack; placing a first vertical column on a first lateral side of the data center racks; after said stacking, placing a second vertical column on a second lateral side of the data center racks; connecting the first vertical column to the data center racks by fastening first lateral side attachment brackets to the data center racks; and connecting the second vertical column to the data center racks by fastening second lateral side attachment brackets to the data center racks, the first lateral side attachment brackets and the second lateral side attachment brackets limiting movement of the data center racks in a depth direction of the rack column assembly. A rack column assembly is also disclosed.

Abstract: A fluid leakage deflection arrangement for a liquid-cooled rack-mounted electronic processing assembly and a method for deflecting fluid leakages in a liquid-cooled rack-mounted electronic processing assembly are disclosed. The fluid leakage deflection arrangement comprises an immersion case containing a first cooling liquid in which an electronic device of the rack-mounted electronic processing assembly is at least partially submerged therein; and a deflection unit configured to prevent the electronic device from being in contact with a leaking liquid distinct from the first cooling liquid by diverting leaking liquid away from the electronic components.

Abstract: An electronic device and a cooling monitoring system for an electronic device receiving power from a power supply. The electronic device includes a board at least in part immersed in an immersion case comprising a first heat-transfer liquid for cooling of the electronic device, one or more sensors configured to measure an operating parameter of the first heat-transfer liquid, and a controller communicably connected to the one or more sensors, the controller being configured to receive signals from the one or more sensors and, in response to determining that the signals indicate that the operating parameter of the first heat-transfer liquid is above a threshold, cause to disconnect the electronic device from the power supply.

Abstract: A fixing system for fixing a liquid cooling block on a heat-generating electronic component, the fixing system comprising a mounting bracket and an indicator. The mounting bracket comprises a main portion overlying at least part of the liquid cooling block in order to urge the liquid cooling block against the heat-generating electronic component, and an outer connecting portion extending from the main portion and configured to be fastened to a substrate on which the heat-generating electronic component is disposed. The indicator is disposed between the main portion and the liquid cooling block, and undergoes deformation in response to the outer connecting portion being progressively fastened to the substrate in order to provide an indication to a user that a desired amount of pressure is exerted between the mounting bracket and the liquid cooling block for establishing adequate contact between the liquid cooling block and the heat-generating electronic component.

Abstract: The disclosed systems and structures are directed to the management of cable/tube bundles for rack-mounted liquid-cooled cases containing electronic assemblies. The management of cable/tube bundles comprises an articulating scissor structure containing a first arm detachably connected to a contact point on a backplane of a rack-mounted immersion case, a second arm detachably connected to a contact point on a backplane of a rack frame, and a joining portion connecting the first and second arms via a center axle and controllably guiding the cable/tube bundles along a pivot point of the central axle. During the de-racking of the immersion case, the articulating scissor structure is configured to laterally extend and support and guide the cable/tube bundle across a de-racked space, and during the racking of the immersion case, the articulating scissor structure is configured to laterally contract and guide the corresponding cable/tube bundle into a fixed racked space.

Abstract: An autonomous immersive cooling container configured to cool at least one electronic device is described. The autonomous immersive cooling container includes a container, having sidewalls, that contains a dielectric immersion cooling liquid, the at least one electronic device being, at least in part, immersed in the dielectric immersion cooling liquid. The autonomous immersive cooling container further includes a plurality of cooling structures disposed at non-perpendicular angles on the sidewalls, the plurality of cooling structures configured to transfer heat from an interior of the container to exterior air such that no additional cooling subsystem is used to cool the dielectric immersion cooling liquid.

Abstract: An immersion tank storage system for a data center, includes: a frame defining a plurality of storage levels disposed above one another; a plurality of immersion tanks supported by the frame, each immersion tank configured to contain electronic devices and an immersion cooling liquid for cooling thereof, each storage level being configured to house first and second immersion tanks; and means for synchronously moving the first and second immersion tanks housed in at least one of the storage levels between: a storage position in which the first and second immersion tanks are spaced from each other by a first distance; and an access position in which the first and second immersion tanks are spaced from each other by a second distance greater than the first distance, wherein in the access position, the first and second immersion tanks are accessible by an operator for accessing the electronic devices contained therein.

Abstract: A hybrid cooling system that includes both immersion cooling and channelized cooling is described. The system cools an electronic device that includes a heat-generating component. The system includes a container that contains a dielectric immersion cooling liquid, the electronic device being, at least in part, immersed in the dielectric immersion cooling liquid, and a liquid cooling block through which a channelized cooling liquid is conveyed. The liquid cooling block is in thermal contact with the heat-generating component, and the channelized cooling liquid has a density that is higher than a density of the dielectric immersion cooling liquid. The system also includes a testing arrangement disposed in a bottom portion of the container, to determine the presence of the channelized cooling liquid in the bottom portion of the container, indicating a leak of the channelized cooling liquid into the dielectric immersion cooling liquid.

Abstract: An immersive cooling system is described. The system includes an immersive cooling container, including: a first reservoir; a second reservoir; numerous slots, each configured to hold a casing; a reservoir connector corresponding to each slot, and configured to provide fluid communication with the first reservoir; and a pump configured to convey a dielectric immersion cooling liquid from the second reservoir to the first reservoir. The immersive cooling system also includes a casing, configured to contain an electronic device and to fit within a slot of the container. The casing includes an inlet configured to be in fluid communication with the reservoir connector of the slot within which the casing is disposed to facilitate flow of the cooling liquid into an interior of the casing through the reservoir connector and an outlet configured to facilitate flow of the cooling liquid from the interior of the casing into the second reservoir.

Abstract: A mesh panel for a heat exchanger system is provided. The mesh panel comprises a mesh body extending from an upper end to a lower end, the mesh body having an inlet side and an outlet side opposite the inlet side. The mesh body comprises a plurality of mesh wires arranged to form a mesh pattern defining a plurality of mesh openings between the mesh wires, and at least one penetrating mesh portion extending at least partly along a depth direction of the mesh body, the depth direction being normal to a plane extending between the upper and lower ends of the mesh body, the at least one penetrating mesh portion at least partly defining an air flow opening, the air flow opening having greater dimensions than each of the mesh openings.

Abstract: A method is provided for positioning a data center rack relative to a rack-supporting frame. The method includes connecting at least one front attachment member to the data center rack on a front side thereof such that part of one of the at least one front attachment member and part of one of the at least one front attachment member extend leftward from a left end and rightward from a right end respectively of the data center rack; lifting and inserting the data center rack between a left and a right vertical support units until the at least one front attachment member abuts the left and right vertical support units; and moving the data center rack leftward or rightward until a hook portion of the at least one front attachment member engages the left or right vertical support unit to set a lateral position of the data center rack.