Abstract: A liquid cooling method and system for a rack-mounted assembly to control cooling liquid temperature are disclosed. The system includes a cooling circuit circulating a cooling liquid to a rack-mounted assembly and a heated liquid from the rack-mounted assembly, a dry cooling module supplying the cooling liquid and receiving the heated liquid for recooling. A controller is communicatively coupled to an input liquid temperature sensor, an output liquid temperature sensor, and a valve. The controller determines an input cooling liquid temperature value, an output heated liquid temperature value, calculates a differential temperature value, and in response to the calculated differential temperature value being below a target differential temperature value, redirects at least a portion of a flow of the heated liquid egressing from an outlet of the rack-mounted assembly to an inlet of the rack-mounted assembly.

Abstract: A connector for a cooling block having a connector body defining at least one connector passage. The connector is connectable to a top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of a conduit inlet and a conduit outlet of the cooling block. A cooling block comprising a cooling block body defining a fluid conduit therein for circulating a cooling fluid therethrough, the fluid conduit having a conduit inlet and a conduit outlet for receiving and discharging the cooling fluid respectively, and the connector connected to the top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of the conduit inlet and the conduit outlet of the cooling block.

Abstract: A liquid cooling arrangement for cooling a server rack housing a plurality of server clusters containing heat-generating processing assemblies with liquid cooling units is presented. The cooling arrangement comprises a liquid distribution loop supplying a cooling liquid to the server clusters and returning a heated liquid from the server clusters with heat exchangers fluidly connected to a supply side of the liquid distribution loop.

Abstract: A cleansing system and method for liquid-cooled rack-mounted processing assemblies are presented that incorporate a cleansing unit comprising a first liquid comprising an acidic detergent coupled a first fluid control structure, a second liquid comprising softened water fluidly-coupled a second fluid control structure, a third liquid comprising treated osmosed water fluidly-coupled a third fluid control structure, and a control module operably-coupled to the control structures and configured to select one of the first, second, or third liquids and define corresponding first, second, and third operational cleansing cycles and duration times. A forward fluid coupling section supplies the selected liquid to the processing assemblies and a return fluid coupling section receives the returned liquid from the processing assemblies for each of the defined operational cleansing cycles.

Abstract: A depurating system and process for server racks containing liquid-cooled rack-mounted processing assemblies are presented that incorporate a tank containing a volume of liquid treated, a control module configured control an operational parameter of the treated liquid, a fluid control structure operably-coupled to the control module and configured to adjust an operational parameter of the treated liquid, and a fluid coupling section fluidly-coupled to the fluid control structure and configured to supply the treated liquid to the server racks. The injection of the treated liquid functions to purge the existing cooling liquid away from the rack-mounted processing assemblies of the server rack and replace the purged existing cooling liquid with the treated liquid while maintaining continued operations of the rack-mounted processing assemblies.

Abstract: A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

Abstract: A datacenter liquid cooling resource sharing system and process is presented that comprises two liquid cooling arrangements having a common liquid sharing support circuit between the two arrangements that incorporates respective first switchover control valves coupled to the forward cooling liquid supply and respective second switchover control valves coupled to the return heated liquid supply.

Abstract: A multi-level modular datacenter for data processing equipment comprising a lower containment unit configured to house at least one uninterruptible power supply unit, a power distribution cabinet system, and one upper porthole disposed on a roof surface of the lower containment unit; an upper containment unit aligned and vertically disposed directly above the lower containment unit, the upper containment unit configured to house a battery assembly, a transformer, and a one lower porthole disposed on a floor surface of the upper containment unit; an electrical distribution infrastructure comprising electrically-communicative cabling to service the lower and upper containment units and the components disposed therein; and at least one electric conduit component, disposed between the lower and upper containment units configured to be aligned with the upper portholes and the lower portholes to accommodate routing of the electrically-communicative cabling and piping between the lower and upper containment units.

Abstract: An air-to-liquid heat exchanger and modular datacenter including the same are disclosed. The air-to-liquid heat exchanger is configured to be disposed on a support surface and includes a frame, a heat exchanger panel mounted to the frame, and a fan assembly mounted to the frame. The heat exchanger panel extends substantially orthogonally to the support surface and is configured to circulate a channelized cooling liquid from a liquid inlet to a liquid outlet. The fan assembly includes at least one fan configured to pull ambient air through the heat exchanger panel, each of the at least one fan being rotatable about a rotation axis, the rotation axis extending substantially parallel to the support surface and at an angle with respect to a normal of the heat exchanger panel.

Abstract: A modular datacenter is disclosed. The modular datacenter includes a containment unit, a first rack system mounted in the containment unit and extending along a first side wall thereof, a second rack system mounted in the containment unit and extending along a second side wall thereof. The second wall is opposed to the first wall, the first and second rack systems being spaced from one another and defining an aisle there between. The first and second rack systems are configured to house electronic devices disposed in immersion casings filled with an immersion cooling liquid. The modular datacenter further includes an extraction mobile apparatus for performing maintenance on the electronic devices, the extraction mobile apparatus being operatively connected to a floor surface of the containment unit and configured to navigate along the aisle.

Abstract: A liquid cooling system and method for preventing icing of a dry cooler components is presented that includes a first liquid distribution circuit to convey cooling liquid from the dry cooler, second liquid distribution circuit to convey heated liquid to the dry cooler, an auxiliary liquid feed circuit for supplementing the liquid flow back to the dry cooler, a first temperature sensor to measure the cooling liquid temperature, a volume sensor to measure the cooling liquid flow rate, and a smart bypass control valve fluidly-coupled to the auxiliary feed circuit and the second liquid distribution circuit. Upon determining that the cooling liquid flow rate is less than a minimum volume, opening the bypass control valve to allow the auxiliary feed circuit to increase liquid flow back to the dry cooler and upon determining that the cooling liquid temperature is less than a minimum temperature, issuing an alert message.

Abstract: A kit and a method for a dry cooler assembly is provided. The kit includes a first frame and a second frame, each being configured to support a heat exchanger. The kit further includes a base component and a roof component. The frames, the base component, and the roof component are configured to be assembled to an assembled configuration, such that the base component supports the frames in a spaced apart configuration, and the frames support the roof component. The method includes securing the base component to a surface, obtaining the first frame and the second frame, each frame being configured to support the heat exchanger, and positioning the frames such that they abut an abutment member of the base component such that the frames are supported in a spaced apart configuration.

Abstract: A liquid cooling method and system for cooling rack-mounted processing assemblies is presented that provides a dry cooling unit, a first liquid distribution circuit to convey the cooling liquid and a second liquid distribution circuit to convey the heated liquid from the rack-mounted processing assemblies, in which each of the rack-mounted data processing assemblies comprises a smart control valve designed to be pressure independent and control the flow rate of the cooling fluid based on detected temperatures and pressure flows.

Abstract: A liquid cooling method and system for estimating power consumption of cooling rack-mounted processing assemblies and controlling corresponding fan and pump speeds, is presented. The presented method and system provide for the estimation of the power consumption of the rack-mounted data processing assemblies by calculating a thermal load based on measured cooling liquid temperatures, heated liquid temperatures, ambient dry cooler temperatures, and cooling liquid volume and controlling the fan speed based on the estimated power consumption. The presented method and system also provide for controlling the pump speed based on measured flow rates and corresponding empirically derived pump head pressure values H.

Abstract: A multi-level modular datacenter and method of installation is presented. The multi-level modular datacenter including a lower containment unit housing a first assembly of data processing equipment, an upper containment unit housing a second assembly of data processing equipment, in which the upper containment unit is arranged to be aligned and vertically disposed directly above the lower containment unit. The multi-level modular datacenter further including at least one first support structure configured to support a respective underneath area of a lateral side portion of the second containment unit and at least one second support structure configured to support a respective underneath area of a corner portion of the second containment unit. The first and second support structures are arranged to receive all weight bearing forces of the second containment unit and provide a protective vertical isolation gap between the first and second containment units.

Abstract: A datacenter dry cooling system for cooling a heat generating source is presented that incorporates a first closed loop arrangement including an air-to-liquid heat exchanger to re-cool heat imparted onto the first cooling fluid, and a first pump that forwards the re-cooled first cooling fluid to the heat generating source. A second cooling fluid open loop arrangement that conveys a second cooling fluid via a second pump to supply the second cooling fluid onto an evaporating pad of an air-to-liquid heat exchanger for cooling dampening. The system also incorporates at least one fan to cause an air flow through the evaporating pad and the first air-to-liquid heat exchanger along with an electronic controller to manage and control the flow rates of the first and second pumps, the flow rate of the second cooling fluid valve, and/or a rotation speed of the at least one fan.

Abstract: A liquid cooling arrangement for cooling heat-generating components of a datacenter server rack. The cooling arrangement includes a liquid cooling loop configured to convey a cooling liquid, a plurality of server clusters each server cluster having a plurality of server assemblies that incorporate at least one respective liquid cooling unit, and a plurality of heat exchangers fluidly connected to the liquid cooling units of the plurality of server clusters via the liquid cooling loop. The heat exchangers configured to receive the heated cooling liquid discharged from the respective liquid cooling units and cool the received heated cooling liquid along with a pump fluidly coupled to the plurality of heat exchangers via the liquid cooling loop, wherein at least a portion of the liquid cooling loop comprises a serialized configuration that serially couples the server clusters and/or serially couples the server clusters and the heat exchangers.

Abstract: A rack assembly including a cooling module for liquid-to-liquid cooling, a rack and an immersion cooling (IC) rack. The rack includes a rack cooling block that cools a rack electronic processing assembly and a rack fluid conduit that circulates a first cooling fluid through the rack cooling block and the cooling module. The IC rack includes a dielectric IC fluid, an IC cooling block immersed in the dielectric IC fluid for cooling an IC electronic processing assembly when the IC electronic processing assembly is placed in contact with the IC cooling block and an IC fluid conduit that circulates a second cooling fluid through the IC cooling block and the cooling module. The rack and the IC rack are thermally connected via the cooling module such that thermal energy can be transferred between the IC fluid conduit and the rack fluid conduit within the cooling module.

Abstract: A baffling assembly for mitigating movement of a heat-transfer liquid in an immersion case and an immersion case assembly. The immersion case contains the heat-transfer liquid in which an electronic device is at least partially submerged. The baffling assembly includes at least one baffle element configured to be disposed proximate a top portion of the immersion case.

Abstract: Systems for cooling one or more electronic devices are disclosed, each of the one or more electronic devices including one or more heat-generating components. An immersion cooling includes a first container adapted for receiving a first heat-transfer liquid, the one or more electronic devices being, at least in part, immersed in the first heat-transfer liquid such that the first heat-transfer liquid collects, in use, at least a portion of a thermal energy generated by the one or more heat-generating components and a second container adapted for receiving a second heat-transfer liquid, the first container being, at least in part, immersed in the second container cooling system.