Patents by Inventor Ali Chen

Ali Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12003333
    Abstract: A method of operating a target radio node in a radio access network is disclosed. The method includes receiving control information transmitted on a control channel, and transmitting acknowledgement feedback pertaining to the control information. The disclosure also pertains to related methods and devices.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 4, 2024
    Assignee: Telefonaktiebolaget LM Ericsson (Publ)
    Inventors: Robert Baldemair, Ali Behravan, Daniel Chen Larsson, Erik Dahlman, Sorour Falahati, Stefan Parkvall
  • Patent number: 11990687
    Abstract: An electronic device may include an antenna disposed on a substrate. The antenna may include a ring of conductive traces, a fed arm, and an unfed arm. The fed arm and the unfed arm may extend from opposing segments of the ring. The ring may be coupled to ground by fences of conductive vias extending through the substrate. The first arm may have a first radiating edge. The second arm may have a second radiating edge. The first radiating edge may be separated from the second radiating edge by a gap. The first arm may indirectly feed the second arm via near-field electromagnetic coupling across the gap. The first and second arms may collectively radiate in an ultra-wideband (UWB) frequency band.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: May 21, 2024
    Assignee: Apple Inc.
    Inventors: Alden T Rush, Soroush Akbarzadeh, Hongfei Hu, Han Wang, Javier Gomez Tagle, Ming Chen, Carlo Di Nallo, Mattia Pascolini, Erdinc Irci, Ali Pourghorban Saghati
  • Patent number: 11969554
    Abstract: A haptic stimulator includes a multilayer sheet with a piezoelectric or electroactive polymer layer adapted to mechanically deform upon application of voltage, the multilayer sheet secured to a substrate, and a source of electrical stimulation coupled to drive electrodes on the polymer layer with an AC signal to vibrate the polymer layer. In particular embodiments, the polymer contains polyvinylidene fluoride, and electrodes are patterned to control local electric fields. Another haptic stimulator has first and second electrodes with an air gap and an insulating sheet between first and second electrodes, with an AC voltage driver connecting to the electrodes. In a method of providing haptic stimulation to skin an alternating current supply drives first and second electrodes, the electrodes disposed upon either a piezoelectric or electroactive polymer sheet, vibrating the polymer layer by driving the electrodes; and coupling vibrations of the polymer layer to the sensate skin.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: April 30, 2024
    Assignees: THE TRUSTEES OF DARTMOUTH COLLEGE, FACEBOOK, INC.
    Inventors: Zi Chen, John X. J. Zhang, Frances Lau, Ali Israr
  • Publication number: 20240126982
    Abstract: Techniques are described herein for providing people suggestions in collaborative online text editors. A method includes: receiving user interface input that corresponds to a document in a document editing application; automatically parsing the received user interface input to identify a name included in the user interface input; in response to identifying the name included in the user interface input, providing an option to create a link in the document between the name and a corresponding contact in a contact store; receiving additional user interface input that indicates acceptance of the option to create the link in the document; and in response to receiving the additional user interface input, automatically creating the link in the document between the name and the corresponding contact in the contact store.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 18, 2024
    Inventors: Behnoosh Hariri, Ali Abdelhadi, Zifan Xiang, Timothy Chen
  • Patent number: 11953332
    Abstract: Transportation-based service share systems and methods are disclosed herein. An example method can include receiving a request from a service provider to reserve a ridehail vehicle for a ridehail having a time frame, the request specifying a service provided by the service provider; determining the ridehail vehicle for the service provider based on the service; and dispatching the ridehail vehicle, the service provider rendering the service during the ridehail.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: April 9, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Xingping Chen, Jeremy Lerner, Danielle Rosenblatt, Scott Huggins, Taylor Hawley, Ali Abdallah
  • Publication number: 20240111833
    Abstract: A storing unit stores, amongst coefficients, values of a coefficient group associated with one selected from multiple variable groups, which are obtained by dividing state variables of an evaluation function. A searching unit searches for a solution to an optimization problem by repeating update processing, which includes calculating, using the values of the coefficient group, a value change of the evaluation function responsive to changing the value of each state variable of the variable group and changing the value of one state variable thereof based on the value change and temperature. A processing unit calculates multiplicity indicating the iteration count in which the values of the variable group are maintained in a search using Markov chain Monte Carlo (MCMC), and causes, responsive to cumulated multiplicity exceeding a threshold, the searching unit to perform the update processing using the values of the coefficient group associated with a different variable group.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 4, 2024
    Applicants: Fujitsu Limited, THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO
    Inventors: Sigeng CHEN, Jeffrey Seth ROSENTHAL, Ali SHEIKHOLESLAMIi, Hirotaka TAMURA, Aki DOTE
  • Publication number: 20240105575
    Abstract: Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core, and a pad over the core, where the pad has a first width. In an embodiment, a surface finish is over the pad, where the surface finish has a second width that is substantially equal to the first width. In an embodiment, the package substrate further comprises a solder resist over the pad, where the solder resist comprises an opening that exposes a portion of the surface finish. In an embodiment, the opening has a third width that is smaller than the second width.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Inventors: Jason M. GAMBA, Haifa HARIRI, Kristof DARMAWIKARTA, Srinivas V. PIETAMBARAM, Hiroki TANAKA, Kyle MCELHINNY, Xiaoying GUO, Steve S. CHO, Ali LEHAF, Haobo CHEN, Bai NIE, Numair AHMED
  • Patent number: 11943058
    Abstract: Example techniques for data retransmission in systems that do not utilize explicit hybrid automatic repeat request (HARQ) feedback are presented, including an example method by a wireless device that includes starting a timer for a hybrid automatic repeat request (HARQ) process associated with a transport block (TB) transmission by the wireless device to the network node. The method includes identifying a HARQ policy for the HARQ process, the HARQ policy governing whether the wireless device is to retransmit the TB or transmit a new TB where no HARQ feedback responsive to the TB transmission is received from the network node before the timer expires. Furthermore, the method includes retransmitting the TB or transmitting the new TB according to the HARQ policy at a next periodic transmission occasion for the HARQ process after the timer expires. Methods at a network node and related apparatuses and computer programs are also presented.
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: March 26, 2024
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Zhenhua Zou, Ali Behravan, Daniel Chen Larsson, Gustav Wikström
  • Patent number: 11932906
    Abstract: Apparatus and techniques for electrokinetic loading of samples of interest into sub-micron-scale reaction chambers are described. Embodiments include an integrated device and related apparatus for analyzing samples in parallel. The integrated device may include at least one reaction chamber formed through a surface of the integrated device and configured to receive a sample of interest, such as a molecule of nucleic acid. The integrated device may further include electrodes patterned adjacent to the reaction chamber that produce one or more electric fields that assist loading the sample into the reaction chamber. The apparatus may further include a sample reservoir having a fluid seal with the surface of the integrated device and configured to hold a suspension containing the samples.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: March 19, 2024
    Assignee: Quantum-Si Incorporated
    Inventors: Guojun Chen, Jeremy Lackey, Alexander Goryaynov, Gerard Schmid, Ali Kabiri, Jonathan M. Rothberg, Todd Rearick, Jonathan C. Schultz, Farshid Ghasemi, Keith G. Fife
  • Patent number: 11920714
    Abstract: A sealing structure includes an inner pipe, an outer pipe, and a sealing ring, where the outer pipe is detachably sleeved on the inner pipe, a slot for inserting a pipe is formed between an inner wall of the outer pipe and an outer wall of the inner pipe, and the outer wall of the inner pipe is provided with a sealing groove for placing the sealing ring; the sealing ring includes a main body provided with a lip; the sealing groove includes a first sealing groove and a second sealing groove, the first sealing groove and the second sealing groove are stepped; the bottom of the lip fits the bottom of the first sealing groove; and the bottom of the main body fits the bottom of the second sealing groove.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 5, 2024
    Assignees: RIFENG ENTERPRISE (FOSHAN) CO., LTD., RIFENG ENTERPRISE GROUP CO., LTD., RiFeng New Material Co., Ltd.
    Inventors: Zhenbin Diao, Ximin Li, Xiyong Lin, Jiajia Cheng, Wenfeng Chen, Huijian Cao, Ali Chen
  • Publication number: 20240066593
    Abstract: Aspects of the disclosure are directed to methods and/or apparatuses involving the formation of pore-free or nearly pore-free liquid droplets. As may be implemented in accordance with one or more embodiments, liquid droplets including metal are formed having pores within the liquid droplets. This may involve, for example, atomizing liquid metal with a gas and forming the droplets having pores. The pores are then driven out of the liquid droplets by heating the liquid droplets from a first state in which an outer surface of the droplets has a lower temperature than an inner region thereof, to a second state in which the outer surface has a higher temperature than the inner region.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Inventors: Lianyi Chen, Ali Nabaa
  • Publication number: 20220307636
    Abstract: A sealing structure includes an inner pipe, an outer pipe, and a sealing ring, where the outer pipe is detachably sleeved on the inner pipe, a slot for inserting a pipe is formed between an inner wall of the outer pipe and an outer wall of the inner pipe, and the outer wall of the inner pipe is provided with a sealing groove for placing the sealing ring; the sealing ring includes a main body provided with a lip; the sealing groove includes a first sealing groove and a second sealing groove, the first sealing groove and the second sealing groove are stepped; the bottom of the lip fits the bottom of the first sealing groove; and the bottom of the main body fits the bottom of the second sealing groove.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 29, 2022
    Inventors: Zhenbin Diao, Ximin Li, Xiyong Lin, Jiajia Cheng, Wenfeng Chen, Huijian Cao, Ali Chen
  • Patent number: 11346479
    Abstract: A pipe fitting joint assembly including a guide sleeve, provided with a first concave-convex structure on the outer wall of one end thereof, a connecting body, provided with a second concave-convex structure on the inner walls of both ends thereof, and an inner gear ring provided with a third concave-convex structure on an inner ring thereof and a fourth concave-convex structure on an outer ring thereof. The inner gear ring is concentrically inserted into the connecting body. The fourth concave-convex structure and the second concave-convex structure are in interference fit. The guide sleeve is concentrically inserted into the inner ring gear of the connecting body. The first concave-convex structure and the fourth concave-convex structure are in clearance fit therebetween using a moving interference manner.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: May 31, 2022
    Assignees: RIFENG ENTERPRISE (FOSHAN) CO., LTD., RIFENG ENTERPRISE GROUP CO., LTD., RIFENG TECHNOLOGY CO., LTD.
    Inventors: Xiyong Lin, Jiajia Cheng, Zhenbin Diao, Xin Li, Huijian Cao, Wenfeng Chen, Jianbo Liao, Ximin Li, Ali Chen
  • Publication number: 20200096145
    Abstract: A pipe fitting joint assembly, comprising: a guide sleeve, provided with a first concave-convex structure on the outer wall of one end thereof; a connecting body, provided with a second concave-convex structure on the inner walls of both ends thereof; and an inner gear ring, provided with a third concave-convex structure on an inner ring thereof and a fourth concave-convex structure on an outer ring thereof. The inner gear ring is concentrically inserted into the connecting body; the fourth concave-convex structure and the second concave-convex structure are in interference fit; the guide sleeve is concentrically inserted into the inner ring gear of the connecting body; and the first concave-convex structure and the fourth concave-convex structure are in clearance fit therebetween using a moving interference manner.
    Type: Application
    Filed: December 29, 2018
    Publication date: March 26, 2020
    Applicants: RIFENG ENTERPRISE (FOSHAN) CO., LTD., RIFENG ENTERPRISE GROUP CO., LTD., RIFENG TECHNOLOGY CO., LTD.
    Inventors: Xiyong Lin, Jiajia Cheng, Zhenbin Diao, Xin Li, Huijian Cao, Wenfeng Chen, Jianbo Liao, Ximin Li, Ali Chen
  • Patent number: D996581
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: August 22, 2023
    Assignees: RIFENG ENTERPRISE (FOSHAN) CO., LTD., RIFENG ENTERPRISE GROUP CO., LTD.
    Inventors: Ximin Li, Zhenbin Diao, Xiyong Lin, Ali Chen