Patents by Inventor Ali Elashri

Ali Elashri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12222776
    Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: February 11, 2025
    Assignee: Amazon Technologies, Inc.
    Inventors: Ali Elashri, William Mark Megarity, Ryan F Conroy, Chetan Sanjay Agarwal, Priti Choudhary
  • Patent number: 12035495
    Abstract: A computer system includes a chassis comprising location indicating elements, such as springs, magnets, standoffs, or other types of location indicating elements physically attached to the chassis in a configuration that indicates locations in the chassis. Also, the computer system includes multiple printed circuit boards comprising pads configured to interface with the location indicating elements, wherein combinations of sensed or not sensed location indicating elements at the pads of the printed circuit boards provide a physically verified placement location for the printed circuit boards.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: July 9, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Shay Madar, Yotam Admon, Ali Elashri, Ziv Harel, Nafea Bshara, Noam Navon
  • Patent number: 11910566
    Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: February 20, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Luke Thomas Gregory, Darin Lee Frink, Rick Chun Kit Cheung, Nafea Bshara, Kenny Kiet Huynh, Noah Kelly, Priti Choudhary, Ali Elashri
  • Patent number: 11751354
    Abstract: A computing equipment box assembly can include a chassis base and a tray. The chassis base can include a bottom panel, an opening through the bottom panel, and a rim defined around the opening. The tray can include a body configured for supporting computing components, a frame section of the body sized to be supported atop the rim of the chassis base; and a downwardly embossed portion of the body extending downwardly from the rim and sized to fit within the opening of the chassis base when the frame section is supported atop the rim of the chassis base.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: September 5, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Noah Thomas Kelly, Ryan F. Conroy, Christopher Mario Gil, Ali Elashri, Munish Sharma