Abstract: A device and method for dilating a Eustachian tube of a patient is disclosed. The device includes a guide catheter and a balloon dilation catheter. The balloon dilation catheter has an actuator that prevents injury to the middle ear. The balloon dilation catheter is slidably coupled with the guide catheter through the guide catheter lumen and is fully inserted into the guide catheter lumen when the distal side of the actuator is adjacent to the proximal end of the guide catheter. The method involves advancing the guide catheter and balloon dilation catheter through a nasal passage of the patient to dilate a portion of the Eustachian tube.

Abstract: A device and method for dilating a Eustachian tube of a patient is disclosed. The device includes a guide catheter and a balloon dilation catheter. The balloon dilation catheter has an actuator that prevents injury to the middle ear. The balloon dilation catheter is slidably coupled with the guide catheter through the guide catheter lumen and is fully inserted into the guide catheter lumen when the distal side of the actuator is adjacent to the proximal end of the guide catheter. The method involves advancing the guide catheter and balloon dilation catheter through a nasal passage of the patient to dilate a portion of the Eustachian tube.

Abstract: Described herein are systems and methods for inserting a hemostatic seal into a delivery device. One such system can include a loading tool and a delivery device configured to detachably mate with one another. The loading tool can house a hemostatic seal in its unfolded configuration and can fold the seal for delivery into the delivery device. The delivery device can then be advanced into the loading tool to insert the seal into the delivery device.

Abstract: A high-strength solder interconnect formed on a copper/electroless nickel/immersion gold metallization solder pad and method. The invention provides a low cost, high-strength solder interconnect on a copper/electroless nickel/immersion gold metallization (CENIGM) pad that can be formed at a temperature at or below the temperature used in eutectic tin-lead (Sn—Pb) solder applications. The invention includes a first substrate having a solder-wettable pad and a second substrate having a copper/electroless nickel/immersion gold metallization (CENIGM) solder pad. The invention also provides a solder interconnect between the solder-wettable pad and the CENIGM solder pad. The invention may provide a solder interconnect that includes a solder body including at least 2% indium (In) by weight and wetted to both the CENIGM solder pad and the solder-wettable pad.