Abstract: A device for removing flaws in situ during the additive molding of metal parts forms the subject of the invention. The device comprises: a hopper adapted to contain metal powder; a printing platform, sliding along an axis; a metal powder releasing device, to allow the powder to fall from the hopper onto the printing platform; a doctor blade for distributing the powder onto the printing platform, forming a bed of powder; a laser source and associated laser beam scanning system, for selectively melting the bed of powder; a grinder for removing flawed layers and a monitoring system, configured to detect possible flaws in the layers, wherein said monitoring system is connected to an electronic control unit, configured to activate the aforesaid grinder in order to remove the flaws detected by the monitoring system.