Patents by Inventor Ali Hariri

Ali Hariri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126982
    Abstract: Techniques are described herein for providing people suggestions in collaborative online text editors. A method includes: receiving user interface input that corresponds to a document in a document editing application; automatically parsing the received user interface input to identify a name included in the user interface input; in response to identifying the name included in the user interface input, providing an option to create a link in the document between the name and a corresponding contact in a contact store; receiving additional user interface input that indicates acceptance of the option to create the link in the document; and in response to receiving the additional user interface input, automatically creating the link in the document between the name and the corresponding contact in the contact store.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 18, 2024
    Inventors: Behnoosh Hariri, Ali Abdelhadi, Zifan Xiang, Timothy Chen
  • Publication number: 20240105575
    Abstract: Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core, and a pad over the core, where the pad has a first width. In an embodiment, a surface finish is over the pad, where the surface finish has a second width that is substantially equal to the first width. In an embodiment, the package substrate further comprises a solder resist over the pad, where the solder resist comprises an opening that exposes a portion of the surface finish. In an embodiment, the opening has a third width that is smaller than the second width.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Inventors: Jason M. GAMBA, Haifa HARIRI, Kristof DARMAWIKARTA, Srinivas V. PIETAMBARAM, Hiroki TANAKA, Kyle MCELHINNY, Xiaoying GUO, Steve S. CHO, Ali LEHAF, Haobo CHEN, Bai NIE, Numair AHMED
  • Publication number: 20240070366
    Abstract: A package substrate stack modeler includes a manufacturing modeler, configured to generate a model of a real package substrate stack based on an ideal design of the package substrate stack; a signal integrity model, configured to determine a signal integrity of a metal trace of the real package substrate stack; and a yield model, configured to determine a yield of the real package substrate stack; wherein the metal trace comprises a first value of a trace variable; further comprising a processor, configured to select a second value of the trace variable of the metal trace based on the determined signal integrity of the metal trace or the determined yield of the package substrate stack model.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Nicholas HAEHN, Raquel DE SOUZA BORGES FERREIRA, Siddharth ALUR, Prakaram JOSHI, Dhanya ATHREYA, Yidnekachew MEKONNEN, Ali HARIRI, Andrea NICOLAS, Sri Chaitra Jyotsna CHAVALI, Kemal AYGUN
  • Publication number: 20220265690
    Abstract: The invention relates to the use of sotagliflozin inpatients with type 2 diabetes mellitus and moderate renal impairment.
    Type: Application
    Filed: July 24, 2020
    Publication date: August 25, 2022
    Inventors: David BREGMAN, Ali HARIRI
  • Publication number: 20210093200
    Abstract: In alternative embodiments, provided are methods and products of manufacture for photoacoustic imaging of the periodontium of individuals in need thereof for noninvasive periodontal probing depth measurements and periodontal pocket imaging and gingival thickness. In alternative embodiments, products of manufacture as provided herein can observe or measure soft tissue contrast, e.g., gums, the periodontium, or the oral mucosa can be imaged and/or measured.
    Type: Application
    Filed: September 21, 2018
    Publication date: April 1, 2021
    Inventors: Jesse JOKERST, Colman MOORE, Ali HARIRI
  • Publication number: 20210022664
    Abstract: A method of identifying a subdermal feature in a subject includes directing optical energy into a subject to photoacoustically generate ultrasonic waves from a dermal or subdermal feature in tissue. Signals representing ultrasonic waves that are generated from the dermal or subdermal feature are received. The signals representing the ultrasonic waves are processed to generate image data of the dermal or subdermal feature. It is determined from the image data that the dermal or subdermal feature is a non-healing skin lesion selected from the group including a pressure ulcer, a diabetic foot ulcer, an arterial insufficiency injury, a decubitus ulcer, a diabetic ulcer, and an insufficiency injury.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 28, 2021
    Inventors: Jesse Jokerst, Ali Hariri
  • Patent number: 6904133
    Abstract: A method and apparatus for coupling a voiceband modem circuit to a common phoneline connector, the common phoneline connection having a ring line connection and a tip line connection which couples a ring/tip line pair to a subscriber loop circuit, the voiceband modem circuit operating in a voiceband modem operating frequency band and having a voiceband modem interface ring line and a voiceband modem interface tip line. The voiceband modem interface ring line is coupled to the ring line and the voiceband modem interface tip line is coupled to the tip line connection by inserting, between the ring line connection and the voiceband modem interface ring line and between the tip line connection and the voiceband modem interface tip line, a series pair of inductors. A first inductor of the series pair has a low inductance and a high self-resonant frequency and a second inductor of the series pair has a high inductance and low self-resonant frequency.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: June 7, 2005
    Assignee: Broadcom Corporation
    Inventors: Larry C. Yamano, Dane R. Snow, Jason Alexander Trachewsky, Ali Hariri
  • Publication number: 20040052344
    Abstract: A method and apparatus for coupling a voiceband modem circuit to a common phoneline connector, the common phoneline connection having a ring line connection and a tip line connection which couples a ring/tip line pair to a subscriber loop circuit, the voiceband modem circuit operating in a voiceband modem operating frequency band and having a voiceband modem interface ring line and a voiceband modem interface tip line. The voiceband modem interface ring line is coupled to the ring line and the voiceband modem interface tip line is coupled to the tip line connection by inserting, between the ring line connection and the voiceband modem interface ring line and between the tip line connection and the voiceband modem interface tip line, a series pair of inductors. A first inductor of the series pair has a low inductance and a high self-resonant frequency and a second inductor of the series pair has a high inductance and low self-resonant frequency.
    Type: Application
    Filed: June 24, 2003
    Publication date: March 18, 2004
    Applicant: Broadcom HomeNetworking, Inc.
    Inventors: Larry C. Yamano, Dane R. Snow, Jason Alexander Trachewsky, Ali Hariri
  • Patent number: 6597768
    Abstract: A method and apparatus for coupling a voiceband modem circuit to a common phoneline connector, the common phoneline connection having a ring line connection and a tip line connection which couples a ring/tip line pair to a subscriber loop circuit, the voiceband modem circuit operating in a voiceband modem operating frequency band and having a voiceband modem interface ring line and a voiceband modem interface tip line. The voiceband modem interface ring line is coupled to the ring line and the voiceband modem interface tip line is coupled to the tip line connection by inserting, between the ring line connection and the voiceband modem interface ring line and between the tip line connection and the voiceband modem interface tip line, a series pair of inductors. A first inductor of the series pair has a low inductance and a high self-resonant frequency and a second inductor of the series pair has a high inductance and low self-resonant frequency.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: July 22, 2003
    Assignee: Broadcom Homenetworking, Inc.
    Inventors: Larry C. Yamano, Dane R. Snow, Jason Alexander Trachewsky, Ali Hariri
  • Publication number: 20020064220
    Abstract: A method and apparatus for coupling a voiceband modem circuit to a common phoneline connector, the common phoneline connection having a ring line connection and a tip line connection which couples a ring/tip line pair to a subscriber loop circuit, the voiceband modem circuit operating in a voiceband modem operating frequency band and having a voiceband modem interface ring line and a voiceband modem interface tip line. The voiceband modem interface ring line is coupled to the ring line and the voiceband modem interface tip line is coupled to the tip line connection by inserting, between the ring line connection and the voiceband modem interface ring line and between the tip line connection and the voiceband modem interface tip line, a series pair of inductors. A first inductor of the series pair has a low inductance and a high self-resonant frequency and a second inductor of the series pair has a high inductance and low self-resonant frequency.
    Type: Application
    Filed: June 14, 2001
    Publication date: May 30, 2002
    Inventors: Larry C. Yamano, Dane R. Snow, Jason Alexander Trachewsky, Ali Hariri