Abstract: A system and method for collecting and purifying rainwater. The system includes a humidifier including a heat exchanger for preheating collected rainwater. The preheated water is output to a heater. The heater heats the water to between about 80 degrees C. and about 100 degrees C. The humidifier also includes a nozzle coupled to an outlet of the heater. The nozzle injects water vapor into the humidifier. The humidifier also includes a fan capable of circulating the water vapor in an inner volume of the humidifier. The water vapor condenses on an outer surface of the heat exchanger. The system also includes a collector for collecting the condensed potable water from the outer surface of the heat exchanger and a delivery system for delivering the potable water.

Abstract: Apparatuses for removal of solids from water comprising a heater for heating an immiscible liquid (IL), a humidifier having porous sheets allowing direct contact between the IL and water, thereby separating the solids by evaporating the water into cool dry air flowing past the porous sheets, and a dehumidifier comprising porous sheets that allow direct contact between the cool IL and hot moist air flowing past the porous sheets, thereby condensing fresh water from the moist air. Also disclosed are methods for removal of solids from water by heating an IL, distributing the IL to porous sheets in a humidifier, distributing water with dissolved solids to the porous sheets, separating the solids from the water by evaporating the water into dry air flowing past the porous sheets, and condensing fresh water by flowing the moist air past porous sheets in a dehumidifier having cool IL distributed to the porous sheets.

Abstract: Apparatuses for removal of solids from water comprising a heater for heating an immiscible liquid (IL), a humidifier having porous sheets allowing direct contact between the IL and water, thereby separating the solids by evaporating the water into cool dry air flowing past the porous sheets, and a dehumidifier comprising porous sheets that allow direct contact between the cool IL and hot moist air flowing past the porous sheets, thereby condensing fresh water from the moist air. Also disclosed are methods for removal of solids from water by heating an IL, distributing the IL to porous sheets in a humidifier, distributing water with dissolved solids to the porous sheets, separating the solids from the water by evaporating the water into dry air flowing past the porous sheets, and condensing fresh water by flowing the moist air past porous sheets in a dehumidifier having cool IL distributed to the porous sheets.

Abstract: A system and method for collecting and purifying rainwater. The system includes a humidifier including a heat exchanger for preheating collected rainwater. The preheated water is output to a heater. The heater heats the water to between about 80 degrees C. and about 100 degrees C. The humidifier also includes a nozzle coupled to an outlet of the heater. The nozzle injects water vapor into the humidifier. The humidifier also includes a fan capable of circulating the water vapor in an inner volume of the humidifier. The water vapor condenses on an outer surface of the heat exchanger. The system also includes a collector for collecting the condensed potable water from the outer surface of the heat exchanger and a delivery system for delivering the potable water.

Abstract: A system and method for collecting and purifying rainwater. The system includes a humidifier including a heat exchanger for preheating collected rainwater. The preheated water is output to a heater. The heater heats the water to between about 80 degrees C. and about 100 degrees C. The humidifier also includes a nozzle coupled to an outlet of the heater. The nozzle injects water vapor into the humidifier. The humidifier also includes a fan capable of circulating the water vapor in an inner volume of the humidifier. The water vapor condenses on an outer surface of the heat exchanger. The system also includes a collector for collecting the condensed potable water from the outer surface of the heat exchanger and a delivery system for delivering the potable water.

Abstract: A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide power to the integrated circuit. The PCB may include a signal layer for conveying signals to and from the integrated circuit, but does not include any means for providing core power to the integrated circuit. Thus, all core power provided to the integrated circuit may be supplied by the power laminate.

Abstract: A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide core power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors. In one embodiment, the power laminate may include a plurality of apertures which allow for the passing of connections between the integrated circuit and the PCB.

Abstract: An apparatus and system comprising electrical interconnection devices (EIDs), such as printed wiring boards, semiconductor packages, and printed circuit boards, having novel via and signal trace positioning. The vias may be positioned off-center from the pattern of the surface pads. Via groups, or staircase vias, connect surface pads with vias extending into the electrical interconnection device. The via groups convert the pad geometry on the surface to a more open via pattern on one or more internal layers. The EID comprises a plurality of pads formed on a surface for providing electrical connections to another EID. A plurality of vias each extend from a corresponding pad to another layer of the printed wiring board. Each via is offset from a central location of its corresponding pad.

Abstract: A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating s space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is flirter disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB.

Abstract: A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide core power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors. In one embodiment, the power laminate may include a plurality of apertures which allow for the passing of connections between the integrated circuit and the PCB.

Abstract: A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide power to the integrated circuit. The PCB may include a signal layer for conveying signals to and from the integrated circuit, but does not include any means for providing core power to the integrated circuit. Thus, all core power provided to the integrated circuit may be supplied by the power laminate.

Abstract: A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is further disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB.

Abstract: A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating s space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is flirter disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB.

Abstract: A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is further disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing for stability of the memory module while encased by the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB.