Abstract: A semiconductor-lid structure and method of forming a semiconductor-lid structure includes a semiconductor die, an ultrahigh thermal conductivity lid disposed on the semiconductor die, and a thermal interface layer between said semiconductor die and said ultrahigh thermal conductivity lid. The ultrahigh thermal conductivity lid includes a coupon having at least one uneven surface, a first layer on said at least one uneven surface formed from a process comprising one of sputter coating a highly adhesive metal over said uneven surface and sputtering a metallic seed layer, and a second layer on said first layer formed from a process comprising one of sputtering a metallic diffusion barrier layer over said first layer and electroplating the metallic seed layer with a highly conductive metal. The ultrahigh thermal conductivity lid has a smooth outer surface formed by chemical and/or mechanical processing of the ultrahigh thermal conductivity lid after formation of the second layer.

Abstract: An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and indirect cooling of the heat-generating portion of the CPU with an embedded microchannel heat exchanger. The coolant package system for the CPU removes higher levels of heat indirectly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serves to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inletting and outletting cooling liquid into and out of the CPU package.

Abstract: A method and apparatus for cooling electronic systems includes a field and/or customer replaceable packaged refrigeration module coupled to tubing formed in, or on, the chassis of the electronic system. The field replaceable packaged refrigeration module portion is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. The coupling of the field replaceable packaged refrigeration module to tubing formed in or on the chassis of the electronic system serves to create a cooling system wherein the temperature of the air surrounding the electronic system is lowered and the chassis of the electronic system itself becomes a refrigerator system for the electronic components therein.

Abstract: A refrigeration cooling assisted MEMS-based micro-channel cooling system that removes high heat densities generated by microelectronic components using a primary cooling system thermally coupled with a secondary chip embedded cooling system.

Abstract: A field and/or customer replaceable packaged refrigeration module with capillary pumped loop is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration module portion is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. The field replaceable packaged refrigeration module is coupled to a capillary pumped loop and serves to lower the base temperature of the capillary pumped loop sub-system, thereby allowing intermittent operation of the field replaceable packaged refrigeration module with the capillary pumped loop sub-system.

Abstract: A field and/or customer replaceable packaged refrigeration module with thermosyphon is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration module portion is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. The field replaceable packaged refrigeration module is coupled to a thermosyphon and serves to lower the base temperature of the thermosyphon sub-system, thereby allowing intermittent operation of the field replaceable packaged refrigeration module with the thermosyphon sub-system.

Abstract: A field and/or customer replaceable packaged refrigeration module with vapor chamber heat sink is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration module portion is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. The field replaceable packaged refrigeration module is coupled to a vapor chamber heat sink and serves to lower the base temperature of the vapor chamber heat sink sub-system, thereby allowing intermittent operation of the field replaceable packaged refrigeration module with the vapor chamber heat sink sub-system.

Abstract: A multiple compressor refrigeration heat sink module is suitable for use in standard electronic component environments. The multiple compressor refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system. As a result, the multiple compressor refrigeration heat sink module can be utilized in existing electronic systems without the need for significant system housing modification or the “plumbing” associated with prior art liquid-based cooling systems. The multiple compressor refrigeration heat sink module is also well suited for applications that require a highly reliable, energy and space efficient, cooling systems for electronic components such as multi-chip modules and mainframe computer applications.

Abstract: A field and/or customer replaceable packaged refrigeration heat sink module is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. As a result, the field replaceable packaged refrigeration heat sink module can be utilized in existing electronic systems without the need for board or cabinet/rack modification or the “plumbing” associated with prior art liquid-based cooling systems.

Abstract: A multiple compressor refrigeration heat sink module is suitable for use in standard electronic component environments. The multiple compressor refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system. As a result, the multiple compressor refrigeration heat sink module can be utilized in existing electronic systems without the need for significant system housing modification or the “plumbing” associated with prior art liquid-based cooling systems. The multiple compressor refrigeration heat sink module is also well suited for applications that require a highly reliable, energy and space efficient, cooling systems for electronic components such as multi-chip modules and mainframe computer applications.