Patents by Inventor Ali Moalemi
Ali Moalemi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200411250Abstract: Microelectronics having form factors (e.g., dimensions and functionality) comparable with traditional microelectronics, but with considerably simplified design, and their methods of manufacture are provided. Microelectronics and methods that implement microelectronics are capable of being forming without the need for through-vias. Exemplary dielectrics in these embodiments include, but are not limited to, high Q, temperature stable and high k dielectrics. Microelectronics and methods are capable of combination with any other passive electronic component such as a resistor or inductor further improving functionality and reducing space requirements on the circuit. Microelectronics and methods are configured to be mounted to a short block or other device without the use of a through-via, simplifying connection to a circuit.Type: ApplicationFiled: June 29, 2020Publication date: December 31, 2020Applicant: Eulex Components IncInventors: Ali Moalemi, Euan Patrick Armstrong
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Patent number: 10418181Abstract: Capacitors having form factors (e.g., dimensions and functionality) comparable with traditional single layer capacitors, but with considerably higher capacitance and methods of their manufacture are provided. Capacitors and methods that implement capacitors where at least one of the dielectric layers is reduced in thickness post firing to produce a device robust enough for automated handling and provide a stable surface for wire-bonding are also provided. Capacitors and methods that implement an internal electrode between at least two layers of pre-fired ceramic dielectric are also provided. Capacitors and methods that implement the integration of multiple dielectric types in a single device producing high frequency performance characteristics are also provided. Capacitors and dielectrics that implement the combination of a multi-layer capacitor with a thin single layer capacitor to further increase operating frequency and capacitance are also provided.Type: GrantFiled: April 20, 2017Date of Patent: September 17, 2019Assignee: Eulex Components IncInventors: Ali Moalemi, Euan Patrick Armstrong
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Publication number: 20170309405Abstract: Capacitors having form factors (e.g., dimensions and functionality) comparable with traditional single layer capacitors, but with considerably higher capacitance and methods of their manufacture are provided. Capacitors and methods that implement capacitors where at least one of the dielectric layers is reduced in thickness post firing to produce a device robust enough for automated handling and provide a stable surface for wire-bonding are also provided. Capacitors and methods that implement an internal electrode between at least two layers of pre-fired ceramic dielectric are also provided. Capacitors and methods that implement the integration of multiple dielectric types in a single device producing high frequency performance characteristics are also provided. Capacitors and dielectrics that implement the combination of a multi-layer capacitor with a thin single layer capacitor to further increase operating frequency and capacitance are also provided.Type: ApplicationFiled: April 20, 2017Publication date: October 26, 2017Applicant: Eulex Corp.Inventors: Ali Moalemi, Euan Patrick Armstrong
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Patent number: 9536665Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.Type: GrantFiled: September 21, 2015Date of Patent: January 3, 2017Assignee: Knowles Capital Formation, Inc.Inventors: Ali Moalemi, Euan Patrick Armstrong
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Publication number: 20160211079Abstract: A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie m a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal.Type: ApplicationFiled: March 25, 2016Publication date: July 21, 2016Applicant: Eulex Corp.Inventors: Euan Patrick Armstrong, Ali Moalemi
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Patent number: 9324499Abstract: A high capacitance single layer ceramic capacitor structure having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and bottom surfaces and a metallization pad electrically isolated from the metallization side and bottom surfaces positioned on a top surface of the ceramic body.Type: GrantFiled: June 24, 2011Date of Patent: April 26, 2016Assignee: Knowles Capital Formation, Inc.Inventors: Ali Moalemi, Euan Patrick Armstrong
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Patent number: 9299498Abstract: A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie in a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal.Type: GrantFiled: August 27, 2013Date of Patent: March 29, 2016Assignee: Eulex Corp.Inventors: Euan Patrick Armstrong, Ali Moalemi
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Publication number: 20160012969Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.Type: ApplicationFiled: September 21, 2015Publication date: January 14, 2016Inventors: Ali MOALEMI, Euan Patrick ARMSTRONG
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Patent number: 9165716Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.Type: GrantFiled: May 18, 2012Date of Patent: October 20, 2015Assignee: Knowles Capital Formation, Inc.Inventors: Ali Moalemi, Euan Patrick Armstrong
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Publication number: 20140133065Abstract: A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie in a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal.Type: ApplicationFiled: August 27, 2013Publication date: May 15, 2014Inventors: EUAN PATRICK ARMSTRONG, Ali Moalemi
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Publication number: 20120327554Abstract: A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.Type: ApplicationFiled: May 18, 2012Publication date: December 27, 2012Inventors: Ali Moalemi, Euan Patrick Armstrong
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Publication number: 20120327553Abstract: A high capacitance single layer ceramic capacitor structure having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and bottom surfaces and a metallization pad electrically isolated from the metallization side and bottom surfaces positioned on a top surface of the ceramic body.Type: ApplicationFiled: June 24, 2011Publication date: December 27, 2012Inventors: Ali Moalemi, Euan Patrick Armstrong