Abstract: A low mounting impedance ultrasonic transducer for mounting on a bonding machine comprises a prior art type transducer having a modified mounting flange which includes one or more elongated apertures in the mounting flange or the transducer body to isolate transverse radial stress in the transducer body from entering into the mounting flanges and coupling to the bonding machine.

Abstract: A multi-resonance frequency ultrasonic transducer as a plurality of useful resonance frequencies for wire bonding operation and comprises an integral unibody with a rectangular aperture in the center of its mass. A multi-frequency stack of transducer drivers is mounted in the rectangular aperture with compression wedges. The length L of the stack of transducer drivers is equal to or less than one-quarter of one wavelength of the lower useful resonance frequency and the design envelopes for the useful frequencies embrace two or more useful fixed frequencies separated from spurious unusable frequencies by a minimum of two kilohertz.

Abstract: A novel ultrasonic transducer comprises a machined solid metal unibody having a rectangular aperture in the center between a tool mounting end and a balanced end. The end portions are connected by two axial side members which connect to two transverse sides of the rectangular aperture. A stack of piezo electric crystals are mounted in said rectangular aperture between the transverse sides and spaced apart from the axial sides of the aperture. A bonding tool is mounted in a cylindrical aperture in the mounting end of the transducer and tightly mechanically coupled to the mounting end so that the stack of piezo electric crystals are acoustically coupled through the unibody to the bonding tool in a cylindrical aperture by a tightly coupled mounting surfaces.

Abstract: A pick-up tool or pick-up head is provided for picking up semiconductor objects. The active face of the pick-up tool is provided with an outer plenum which extends around the peripheral edges of the object to be picked up and further includes an inner plenum formed in the center of the pick-up tool over the object to be picked up. A partial vacuum is applied to the inner plenum and compressed air is supplied to the outer plenum which flows over a support ridge separating the inner plenum from the outer plenum. The air flowing over the ridge generates a thin air film supporting layer so that the object being picked up by the pick-up tool is supported on the air film and levitated separate and apart from the pick-up tool.

Abstract: A die ejector chuck is provided with a central housing and an outer housing and the central housing is provided with a die eject collar which extends through an aperture in the outer housing. A preselected die on a flexible adhesive tape is positioned over the die eject collar and a source of vacuum is applied to apertures in the outer housing. The outer housing is moved upward and away from the central die eject collar so as to stretch the flexible adhesive tape by a die eject pin to permt the preselected die to be picked up with a die collet acting with a light pulling force on the active surface of the preselected die.

Abstract: A die ejector chuck is provided with a central housing and an outer housing and the central housing is provided with a die eject collar which extends through an aperture in the outer housing. A preselected die on a flexible adhesive tape is positioned over the die eject collar and a source of vacuum is applied to apertures in the outer housing. The outer housing is moved upward and away from the central die eject collar so as to stretch the flexible adhesive tape supporting the preselected die. The adhesive tape is pre-peeled and pulled away from the preselected die which subsequently is further separated from the adhesive tape by a die eject pin to permit the preselected die to be picked up with a die collet acting with a light pulling force on the active surface of the preselected die.