Abstract: Implementations described herein generally relate to flexible display devices and cover lens assemblies with flexible cover lens. In one or more embodiments, a cover lens assembly is provided and includes a first flexible cover lens, a second flexible cover lens, and a sacrificial adhesion disposed between the first flexible cover lens and the second flexible cover lens. The first flexible cover lens includes a first hard coat layer having a hardness in a range from about 4H to about 9H and a first substrate. The second flexible cover lens includes a second hard coat layer having a hardness in a range from about 2H to about 9H. The first substrate is disposed between the first hard coat layer and the sacrificial adhesion layer.

Abstract: Implementations described herein generally relate to flexible display devices and cover lens assemblies with flexible cover lens. In one or more embodiments, a cover lens assembly is provided and includes a first flexible cover lens, a second flexible cover lens, and a sacrificial adhesion disposed between the first flexible cover lens and the second flexible cover lens. The first flexible cover lens includes a first hard coat layer having a hardness in a range from about 4 H to about 9 H and a first substrate. The second flexible cover lens includes a second hard coat layer having a hardness in a range from about 2 H to about 9 H. The first substrate is disposed between the first hard coat layer and the sacrificial adhesion layer.

Abstract: A method and apparatus for monitoring substrate lift pin operation is disclosed and includes a support pedestal for a vacuum chamber, the support pedestal comprising a body having a plurality of openings formed between two major sides of the body, and a substrate support device disposed in each of the plurality of openings, each of the support devices comprising a housing disposed in the body, the housing having a bore formed therethrough, and a support pin disposed in the bore, wherein the body includes a monitoring device positioned proximal to the support pins of each of the substrate support devices.

Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.

Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.