Abstract: The present disclosure is directed to a unique design of multi-purpose wheels for use in multi-purpose vehicles capable of operating in different transportation modes in different mediums such as flying mode and driving mode. Advantageous design of multi-purpose wheels and vehicles of the present disclosure allow for easy and convenient change in transportation mode of such vehicles without need for any special purpose transportation infrastructure. In one aspect, a multi-purpose tool includes a first set of blades configured to enable an object to which the multi-purpose tool is attached to operate in a first mode of transportation; a second set of blades configured to enable the object to operate in a second mode of transportation; and an engagement mechanism coupled to the first set of blades and the second set of blades for switching operation of the object between the first mode of transportation and the second mode of transportation.

Abstract: The present disclosure is directed to a unique design of multi-purpose wheels for use in multi-purpose vehicles capable of operating in different transportation modes in different mediums such as flying mode and driving mode. Advantageous design of multi-purpose wheels and vehicles of the present disclosure allow for easy and convenient change in transportation mode of such vehicles without need for any special purpose transportation infrastructure. In one aspect, a multi-purpose tool includes a first set of blades configured to enable an object to which the multi-purpose tool is attached to operate in a first mode of transportation; a second set of blades configured to enable the object to operate in a second mode of transportation; and an engagement mechanism coupled to the first set of blades and the second set of blades for switching operation of the object between the first mode of transportation and the second mode of transportation.

Abstract: According to one exemplary embodiment, a semiconductor die includes at least one pad ring situated on an active surface of the semiconductor die, where the at least one pad ring includes a number of pads. The semiconductor die further includes a number of bumps including at least one shared bump. The at least one shared bump is shared by at least two pads, thereby causing the number of bumps to be fewer than the number of pads. The at least two pads can be at least two ground pads, at least two power pads, or at least two reference voltage pads.

Abstract: According to one exemplary embodiment, a semiconductor die includes at least one pad ring situated on an active surface of the semiconductor die, where the at least one pad ring includes a number of pads. The semiconductor die further includes a number of bumps including at least one shared bump. The at least one shared bump is shared by at least two pads, thereby causing the number of bumps to be fewer than the number of pads. The at least two pads can be at least two ground pads, at least two power pads, or at least two reference voltage pads.

Abstract: A guide of the device is engageable with a hypodermic syringe barrel for secure placement thereon. A slide carried by the guide includes a shroud extensible from a stowed position adjacent the barrel forward over the end of a used syringe needle. The guide and an elongate slide therein embody locking means retaning the slide in an extended position after syringe use. A rib on the slide is provided at one end with a finger contactible surface for convenient slide positioning. The guide includes inwardly turned flanges to further support the slide against lateral displacement.

Abstract: The present invention relates to a method for producing an atta flour, which is typically used to produce Asian breads such as chapati and roti. The atta flour method includes passing an amount of wheat through a device designed to crack the wheat so as to produce an amount of cracked wheat, followed by passing the cracked wheat through at least two smooth rolls designed to grind the cracked wheat into flour, with the smooth roll importantly grinding the wheat to a smaller particle size and shearing the wheat to cause starch damage in the finished atta flour. The atta flour will have an amount of starch damage equal to between about 13% and about 18% and an amount of ash equal to at least 1%.