Patents by Inventor Ali Sengül
Ali Sengül has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136339Abstract: Disclosed herein are light sources (e.g., micro-LEDs and ?OLEDs), display electronics, and tiled display panels for high luminance, high resolution display panels used in near-eye display systems. Techniques for three-dimensional integration of multi-color LEDs, micro-LED surface loss reduction using band engineered sidewall passivation structures, micro-LED heat spreading materials and structures, and micro-LED light extraction efficiency improvement using etched outwardly tilted sidewall minors are described. Techniques for drive circuit supply voltage tracking and compensation, dynamic burn-in compensation using interpolation of compensation parameters, and digital misalignment calibration of tiled display panels are also described.Type: ApplicationFiled: December 11, 2023Publication date: April 25, 2024Inventors: Shenghui LEI, Yong Tae MOON, Ali SENGÜL
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Publication number: 20230352437Abstract: Embodiments relate to using nanoporous metal tips to establish connections between a first body and a second body. The first body is positioned relative to the second body to align contacts protruding from a first surface of the first body with electrodes protruding from a second surface of the second body. The second surface faces the first surface. The contacts, the electrodes, or both comprise nanoporous metal tips. A relative movement is made between the first body and the second body after positioning the first body to approach the first body to the second body. The contacts and the electrodes are bonded by melting and solidifying the nanoporous metal tips after approaching the first body and the second body.Type: ApplicationFiled: July 18, 2022Publication date: November 2, 2023Inventors: Daniel Brodoceanu, Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu, Ali Sengül
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Patent number: 11756810Abstract: A pick-up head picks up a semiconductor device from a carrier substrate. The pick-up head includes a first leg portion, a second leg portion, a raised bridge base portion between the first and second leg portions, and a tip portion mounted on the raised bridge base portion. The tip portion engages with the semiconductor device to pick up the semiconductor device from the carrier substrate. The pick-up head is associated with a force detection mechanism that detects a force applied to the pick-up head for picking up the semiconductor device. The force detection mechanism includes cavities formed on the first leg portion and/or second leg portion, pillars arranged on the pick-up head, a force detection device arranged in a mount assembly that is attached on the pick-up head, or electrodes arranged on the mount assembly. Actuation of the pick-up head is determined based on the detected force.Type: GrantFiled: December 27, 2019Date of Patent: September 12, 2023Assignee: Meta Platforms Technologies, LLCInventors: Oscar Torrents Abad, Daniel Brodoceanu, Ali Sengül, Pooya Saketi
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Patent number: 11670531Abstract: A pick-up tool (PUT) includes a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first and second leg portions, the first and second bridge leg portions each including a top surface and side surfaces, the top surfaces of the first and second bridge leg portions extending above the bridge center portion; a bridge base portion on the bridge center portion, the bridge base portion including a bottom side on the bridge center portion, a top side that is smaller than the bottom side, and one or more sloped surfaces defined between the top and bottom sides; and a tip configured to attach with a semiconductor device on the top side of the bridge base portion.Type: GrantFiled: November 13, 2019Date of Patent: June 6, 2023Assignee: Meta Platforms Technologies, LLCInventors: Oscar Torrents Abad, Daniel Brodoceanu, Ali Sengül, Pooya Saketi
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Patent number: 11424214Abstract: Embodiments relate to using nanoporous metal tips to establish connections between a first body and a second body. The first body is positioned relative to the second body to align contacts protruding from a first surface of the first body with electrodes protruding from a second surface of the second body. The second surface faces the first surface. The contacts, the electrodes, or both comprise nanoporous metal tips. A relative movement is made between the first body and the second body after positioning the first body to approach the first body to the second body. The contacts and the electrodes are bonded by melting and solidifying the nanoporous metal tips after approaching the first body and the second body.Type: GrantFiled: February 6, 2020Date of Patent: August 23, 2022Assignee: Meta Platforms Technologies, LLCInventors: Daniel Brodoceanu, Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu, Ali Sengül
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Patent number: 11417792Abstract: A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.Type: GrantFiled: March 19, 2020Date of Patent: August 16, 2022Assignee: Meta Platforms Technologies, LLCInventors: Ali Sengül, Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Tennyson Nguty
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Patent number: 11349053Abstract: Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.Type: GrantFiled: January 14, 2020Date of Patent: May 31, 2022Assignee: Facebook Technologies, LLCInventors: Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu, Pooya Saketi, Chao Kai Tung, Tennyson Nguty, Allan Pourchet
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Patent number: 11328942Abstract: A pick-up head assembly comprises a body of a liquid crystalline elastomer (LCE) that undergoes a reversible expansion when exposed to a first frequency of light and contracts when exposed to a second frequency of light. Selective portions of the LCE in the pick-up head assembly are irradiated with the first frequency to cause an expansion in the selective portions. The adhesive forces of the expanded portions of the LCE are used to pick-up semiconductor devices from a first substrate. The semiconductor devices are placed on a second substrate by exposing the expanded portions of the LCE to the second frequency of light, causing the expanded portions to contract.Type: GrantFiled: September 10, 2019Date of Patent: May 10, 2022Assignee: Facebook Technologies, LLCInventors: Thomas John Farrell Wallin, Yigit Mengue, Pooya Saketi, Ali Sengül, Nicholas Roy Corson, Katherine Healy, Remi Alain Delille, Oscar Torrents Abad, Daniel Brodoceanu, Robert Manson, Leif-Erik Sharif Simonsen
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Patent number: 11296268Abstract: A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via magnetized interconnects. The backplane substrate may include circuits for driving the LED array, and each of the magnetized interconnects electrically connect a LED device to a corresponding circuit of the backplane substrate. The magnetized interconnects may be formed by electrically connecting first structures protruding from the backplane substrate to second structures protruding from the LED substrate. At least one of the first structure and the second structure includes ferromagnetic material configured to secure the first structure to the second structure.Type: GrantFiled: March 20, 2020Date of Patent: April 5, 2022Assignee: Facebook Technologies, LLCInventors: Ali Sengül, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Jeb Wu, Chao Kai Tung, Tennyson Nquty, Allan Pourchet
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Patent number: 11276672Abstract: A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes one or more dummy electrodes that corresponds to one or more contacts on the substrate. The one or more dummy electrodes are exposed to a laser beam for coupling the one or more dummy electrodes to the one or more contacts. The one or more dummy electrodes may be positioned along edges of the LED chip that surround a display area of the LED chip and provide bonding strength between the LED chip and the substrate.Type: GrantFiled: October 8, 2019Date of Patent: March 15, 2022Assignee: Facebook Technologies, LLCInventors: Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül
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Patent number: 11255529Abstract: A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.Type: GrantFiled: October 29, 2019Date of Patent: February 22, 2022Assignee: Facebook Technologies, LLCInventors: Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül
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Patent number: 11239400Abstract: A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.Type: GrantFiled: January 8, 2020Date of Patent: February 1, 2022Assignee: Facebook Technologies, LLCInventors: Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi, Jeb Wu, Chao Kai Tung, Remi Alain Delille, Tennyson Nguty, Allan Pourchet
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Patent number: 11107948Abstract: A method and system for assembling a device by picking up semiconductor devices from a carrier substrate and placing the semiconductor devices onto a target substrate. The transfer of the semiconductor devices uses fluid as a transfer medium. The fluid enters a fluid channel of a pickup head, causing the pickup head to expand, make contact with, and attach to an aligned semiconductor device. After the semiconductor device is aligned with and placed onto the target substrate, at least a portion of the fluid is removed from the pickup head to release the semiconductor device onto the target substrate. The semiconductor device bonds to the target substrate.Type: GrantFiled: December 2, 2019Date of Patent: August 31, 2021Assignee: Facebook Technologies, LLCInventors: Yigit Menguc, Pooya Saketi, Thomas John Farrell Wallin, Nicholas Roy Corson, Ali Sengül, Katherine Healy, Oscar Torrents Abad, Daniel Brodoceanu, Robert Manson, Leif-Erik Sharif Simonsen, Remi Alain Delille
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Patent number: 11101159Abstract: Embodiments relate to using photocurable polymers to place light emitting diodes (LEDs) onto an electronic display substrate after fabrication of the LEDs. A LED assembly system places LEDs on a temporary substrate after fabrication and applies a a photocurable polymer onto the top surfaces of the LEDs. A transparent pickup head aligns with a subset of the LEDs. The pickup head is positioned on the top surfaces of the subset of LEDs such that the layer of the photocurable polymer is in between the pickup head and the top surface of the subset of the LEDs. Light is directed through the pickup head to cure the photocurable polymer, adhering the subset of LEDs to the pickup head. The subset of LEDs is removed away from the temporary substrate, due to relative movement between the temporary substrate and the pickup head.Type: GrantFiled: January 2, 2020Date of Patent: August 24, 2021Assignee: Facebook Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi
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Patent number: 10989735Abstract: Embodiments relate to the design of an electronic device capable of preventing a lateral motion between a first body and a second body. The device comprises a first body comprising one or more atomic force microscopy (AFM) tips protruding from a first surface of the first body. The device further comprises a second body comprising one or more electrical contacts on a second surface of the second body. The second surface faces the first surface. The one or more electrical contacts pierced by the AFM tips of the first surface to prevent a lateral motion between the first body and the second body.Type: GrantFiled: February 4, 2020Date of Patent: April 27, 2021Assignee: Facebook Technologies, LLCInventors: Ali Sengül, Oscar Torrents Abad, Zheng Sung Chio, Pooya Saketi, Daniel Brodoceanu
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Publication number: 20210055327Abstract: Embodiments relate to the design of an electronic device capable of preventing a lateral motion between a first body and a second body. The device comprises a first body comprising one or more atomic force microscopy (AFM) tips protruding from a first surface of the first body. The device further comprises a second body comprising one or more electrical contacts on a second surface of the second body. The second surface faces the first surface. The one or more electrical contacts pierced by the AFM tips of the first surface to prevent a lateral motion between the first body and the second body.Type: ApplicationFiled: February 4, 2020Publication date: February 25, 2021Inventors: Ali Sengül, Oscar Torrents Abad, Zheng Sung Chio, Pooya Saketi, Daniel Brodoceanu
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Publication number: 20200343121Abstract: A pick-up tool (PUT) includes a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first and second leg portions, the first and second bridge leg portions each including a top surface and side surfaces, the top surfaces of the first and second bridge leg portions extending above the bridge center portion; a bridge base portion on the bridge center portion, the bridge base portion including a bottom side on the bridge center portion, a top side that is smaller than the bottom side, and one or more sloped surfaces defined between the top and bottom sides; and a tip configured to attach with a semiconductor device on the top side of the bridge base portion.Type: ApplicationFiled: November 13, 2019Publication date: October 29, 2020Inventors: Oscar Torrents Abad, Daniel Brodoceanu, Ali Sengül, Pooya Saketi
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Patent number: 10818643Abstract: Embodiments relate to using a pickup assembly to place light emitting diodes (LEDs) onto an electronic display substrate after fabrication of the LEDs. An LED assembly system places LEDs on a temporary substrate after fabrication. Pickup heads of the pickup assembly are coated with a conformable material to enable attachment of each LED to a pickup head. The pickup head removes the LEDs away from the temporary substrate and aligns the LEDs onto a target substrate. The LED assembly system provides heat to an electrode of the LEDs and a corresponding electrical contact pad of the target substrate. The pickup assembly applies force to the LED on the target substrate, such that with the heat, the electrode of the LED and the electrical contact pad are bonded. The pickup assembly releases the LED onto the target substrate.Type: GrantFiled: January 2, 2020Date of Patent: October 27, 2020Assignee: Facebook Technologies, LLCInventors: Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi