Abstract: A p-type thermoelectric composite and composite slurries for printing low cost and scalable thermoelectric generator (TEG) devices is presented. The mechanically alloyed Bi0.5Sb1.5Te3 p-type composite may be enhanced with a ZT additive and a polymer binder. An additive of 2 wt. % to 10 wt. % Tellurium to the composite increased the Seebeck coefficient by approximately 50%. Epoxy is a suitable polymer binder that provides good adhesion strength with minimal curing shrinkage and high mass loading of active filler particles. Different n-type thermoelectric compositions can be used in conjunction with the p-type compositions. Devices with mechanically alloyed Bi0.5Sb1.5Te3 p-type composites doped with 8 wt. % Te on a flexible wired substrate and n-type Bi-epoxy elements were demonstrated. Potential uses of the devices include power sources for ultra low power needs such as wireless sensor network devices, Peltiers, and thermoelectric coolers.