Patents by Inventor Alich Lee

Alich Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6637931
    Abstract: The present invention discloses a probe assembly for used in an infrared ear thermometer. Given that the exchanged thermal radiation and the infrared detector's temperature are known, the subject temperature can be calculated according to Stefan-Boltzman's law. To make the Stefan-Boltzman's law applicable in a dynamic environment where temperature may vary greatly, the contact temperature sensor (thermistor) must acuurately and fast track the temperature of the infrared detector (thermopile sensor). By using the heat transfer theorem, the disclosed assembly makes the thermistor accurately track the cold junction temperature of the thermopile chip without being in an isothermal condition. Not only minimizes the measurement error in a dynamic environment, the design of the disclosed probe assembly also makes a samll and compact infrared thermometer possible.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: October 28, 2003
    Assignee: Oriental System Technology Inc.
    Inventors: Burt Lee, Alich Lee, Cruise Wu, Ryan Chang
  • Publication number: 20030016729
    Abstract: The present invention discloses a probe assembly for used in an infrared ear thermometer. Given that the exchanged thermal radiation and the infrared detector's temperature are known, the subject temperature can be calculated according to Stefan-Boltzman's law. To make the Stefan-Boltzman's law applicable in a dynamic environment where temperature may vary greatly, the contact temperature sensor (thermistor) must acuurately and fast track the temperature of the infrared detector (thermopile sensor). By using the heat transfer theorem, the disclosed assembly makes the thermistor accurately track the cold junction temperature of the thermopile chip without being in an isothermal condition. Not only minimizes the measurement error in a dynamic environment, the design of the disclosed probe assembly also makes a samll and compact infrared thermometer possible.
    Type: Application
    Filed: August 22, 2001
    Publication date: January 23, 2003
    Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
    Inventors: Burt Lee, Alich Lee, Cruise Wu, Ryan Chang