Abstract: A shaping system comprises a dispensing station configured to dispense formable material on a substrate, a shaping station configured to contact the dispensed formable material on the substrate with a plate, a positioning system configured to move the substrate having the dispensed formable material from the dispensing system to the shaping station, and a cover having one or more walls. While the substrate having the dispensed formable material is moved by the positioning system from the dispensing station to the shaping station, the cover is positioned to enclose the substrate and the dispensed formable material such that a ratio of a diameter of the substrate to a distance between the cover and the substrate to 80:1 to 30:1.

Abstract: An apparatus includes a first substrate chuck configured to hold a first substrate, a second substrate chuck configured to hold a second substrate, and a dispenser configured to dispense a formable material onto the first substrate while the first substrate overlies the first substrate chuck and to dispensing the formable material onto the second substrate while the second substrate overlies the second substrate chuck. A method of forming a planarization layer on a substrate can use the apparatus. A method of making an article can include the method of forming the planarization layer.

Abstract: A shaping system comprises a dispensing station configured to dispense formable material on a substrate, a shaping station configured to contact the dispensed formable material on the substrate with a plate, a positioning system configured to move the substrate having the dispensed formable material from the dispensing system to the shaping station, and a cover having one or more walls. While the substrate having the dispensed formable material is moved by the positioning system from the dispensing station to the shaping station, the cover is positioned to enclose the substrate and the dispensed formable material such that a ratio of a diameter of the substrate to a distance between the cover and the substrate to 80:1 to 30:1.

Abstract: A method is provided, comprising creating at least one crack at a point on an edge of a stack of at least a substrate and a superstrate; propagating the crack along the periphery; and moving the superstrate relative to the substrate to complete separation of the superstrate from the substrate.

Abstract: A method is provided, comprising creating at least one crack at a point on an edge of a stack of at least a substrate and a superstrate; propagating the crack along the periphery; and moving the superstrate relative to the substrate to complete separation of the superstrate from the substrate.

Abstract: A method, a system, and a controller for imprinting. Apply droplets of a formable material to imprint region of substrate. A partial pressure of formable material develops at a fluid-gas interface. A portion of an imprinting surface of a mesa on a template at an initial contact time is brought into contact with the droplets. The droplets merge and flow towards an imprint edge interface. A first gas flows in the imprint region prior to the initial contact time. A second gas flows into the imprint edge interface and region between the template and the substrate after the initial contact time. The template and the flow of the second gas reduces the partial pressure of the formable material below a vapor pressure of the formable material in a portion of the gap region adjacent to the fluid-gas interface at the imprint edge interface.

Abstract: An apparatus for imprint lithography is disclosed. The apparatus may include a fluid dispense head comprising at least two fluid dispense ports in a fixed arrangement relative to one another. The fluid dispense head can moves relative to the substrate in a translating direction. The apparatus may further include a logic element configured to determine a substrate fluid droplet pattern. The apparatus can dispense the formable material form a first part of the substrate fluid droplet pattern. The apparatus may be configured to move the fluid dispense head in an offset direction after an instruction to dispense the formable material is executed. The apparatus may dispense the formable material to form a second part of the substrate fluid droplet pattern. The first part of the fluid droplet pattern and the second part of the fluid droplet pattern can be dispensed during a first pass.

Abstract: A method, a system, and a controller for imprinting. Apply droplets of a formable material to imprint region of substrate. A partial pressure of formable material develops at a fluid-gas interface. A portion of an imprinting surface of a mesa on a template at an initial contact time is brought into contact with the droplets. The droplets merge and flow towards an imprint edge interface. A first gas flows in the imprint region prior to the initial contact time. A second gas flows into the imprint edge interface and region between the template and the substrate after the initial contact time. The template and the flow of the second gas reduces the partial pressure of the formable material below a vapor pressure of the formable material in a portion of the gap region adjacent to the fluid-gas interface at the imprint edge interface.

Abstract: The present invention features a method to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The method includes sensing relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: A system, method, and computer-readable medium for allocation of a Locality-sensitive Non-Unique Secondary Index are provided. The Locality-sensitive Non-Unique Secondary Index preserves the similarity of incorporated fields as well as improves the average secondary index sub-table look-up performance and is advantageously resilient to the type of predicates and workloads applied thereto. Rows of the secondary index having values of the columns that are hashed to determine a secondary index sub-table row location have a higher probability of being closely located within the secondary index than rows with more dissimilar column values that are hashed to determine the secondary index row location.

Abstract: The present invention features a method to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The method includes sensing relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: The present invention features a method to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The method includes sensing relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: The present invention features a system to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The system senses relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: The present invention features a system to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The system senses relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: The present invention features a method to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The method includes sensing relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.