Patents by Inventor Alisa C. Sandoval
Alisa C. Sandoval has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7140801Abstract: A latch is designed to attain and keep full engagement of a sub-assembly in a chassis and to increase the reliability and longevity of connectors by increasing the chances that they remain fully engaged even in the presence of shock and vibration.Type: GrantFiled: August 22, 2003Date of Patent: November 28, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Michael J. Greenside, Alisa C. Sandoval
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Patent number: 7056144Abstract: A computing system includes a circuit board, a first connector portion electrically connected to the circuit board, an electronic component and a plurality of resilient support members. The electronic component includes a first electronic device, a second connector portion electrically coupled to the electronic device and connected to the first connector portion along an axis. The plurality of resilient support members are asymmetrically located about the axis and extend between the device and the circuit board.Type: GrantFiled: February 19, 2004Date of Patent: June 6, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Stephan K. Barsun, Bryan D. Bolich, Alisa C. Sandoval, Gregory S. Meyer, Richard A. Miner
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Patent number: 6872087Abstract: A circuit board assembly and a method for protecting and covering an interface opening of a connector. The circuit board assembly includes a bulkhead member having a bulkhead aperture, a circuit board having a connector with an interface opening and passing through the bulkhead aperture, and a cover member disposed over the interface opening. A coupling member is provided for coupling the cover member to the connector. The method comprises passing the connector including the interface opening through the bulkhead aperture, and releasably covering the interface opening with a cover member that is coupled to the connector.Type: GrantFiled: July 26, 2002Date of Patent: March 29, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alisa C. Sandoval, Gregory S. Meyer
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Patent number: 6793507Abstract: A cable connector riser is provided configured to be positioned between a circuit board side of a receiving connector and a circuit board. The cable connector riser has a base portion having a thickness sufficient to provide clearance for a housing of a mating connector on a cable, the housing including a portion projecting downward towards the circuit board from a bottom surface of the mating connector.Type: GrantFiled: December 13, 2002Date of Patent: September 21, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alisa C. Sandoval, Chris Womack, Gregory S. Meyer
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Publication number: 20040116000Abstract: A cable connector riser is provided configured to be positioned between a circuit board side of a receiving connector and a circuit board. The cable connector riser has a base portion having a thickness sufficient to provide clearance for a housing of a mating connector on a cable, the housing including a portion projecting downward towards the circuit board from a bottom surface of the mating connector.Type: ApplicationFiled: December 13, 2002Publication date: June 17, 2004Inventors: Alisa C. Sandoval, Chris Womack, Gregory S. Meyer
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Patent number: 6700799Abstract: The present invention is electromagnetic interference containment apparatus. In one embodiment, a layer of compressible material is disposed between an electromagnetic interference source and a bulkhead coupled to the electromagnetic interference source. The layer of compressible material has a first thickness and a second thickness. A first layer of conductive material is disposed on the back side of the layer of compressible material and is electrically coupled to the electromagnetic interference source. The first layer of conductive material is for absorbing electromagnetic emissions from the electromagnetic interference source. A second layer of conductive material is disposed on the front side of the layer of compressible material and is electrically coupled to the first layer of conductive material. The second layer of conductive material is for electrically contacting the bulkhead and for conducting the electromagnetic emissions to the bulkhead.Type: GrantFiled: August 8, 2002Date of Patent: March 2, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alisa C. Sandoval, Andrew Michael Cherniski
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Publication number: 20040017665Abstract: A circuit board assembly and a method for protecting and covering an interface opening of a connector. The circuit board assembly includes a bulkhead member having a bulkhead aperture, a circuit board having a connector with an interface opening and passing through the bulkhead aperture, and a cover member disposed over the interface opening. A coupling member is provided for coupling the cover member to the connector. The method comprises passing the connector including the interface opening through the bulkhead aperture, and releasably covering the interface opening with a cover member that is coupled to the connector.Type: ApplicationFiled: July 26, 2002Publication date: January 29, 2004Applicant: HEWLETT-PACKARD COMPANYInventors: Alisa C. Sandoval, Gregory S. Meyer
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Publication number: 20030174488Abstract: The present invention is electromagnetic interference containment apparatus. In one embodiment, a layer of compressible material is disposed between an electromagnetic interference source and a bulkhead coupled to the electromagnetic interference source. The layer of compressible material has a first thickness and a second thickness. A first layer of conductive material is disposed on the back side of the layer of compressible material and is electrically coupled to the electromagnetic interference source. The first layer of conductive material is for absorbing electromagnetic emissions from the electromagnetic interference source. A second layer of conductive material is disposed on the front side of the layer of compressible material and is electrically coupled to the first layer of conductive material. The second layer of conductive material is for electrically contacting the bulkhead and for conducting the electromagnetic emissions to the bulkhead.Type: ApplicationFiled: August 8, 2002Publication date: September 18, 2003Inventors: Alisa C. Sandoval, Andrew Michael Cherniski
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Patent number: 6169662Abstract: The card removal method and system easily removes a PCA card from a powered on computer system while minimizing damage to the computer system and to the individual removing the PCA. The printed circuit assembly card removal system is comprised of: an ejection card including at least a first ejector extending from the surface of the ejection card, the ejector having a first surface for pressing against the edge of the PCA card to be removed, and an ejection card holder for mechanically supporting the ejection card. To remove the PCA, the ejection card is pulled outward causing the ejector to apply a force to the edge of the PCA card to be removed, forcing the card edge fingers of the PCA card out of the PCA connector.Type: GrantFiled: October 24, 1997Date of Patent: January 2, 2001Assignee: Hewlett-Packard CompanyInventors: Thomas J. Clark, Alisa C. Sandoval
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Patent number: 6125044Abstract: A printed circuit board (PCB) assembly includes a PCB having and a ferrite attenuator. The PCB includes input/output signal paths for carrying signals to and from the PCB, power paths for conducting power to the PCB, and ground paths for connecting the PCB to a ground level. The ferrite attenuator surrounds the input/output signal paths, the power paths, and the ground paths. The PCB assembly is preferably used in a system, such as a computer system, where the ferrite attenuator suppresses electromagnetic interference (EMI) generated in the system.Type: GrantFiled: March 23, 1999Date of Patent: September 26, 2000Assignee: Hewlett-Packard CompanyInventors: Andrew M. Cherniski, Alisa C. Sandoval