Patents by Inventor Alisa C. Sandoval

Alisa C. Sandoval has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7140801
    Abstract: A latch is designed to attain and keep full engagement of a sub-assembly in a chassis and to increase the reliability and longevity of connectors by increasing the chances that they remain fully engaged even in the presence of shock and vibration.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: November 28, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael J. Greenside, Alisa C. Sandoval
  • Patent number: 7056144
    Abstract: A computing system includes a circuit board, a first connector portion electrically connected to the circuit board, an electronic component and a plurality of resilient support members. The electronic component includes a first electronic device, a second connector portion electrically coupled to the electronic device and connected to the first connector portion along an axis. The plurality of resilient support members are asymmetrically located about the axis and extend between the device and the circuit board.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: June 6, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephan K. Barsun, Bryan D. Bolich, Alisa C. Sandoval, Gregory S. Meyer, Richard A. Miner
  • Patent number: 6872087
    Abstract: A circuit board assembly and a method for protecting and covering an interface opening of a connector. The circuit board assembly includes a bulkhead member having a bulkhead aperture, a circuit board having a connector with an interface opening and passing through the bulkhead aperture, and a cover member disposed over the interface opening. A coupling member is provided for coupling the cover member to the connector. The method comprises passing the connector including the interface opening through the bulkhead aperture, and releasably covering the interface opening with a cover member that is coupled to the connector.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: March 29, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alisa C. Sandoval, Gregory S. Meyer
  • Patent number: 6793507
    Abstract: A cable connector riser is provided configured to be positioned between a circuit board side of a receiving connector and a circuit board. The cable connector riser has a base portion having a thickness sufficient to provide clearance for a housing of a mating connector on a cable, the housing including a portion projecting downward towards the circuit board from a bottom surface of the mating connector.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: September 21, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alisa C. Sandoval, Chris Womack, Gregory S. Meyer
  • Publication number: 20040116000
    Abstract: A cable connector riser is provided configured to be positioned between a circuit board side of a receiving connector and a circuit board. The cable connector riser has a base portion having a thickness sufficient to provide clearance for a housing of a mating connector on a cable, the housing including a portion projecting downward towards the circuit board from a bottom surface of the mating connector.
    Type: Application
    Filed: December 13, 2002
    Publication date: June 17, 2004
    Inventors: Alisa C. Sandoval, Chris Womack, Gregory S. Meyer
  • Patent number: 6700799
    Abstract: The present invention is electromagnetic interference containment apparatus. In one embodiment, a layer of compressible material is disposed between an electromagnetic interference source and a bulkhead coupled to the electromagnetic interference source. The layer of compressible material has a first thickness and a second thickness. A first layer of conductive material is disposed on the back side of the layer of compressible material and is electrically coupled to the electromagnetic interference source. The first layer of conductive material is for absorbing electromagnetic emissions from the electromagnetic interference source. A second layer of conductive material is disposed on the front side of the layer of compressible material and is electrically coupled to the first layer of conductive material. The second layer of conductive material is for electrically contacting the bulkhead and for conducting the electromagnetic emissions to the bulkhead.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: March 2, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alisa C. Sandoval, Andrew Michael Cherniski
  • Publication number: 20040017665
    Abstract: A circuit board assembly and a method for protecting and covering an interface opening of a connector. The circuit board assembly includes a bulkhead member having a bulkhead aperture, a circuit board having a connector with an interface opening and passing through the bulkhead aperture, and a cover member disposed over the interface opening. A coupling member is provided for coupling the cover member to the connector. The method comprises passing the connector including the interface opening through the bulkhead aperture, and releasably covering the interface opening with a cover member that is coupled to the connector.
    Type: Application
    Filed: July 26, 2002
    Publication date: January 29, 2004
    Applicant: HEWLETT-PACKARD COMPANY
    Inventors: Alisa C. Sandoval, Gregory S. Meyer
  • Publication number: 20030174488
    Abstract: The present invention is electromagnetic interference containment apparatus. In one embodiment, a layer of compressible material is disposed between an electromagnetic interference source and a bulkhead coupled to the electromagnetic interference source. The layer of compressible material has a first thickness and a second thickness. A first layer of conductive material is disposed on the back side of the layer of compressible material and is electrically coupled to the electromagnetic interference source. The first layer of conductive material is for absorbing electromagnetic emissions from the electromagnetic interference source. A second layer of conductive material is disposed on the front side of the layer of compressible material and is electrically coupled to the first layer of conductive material. The second layer of conductive material is for electrically contacting the bulkhead and for conducting the electromagnetic emissions to the bulkhead.
    Type: Application
    Filed: August 8, 2002
    Publication date: September 18, 2003
    Inventors: Alisa C. Sandoval, Andrew Michael Cherniski
  • Patent number: 6169662
    Abstract: The card removal method and system easily removes a PCA card from a powered on computer system while minimizing damage to the computer system and to the individual removing the PCA. The printed circuit assembly card removal system is comprised of: an ejection card including at least a first ejector extending from the surface of the ejection card, the ejector having a first surface for pressing against the edge of the PCA card to be removed, and an ejection card holder for mechanically supporting the ejection card. To remove the PCA, the ejection card is pulled outward causing the ejector to apply a force to the edge of the PCA card to be removed, forcing the card edge fingers of the PCA card out of the PCA connector.
    Type: Grant
    Filed: October 24, 1997
    Date of Patent: January 2, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Thomas J. Clark, Alisa C. Sandoval
  • Patent number: 6125044
    Abstract: A printed circuit board (PCB) assembly includes a PCB having and a ferrite attenuator. The PCB includes input/output signal paths for carrying signals to and from the PCB, power paths for conducting power to the PCB, and ground paths for connecting the PCB to a ground level. The ferrite attenuator surrounds the input/output signal paths, the power paths, and the ground paths. The PCB assembly is preferably used in a system, such as a computer system, where the ferrite attenuator suppresses electromagnetic interference (EMI) generated in the system.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: September 26, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Andrew M. Cherniski, Alisa C. Sandoval