Patents by Inventor Alistair Martin Waddell
Alistair Martin Waddell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11848425Abstract: An energy storage system includes a DC bus; a plurality of battery strings, each battery string comprising batteries coupled electrically together; a plurality of DC/DC converters electrically coupling respective battery strings to the DC bus; an enclosure housing the battery strings and the DC/DC converters; and a temperature control system. The temperature control system includes at least one heating, ventilation, and air conditioning (HVAC) system, and a controller.Type: GrantFiled: October 12, 2018Date of Patent: December 19, 2023Assignee: General Electric CompanyInventors: Keith Garrette Brown, Honggang Wang, Alistair Martin Waddell
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Patent number: 11342882Abstract: An energy storage system includes a plurality of battery strings, each battery string including a plurality of batteries coupled electrically together; a plurality of temperature sensors; an enclosure housing the plurality of battery strings and the temperature sensors; a plurality of fans positioned in different locations within the enclosure; and a temperature control system. The temperature control system includes a heating, ventilation, and air conditioning (HVAC) components, and a controller. The controller is programmed to execute the method that includes determining fan speed operating commands based at least in part on sensed temperatures at the different locations, and operating the fan speed in response to the operating commands provided to the respective fans.Type: GrantFiled: October 12, 2018Date of Patent: May 24, 2022Assignee: GENERAL ELECTRIC COMPANYInventors: Honggang Wang, Ralph Teichmann, Keith Garrette Brown, Alistair Martin Waddell
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Publication number: 20220053673Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.Type: ApplicationFiled: October 27, 2021Publication date: February 17, 2022Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Owen Jannis Schelenz, Michael Fernahl
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Patent number: 11252847Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.Type: GrantFiled: June 30, 2017Date of Patent: February 15, 2022Assignee: General Electric CompanyInventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Owen Jannis Schelenz, Michael Fernahl
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Publication number: 20210194076Abstract: An energy storage system includes a plurality of battery strings, each battery string including a plurality of batteries coupled electrically together; a plurality of temperature sensors; an enclosure housing the plurality of battery strings and the temperature sensors; a plurality of fans positioned in different locations within the enclosure; and a temperature control system. The temperature control system includes a heating, ventilation, and air conditioning (HVAC) components, and a controller. The controller is programmed to execute the method that includes determining fan speed operating commands based at least in part on sensed temperatures at the different locations, and operating the fan speed in response to the operating commands provided to the respective fans.Type: ApplicationFiled: October 12, 2018Publication date: June 24, 2021Inventors: Honggang Wang, Ralph Teichmann, Keith Garrette Brown, Alistair Martin Waddell
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Publication number: 20210194421Abstract: An energy storage system includes a DC bus; a plurality of battery strings, each battery string comprising batteries coupled electrically together; a plurality of DC/DC converters electrically coupling respective battery strings to the DC bus; an enclosure housing the battery strings and the DC/DC converters; and a temperature control system. The temperature control system includes at least one heating, ventilation, and air conditioning (HVAC) system, and a controller.Type: ApplicationFiled: October 12, 2018Publication date: June 24, 2021Inventors: Keith Garrette Brown, Honggang Wang, Alistair Martin Waddell
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Publication number: 20200127347Abstract: A modular energy storage system including an enclosure having at least one thermally conductive sidewall; a battery module housed inside of the enclosure and including a plurality of battery submodules, each battery submodule including a plurality of battery cells, at least some of the plurality of battery cells being electrically interconnected to each other; at least one heat pipe thermally coupled to the plurality of battery cells of at least one of the plurality of battery submodules to channel heat from the plurality of battery cells thermally coupled thereto to the at least one thermally conductive sidewall of the enclosure; and a cooling mechanism thermally coupled to the at least one thermally conductive sidewall of the enclosure to cool the at least one heat pipe.Type: ApplicationFiled: May 30, 2018Publication date: April 23, 2020Inventors: Alistair Martin Waddell, Richard Hayes Cutright, Ralph Teichmann, Todd Garrett Wetzel
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Patent number: 10590916Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.Type: GrantFiled: January 22, 2018Date of Patent: March 17, 2020Assignee: General Electric CompanyInventors: Alistair Martin Waddell, Mark Aaron Chan, Mikel Andonegi Aldaz
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Patent number: 10497642Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.Type: GrantFiled: May 17, 2018Date of Patent: December 3, 2019Assignee: General Electric CompanyInventors: Saijun Mao, Bo Qu, Jingkui Shi, He Xu, Jie Shen, Lin Lan, Rui Li, Zhihui Yuan, Alistair Martin Waddell, Stefan Schroeder, Marius Michael Mechlinski, Mark Aaron Chan
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Publication number: 20190226461Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.Type: ApplicationFiled: January 22, 2018Publication date: July 25, 2019Applicant: General Electric CompanyInventors: Alistair Martin Waddell, Mark Aaron Chan, Mikel Andonegi Aldaz
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Patent number: 10249554Abstract: A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.Type: GrantFiled: June 20, 2017Date of Patent: April 2, 2019Assignee: GENERAL ELECTRIC COMPANYInventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Stefan Schroeder
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Publication number: 20190008078Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.Type: ApplicationFiled: June 30, 2017Publication date: January 3, 2019Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Owen Jannis Schelenz, Michael Fernahl
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Publication number: 20180366391Abstract: A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.Type: ApplicationFiled: June 20, 2017Publication date: December 20, 2018Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Stefan Schroeder
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Publication number: 20180337109Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.Type: ApplicationFiled: May 17, 2018Publication date: November 22, 2018Inventors: Saijun MAO, Bo QU, Jingkui SHI, He XU, Jie SHEN, Lin LAN, Rui LI, Zhihui YUAN, Alistair Martin WADDELL, Stefan SCHROEDER, Marius Michael MECHLINSKI, Mark Aaron CHAN
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Patent number: 9894815Abstract: A heat removal assembly for use with a power converter that includes a condenser and an evaporator coupled in flow communication with the condenser. The evaporator is configured to channel working fluid therebetween. The evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined at the supply housing and a flow outlet defined at said receiving housing, and the flow inlet is sized smaller in cross-sectional size than the flow outlet.Type: GrantFiled: August 8, 2016Date of Patent: February 13, 2018Assignee: General Electric CompanyInventors: Alistair Martin Waddell, Christian Meyer, Michael Bernhard Kocur, Mark Aaron Chan Chan, Owen Schelenz
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Publication number: 20180042145Abstract: A heat removal assembly for use with a power converter that includes a condenser and an evaporator coupled in flow communication with the condenser. The evaporator is configured to channel working fluid therebetween. The evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined at the supply housing and a flow outlet defined at said receiving housing, and the flow inlet is sized smaller in cross-sectional size than the flow outlet.Type: ApplicationFiled: August 8, 2016Publication date: February 8, 2018Inventors: Alistair Martin Waddell, Christian Meyer, Michael Bernhard Kocur, Mark Aaron Chan Chan, Owen Schelenz