Patents by Inventor Alistair Martin Waddell

Alistair Martin Waddell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11848425
    Abstract: An energy storage system includes a DC bus; a plurality of battery strings, each battery string comprising batteries coupled electrically together; a plurality of DC/DC converters electrically coupling respective battery strings to the DC bus; an enclosure housing the battery strings and the DC/DC converters; and a temperature control system. The temperature control system includes at least one heating, ventilation, and air conditioning (HVAC) system, and a controller.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: December 19, 2023
    Assignee: General Electric Company
    Inventors: Keith Garrette Brown, Honggang Wang, Alistair Martin Waddell
  • Patent number: 11342882
    Abstract: An energy storage system includes a plurality of battery strings, each battery string including a plurality of batteries coupled electrically together; a plurality of temperature sensors; an enclosure housing the plurality of battery strings and the temperature sensors; a plurality of fans positioned in different locations within the enclosure; and a temperature control system. The temperature control system includes a heating, ventilation, and air conditioning (HVAC) components, and a controller. The controller is programmed to execute the method that includes determining fan speed operating commands based at least in part on sensed temperatures at the different locations, and operating the fan speed in response to the operating commands provided to the respective fans.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: May 24, 2022
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Honggang Wang, Ralph Teichmann, Keith Garrette Brown, Alistair Martin Waddell
  • Publication number: 20220053673
    Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.
    Type: Application
    Filed: October 27, 2021
    Publication date: February 17, 2022
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Owen Jannis Schelenz, Michael Fernahl
  • Patent number: 11252847
    Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: February 15, 2022
    Assignee: General Electric Company
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Owen Jannis Schelenz, Michael Fernahl
  • Publication number: 20210194076
    Abstract: An energy storage system includes a plurality of battery strings, each battery string including a plurality of batteries coupled electrically together; a plurality of temperature sensors; an enclosure housing the plurality of battery strings and the temperature sensors; a plurality of fans positioned in different locations within the enclosure; and a temperature control system. The temperature control system includes a heating, ventilation, and air conditioning (HVAC) components, and a controller. The controller is programmed to execute the method that includes determining fan speed operating commands based at least in part on sensed temperatures at the different locations, and operating the fan speed in response to the operating commands provided to the respective fans.
    Type: Application
    Filed: October 12, 2018
    Publication date: June 24, 2021
    Inventors: Honggang Wang, Ralph Teichmann, Keith Garrette Brown, Alistair Martin Waddell
  • Publication number: 20210194421
    Abstract: An energy storage system includes a DC bus; a plurality of battery strings, each battery string comprising batteries coupled electrically together; a plurality of DC/DC converters electrically coupling respective battery strings to the DC bus; an enclosure housing the battery strings and the DC/DC converters; and a temperature control system. The temperature control system includes at least one heating, ventilation, and air conditioning (HVAC) system, and a controller.
    Type: Application
    Filed: October 12, 2018
    Publication date: June 24, 2021
    Inventors: Keith Garrette Brown, Honggang Wang, Alistair Martin Waddell
  • Publication number: 20200127347
    Abstract: A modular energy storage system including an enclosure having at least one thermally conductive sidewall; a battery module housed inside of the enclosure and including a plurality of battery submodules, each battery submodule including a plurality of battery cells, at least some of the plurality of battery cells being electrically interconnected to each other; at least one heat pipe thermally coupled to the plurality of battery cells of at least one of the plurality of battery submodules to channel heat from the plurality of battery cells thermally coupled thereto to the at least one thermally conductive sidewall of the enclosure; and a cooling mechanism thermally coupled to the at least one thermally conductive sidewall of the enclosure to cool the at least one heat pipe.
    Type: Application
    Filed: May 30, 2018
    Publication date: April 23, 2020
    Inventors: Alistair Martin Waddell, Richard Hayes Cutright, Ralph Teichmann, Todd Garrett Wetzel
  • Patent number: 10590916
    Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: March 17, 2020
    Assignee: General Electric Company
    Inventors: Alistair Martin Waddell, Mark Aaron Chan, Mikel Andonegi Aldaz
  • Patent number: 10497642
    Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: December 3, 2019
    Assignee: General Electric Company
    Inventors: Saijun Mao, Bo Qu, Jingkui Shi, He Xu, Jie Shen, Lin Lan, Rui Li, Zhihui Yuan, Alistair Martin Waddell, Stefan Schroeder, Marius Michael Mechlinski, Mark Aaron Chan
  • Publication number: 20190226461
    Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.
    Type: Application
    Filed: January 22, 2018
    Publication date: July 25, 2019
    Applicant: General Electric Company
    Inventors: Alistair Martin Waddell, Mark Aaron Chan, Mikel Andonegi Aldaz
  • Patent number: 10249554
    Abstract: A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 2, 2019
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Stefan Schroeder
  • Publication number: 20190008078
    Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 3, 2019
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Owen Jannis Schelenz, Michael Fernahl
  • Publication number: 20180366391
    Abstract: A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.
    Type: Application
    Filed: June 20, 2017
    Publication date: December 20, 2018
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Stefan Schroeder
  • Publication number: 20180337109
    Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.
    Type: Application
    Filed: May 17, 2018
    Publication date: November 22, 2018
    Inventors: Saijun MAO, Bo QU, Jingkui SHI, He XU, Jie SHEN, Lin LAN, Rui LI, Zhihui YUAN, Alistair Martin WADDELL, Stefan SCHROEDER, Marius Michael MECHLINSKI, Mark Aaron CHAN
  • Patent number: 9894815
    Abstract: A heat removal assembly for use with a power converter that includes a condenser and an evaporator coupled in flow communication with the condenser. The evaporator is configured to channel working fluid therebetween. The evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined at the supply housing and a flow outlet defined at said receiving housing, and the flow inlet is sized smaller in cross-sectional size than the flow outlet.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: February 13, 2018
    Assignee: General Electric Company
    Inventors: Alistair Martin Waddell, Christian Meyer, Michael Bernhard Kocur, Mark Aaron Chan Chan, Owen Schelenz
  • Publication number: 20180042145
    Abstract: A heat removal assembly for use with a power converter that includes a condenser and an evaporator coupled in flow communication with the condenser. The evaporator is configured to channel working fluid therebetween. The evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined at the supply housing and a flow outlet defined at said receiving housing, and the flow inlet is sized smaller in cross-sectional size than the flow outlet.
    Type: Application
    Filed: August 8, 2016
    Publication date: February 8, 2018
    Inventors: Alistair Martin Waddell, Christian Meyer, Michael Bernhard Kocur, Mark Aaron Chan Chan, Owen Schelenz