Abstract: An package such as an optocoupler package is disclosed. The optocoupler package includes a leadframe structure comprising a first die attach pad comprising a first die attach pad surface and a second die attach pad with a second die attach pad surface. The optocoupler package further has an optical emitter device on the first die attach pad, and an optical receiver device on second die attach pad. The optical receiver device is oriented at an angle with respect to the optical emitter device, and an optically transmissive medium is disposed between the optical emitter device and the optical receiver device.

Abstract: A semiconductor device (10) of the present invention has a gate (32) insulatively disposed above the substrate, source and drain regions (36, 38) disposed near the surface in the substrate adjacent opposite sides of the gate (32), and a field oxide region (26) disposed in the surface of the substrate surrounding the source and drain regions (36, 38) and defining an active moat region (20). The channel stop region (24) is disposed below the field oxide region (26) and is spaced from the active moat region (20) with a predetermined spacing.