Patents by Inventor Alkim Akyurtlu
Alkim Akyurtlu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11907782Abstract: Among other concepts, this disclosure describes a thermal/optical/electronic authentication system (covert or non-covert) for device/system implementations. The authentication system may be based on different design parameters such as i) materials composition, ii) thickness of material, iii) geometry of material, iv) external effects including use of an external DC bias and curing, etc. The authentication testbeds can be configured to include one or more inks. Using such methods as discussed herein, the authentication can be broadened to include near-IR (700-900 nm), short wave IR (1-2.6 mm), and UVA (300-400 nm) or any spectrum. Printed resistors are very difficult to duplicate without Ag-BST13 ink. If necessary, a printed resistor network on a respective substrate can be hidden using a layer of non-sintered Ag-BST13 (non-conductive).Type: GrantFiled: February 3, 2021Date of Patent: February 20, 2024Assignee: University of MassachusettsInventors: Edward D. Kingsley, Oshadha K. Ranasingha, Andrew M. Luce, Alkim Akyurtlu, Craig A. Armiento, Yuri A. Piro
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Publication number: 20240002692Abstract: A composition for making a filler including a plurality of ceramic particles, an oxirane monomer in liquid form, an ultraviolet initiator that absorbs ultraviolet, and a thermal initiator.Type: ApplicationFiled: June 29, 2023Publication date: January 4, 2024Inventors: Susan C. Trulli, Yuri Piro, Alkim Akyurtlu
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Publication number: 20230332003Abstract: A printable dielectric ink composition includes an inhibited catalyst-polymer complex and a crosslinker, wherein the printable dielectric ink composition has a viscosity of about 1 to about 10 cP.Type: ApplicationFiled: April 14, 2023Publication date: October 19, 2023Inventors: Yuri Piro, Susan C. Trulli, Craig Alfred Armiento, Christopher R. Areias, Alkim Akyurtlu, James Reuther
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Publication number: 20230139276Abstract: A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.Type: ApplicationFiled: November 1, 2021Publication date: May 4, 2023Inventors: Craig A. Armiento, Yuri Piro, Andrew M. Luce, Emily Lamport, Oshadha Ranasingha, Christopher R. Areias, Christopher N. Kuncho, Alkim Akyurtlu, Edward D. Kingsley
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Publication number: 20230113929Abstract: An ink stabilizing composition includes a polymeric network including an acrylate polymer and a plurality of high aspect ratio particles each having an aspect ratio of about 2:1 to about 30:1 and an average particle diameter of about 0.5 to about 1.2 micrometers.Type: ApplicationFiled: October 7, 2022Publication date: April 13, 2023Inventors: Craig A. Armiento, Yuri Piro, Oshadha Ranasingha, Andrew M. Luce, Edward D. Kingsley, Alkim Akyurtlu
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Publication number: 20230056201Abstract: Among other concepts, this disclosure describes a thermal/optical/electronic authentication system (covert or non-covert) for device/system implementations. The authentication system may be based on different design parameters such as i) materials composition, ii) thickness of material, iii) geometry of material, iv) external effects including use of an external DC bias and curing, etc. The authentication testbeds can be configured to include one or more inks. Using such methods as discussed herein, the authentication can be broadened to include near-IR (700-900 nm), short wave IR (1-2.6 mm), and UVA (300-400 nm) or any spectrum. Printed resistors are very difficult to duplicate without Ag-BST13 ink. If necessary, a printed resistor network on a respective substrate can be hidden using a layer of non-sintered Ag-BST13 (non-conductive).Type: ApplicationFiled: February 3, 2021Publication date: February 23, 2023Inventors: Edward D. Kingsley, Oshadha K. Ranasingha, Andrew M. Luce, Alkim Akyurtlu, Craig A. Armiento, Yuri A. Piro
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Publication number: 20230014456Abstract: A method of fabricating a three-dimensional (3D) object includes atomizing a pre-polymer composition into an aerosol jet stream. The pre-polymer composition includes an epoxy precursor and a photoacid generator. The method further includes depositing the aerosol jet stream onto a substrate to form a first layer of dielectric ink and curing the first layer of dielectric ink using ultraviolet (UV) light. The method further includes depositing the aerosol jet stream onto the first layer of dielectric ink to form a second layer of dielectric ink. The first layer of dielectric ink and the second layer of dielectric ink overlap by at least 50%.Type: ApplicationFiled: July 12, 2021Publication date: January 19, 2023Inventors: Christopher R. Areias, Yuri Piro, Andrew M. Luce, Guinevere M. Strack, Oshadha Ranasingha, Alkim Akyurtlu, Edward D. Kingsley, Craig A. Armiento
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Publication number: 20230017655Abstract: A dielectric ink composition includes an epoxy precursor and a photoacid generator. The dielectric ink composition is aerosolable and ultraviolet (UV) curable.Type: ApplicationFiled: July 12, 2021Publication date: January 19, 2023Inventors: Yuri Piro, Christopher R. Areias, Andrew M. Luce, Oshadha Ranasingha, Emily Lamport, Alkim Akyurtlu, Edward D. Kingsley, Craig A. Armiento
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Publication number: 20220220331Abstract: This disclosure describes manufacture of a mixture and use of same to fabricate different types of electronic components. In one configuration, the mixture includes: first particles, the first particles being an insulator material; second particles, the second particles being electrically conductive metal material; and a combination of the first particles and the second particles suspended in a printable liquid medium, the printable liquid/solid medium (slurry) being curable into a dielectric layer of material. According to one configuration, the printable material is disposed and cured on a substrate. The first particles and second particles are randomly distributed in the cured printed material (dielectric material). The second particles in the cured dielectric material are transformable into one or more electrically conductive paths, electronic components, etc., via application of heat above a threshold value.Type: ApplicationFiled: July 30, 2020Publication date: July 14, 2022Inventors: Oshadha K. Ranasingha, Andrew M. Luce, Guinevere M. Strack, Mahdi Haghzadeh, Cameron Hardie, Edward Kingsley, Craig A. Armiento, Alkim Akyurtlu
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Publication number: 20210394440Abstract: A scalable method of fabricating large area nanoparticle arrays is disclosed. The method uses a combination of nanofabrication and additive manufacturing techniques to fabricate ordered nanoparticle arrays on wide number of substrates, including flexible substrates. Nanosphere lithography may be used to form a monolayer of polymer nanospheres. A metal may be deposited on the nanospheres, using a physical vapor deposition technique. The nanoparticles may then be decomposed using intense pulsed light technique. Ordered nanoparticle arrays have several promising applications, for example, thin films with tailored light scattering signatures, sensors based on surface-enhanced Raman scattering, nanostructured electrode arrays, and ordered catalytic islands for nanostructure growth.Type: ApplicationFiled: June 17, 2021Publication date: December 23, 2021Inventors: Alkim Akyurtlu, Richard M. Osgood, III, Guinevere M. Strack, Yassine AitElAoud
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Patent number: 11107610Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.Type: GrantFiled: June 15, 2020Date of Patent: August 31, 2021Assignees: Raytheon Company, University of MassachusettsInventors: Erika C. Klek, Mary K. Herndon, Thomas V. Sikina, James E. Benedict, Andrew R. Southworth, Kevin M. Wilder, Oshadha K. Ranasingha, Alkim Akyurtlu
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Publication number: 20210146062Abstract: A position tracking system includes a member extending along a lengthwise axis. Multiple position tracking elements (such as conductive strips) are fabricated to be exposed on a surface of the member. The multiple position tracking elements form a sequence along the lengthwise axis and are spaced apart from each other. The position tracking system further includes a probe. The probe monitors for presences and absence of the position tracking elements disposed in the sequence as the member and corresponding sequence of position tracking elements moves with respect to the probe. Based on the detected presence and absence of position tracking elements, a monitor resource of the position tracking system monitors parameters such as: i) a position of the member along the axis, ii) a rate of movement of the member along the axis over time, iii) a direction of movement of the member along the axis, etc.Type: ApplicationFiled: December 10, 2020Publication date: May 20, 2021Inventors: Craig A. Armiento, David Musoke, Alexander Z. Senckowski, Alkim Akyurtlu, Edward D. Kingsley, Kyle M. Homan
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Publication number: 20200365300Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.Type: ApplicationFiled: June 15, 2020Publication date: November 19, 2020Inventors: Erika C. Klek, Mary K. Herndon, Thomas V. Sikina, James E. Benedict, Andrew R. Southworth, Kevin M. Wilder, Oshadha K. Ranasingha, Alkim Akyurtlu
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Patent number: 10839992Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.Type: GrantFiled: May 17, 2019Date of Patent: November 17, 2020Assignees: Raytheon Company, University of MassachusettsInventors: Erika C. Klek, Mary K. Herndon, Thomas V. Sikina, James E. Benedict, Andrew R. Southworth, Kevin M. Wilder, Oshadha K. Ranasingha, Alkim Akyurtlu
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Patent number: 10703877Abstract: Flexible substrates including a polymer selected from a thermoplastic polymer, a thermoset polymer, and/or a polymer blend, and ferroelectric perovskite-type oxide particles dispersed in the polymer, where the ferroelectric perovskite-type oxide has a dielectric constant that varies with applied voltage. The flexible substrates can be used in tunable electronics.Type: GrantFiled: November 15, 2017Date of Patent: July 7, 2020Assignee: University of MassachusettsInventors: Alkim Akyurtlu, Joey L. Mead, Carol M. F. Barry, Mahdi Haghzadeh, Artee Panwar, Mary K. Herndon
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Publication number: 20200148905Abstract: This disclosure describes manufacture of mixture and use of same to fabricate a respective electronic device. In one embodiment, the mixture includes: perovskite oxide particles and a solvent. The solvent is a water-soluble liquid such as ethylene glycol. A combination of the perovskite oxide particles and the solvent are mixed for subsequent fabrication (such as via a printing head of a printer) of an electronic device.Type: ApplicationFiled: November 8, 2018Publication date: May 14, 2020Inventors: Oshadha K. Ranasingha, Mahdi Haghzadeh, Alkim Akyurtlu, Craig A. Armiento
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Patent number: 10575408Abstract: A printed electrical connector design includes two flat patterned thermoplastic plates printed with mechanical registration features that align conductive traces on the two plates of the electrical connector. A top plate is printed with a plurality of raised pedestals and a plurality of metallic traces. A bottom plate is printed with a plurality of recessed channels and a corresponding plurality of metallic traces. The plurality of recessed channels of the bottom plate are configured to mate with the plurality of raised pedestals on the top plate. The pedestals and channels of the top and bottom plates, respectively, serve to align the metallic traces that comprise the electrical connector. The printed electrical connector design allows printed electrical/electronic circuits and/or devices to be manufactured and interfaced with other printed electrical/electronic circuits and/or devices.Type: GrantFiled: March 9, 2018Date of Patent: February 25, 2020Assignee: University of MasschusettsInventors: Craig A. Armiento, Alkim Akyurtlu
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Patent number: 10287446Abstract: A novel ferroelectric ink comprising multiphase Barium Strontium Titanate (BST) in a polymer composite is described. The ink can be employed using direct-ink writing techniques to print high dielectric constant, low loss, and electrostatically-tunable dielectrics on substrates. The substrates can be flexible such as plastics or rigid, such as substrates comprising semiconductor materials or ceramics and the like. The dielectric ink is made by suspending pre-sintered nano/submicron-sized particles of BST in a thermoplastic polymer with a solvent. After printing with the ink, a low temperature curing process is performed at temperatures below 200° C., a temperature too low to sinter BST. Fully printed devices, such as a varactor and a phase shifter using direct ink writing methodologies are described.Type: GrantFiled: November 6, 2017Date of Patent: May 14, 2019Assignee: University of MassachusettsInventors: Mahdi Haghzadeh, Alkim Akyurtlu, Craig Armiento
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Publication number: 20180263119Abstract: A printed electrical connector is fabricated via additive manufacturing technology. According to configuration, the printed electrical connector design includes two flat patterned thermoplastic plates printed with mechanical registration features that align conductive traces on the two plates of the electrical connector. A top plate is printed with a plurality of raised pedestals and a plurality of metallic traces. A bottom plate is printed with a plurality of recessed channels and a corresponding plurality of metallic traces. The plurality of recessed channels of the bottom plate are configured to mate with the plurality of raised pedestals on the top plate. The pedestals and channels of the top and bottom plates, respectively, serve to align the metallic traces that comprise the electrical connector. The printed electrical connector design allows printed electrical/electronic circuits and/or devices to be manufactured and interfaced with other printed electrical/electronic circuits and/or devices.Type: ApplicationFiled: March 9, 2018Publication date: September 13, 2018Inventors: Craig A. Armiento, Alkim Akyurtlu
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Publication number: 20180183146Abstract: A via-less beamformer provided from a plurality of circuits elements having circuit layouts selected to mitigate unwanted reactive coupling there between. At least one of the plurality of circuit elements is provided having a circuit layout selected based upon reactive field theory. In one embodiment, a circuit layout may be selected by: determining which circuit features of the circuit elements produce reactive fields in response to a signal provided thereto, separating the total field into a modal set and determining the modal weighting coefficients based on geometrical and/or design features of the of the circuit elements. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits. In one embodiment the via-less beamformer comprises one or more branch hybrid coupler circuits. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits and one or more branch hybrid coupler circuits.Type: ApplicationFiled: December 27, 2016Publication date: June 28, 2018Applicant: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, Philip M. Henault, Alkim Akyurtlu