Patents by Inventor ALLAN A. OVROM, III

ALLAN A. OVROM, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-die package
    Patent number: 10304769
    Abstract: Embodiments herein may relate to a package that includes a package substrate with a first die on a first side of the package substrate and a second die on a second side of the package substrate. Solder balls may be coupled with the second side of the package substrate and the second die such that the solder balls are approximately coplanar. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: May 28, 2019
    Assignee: INTEL CORPORATION
    Inventors: Robert L. Sankman, Allan A. Ovrom, III, Robert Starkston, Oren Arad
  • MULTI-DIE PACKAGE
    Publication number: 20180226334
    Abstract: Embodiments herein may relate to a package that includes a package substrate with a first die on a first side of the package substrate and a second die on a second side of the package substrate. Solder balls may be coupled with the second side of the package substrate and the second die such that the solder balls are approximately coplanar.
    Type: Application
    Filed: August 27, 2015
    Publication date: August 9, 2018
    Inventors: ROBERT L. SANKMAN, ALLAN A. OVROM, III, ROBERT STARKSTON, OREN ARAD