Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.

Abstract: A system for teaching a user to identify a family of items is provided including a matching symbol having an identifiable family indicator and a teaching symbol indicating a matching of the family indicator to the family of items. The teaching further illustrates compatibility of the family of items with the family indicator.

Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.

Abstract: A method and system for providing online live auctions platform is disclosed. The online live auction platform is provided among a group of bidders having similar or same interests or in one or more virtual communities. An auction process starts in a first community that permits a member of a first virtual community to list an auctioned item for bidding. All members in the first virtual community can participate in the bidding and members in a second virtual community may participate in the bidding by becoming part of the first virtual community or through one of the members in the first virtual community.