Abstract: A coupling that includes a female coupling member having at least one electrically conductive ring on an inner mating surface; a male coupling member having at least one electrically conductive ring on an outer mating surface, the outer mating surface sized to fit within the inner mating surface of the female coupling member; and wherein when the male coupling member is inserted into the female coupling member, alignment of the at least one electrically conductive ring of the female coupling member with the at least one electrically conductive ring of the male coupling member indicates whether the female coupling member and the male coupling member are fully engaged.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: A recirculating cooling system includes a coolant sampling line, a deterministic lateral displacement (DLD) microfluidic separation device, a monitoring device, and an alert generation device. The coolant sampling line is in fluid communication with a recirculating coolant line, and the DLD microfluidic separation device receives a coolant sample diverted into the coolant sampling loop from the recirculating coolant line via the coolant sampling line. The DLD microfluidic separation device includes a separation array for separating bacteria into an output channel according to a size threshold. The monitoring device monitors a characteristic property of the coolant sampling loop for comparison to a threshold for bacterial growth in the recirculating cooling system. The alert generation device generates an alert to remediate the bacterial growth in the recirculating cooling system responsive to the characteristic property of the coolant sampling loop satisfying the threshold.

Abstract: A coupling that includes a female coupling member having at least one electrically conductive ring on an inner mating surface; a male coupling member having at least one electrically conductive ring on an outer mating surface, the outer mating surface sized to fit within the inner mating surface of the female coupling member; and wherein when the male coupling member is inserted into the female coupling member, alignment of the at least one electrically conductive ring of the female coupling member with the at least one electrically conductive ring of the male coupling member indicates whether the female coupling member and the male coupling member are fully engaged.

Abstract: A cooling system is provided which includes, for instance, a coolant circulation loop, one or more primary coolant pumps, and a fill and drain pump. The primary coolant pump(s) is coupled to facilitate circulating coolant through the coolant circulation loop, and the fill and drain pump facilitates selective filling of the cooling system with the coolant, or draining of the coolant from the cooling system. The fill and drain pump is integrated with the cooling system as a backup coolant pump to the primary coolant pump(s), and circulates the coolant through the coolant circulation loop responsive to an error in the primary coolant pump(s). The primary coolant pump(s) and fill and drain pumps may be different types of pumps, and the cooling system further includes a control system for automatically activating the fill and drain pump upon detection of an error in the primary coolant pump(s).

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: A recirculating cooling system includes a coolant sampling line, a deterministic lateral displacement (DLD) microfluidic separation device, a monitoring device, and an alert generation device. The coolant sampling line is in fluid communication with a recirculating coolant line, and the DLD microfluidic separation device receives a coolant sample diverted into the coolant sampling loop from the recirculating coolant line via the coolant sampling line. The DLD microfluidic separation device includes a separation array for separating bacteria into an output channel according to a size threshold. The monitoring device monitors a characteristic property of the coolant sampling loop for comparison to a threshold for bacterial growth in the recirculating cooling system. The alert generation device generates an alert to remediate the bacterial growth in the recirculating cooling system responsive to the characteristic property of the coolant sampling loop satisfying the threshold.

Abstract: An apparatus for a switchable filter assembly includes a first conduit coupled to a second and a third conduit, where a liquid has the ability to flow through the first conduit to the second conduit and the third conduit, and where the second conduit and the third conduit are arranged in parallel. A first assembly is capable of sliding inside the first conduit, such that a position of the first assembly determines an amount of liquid flowing to the third conduit. The first assembly includes a compressible member coupled to a first structure, where the first structure prevents the liquid from passing through the first conduit to the third conduit. An amount of compression of the compressible member coupled to the first structure is dependent on a pressure of the liquid flowing from the first conduit to the second conduit.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: An apparatus for a switchable filter assembly includes a first conduit coupled to a second and a third conduit, where a liquid has the ability to flow through the first conduit to the second conduit and the third conduit, and where the second conduit and the third conduit are arranged in parallel. A first assembly is capable of sliding inside the first conduit, such that a position of the first assembly determines an amount of liquid flowing to the third conduit. The first assembly includes a compressible member coupled to a first structure, where the first structure prevents the liquid from passing through the first conduit to the third conduit. An amount of compression of the compressible member coupled to the first structure is dependent on a pressure of the liquid flowing from the first conduit to the second conduit.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: A cooling system is provided which includes, for instance, a coolant circulation loop, one or more primary coolant pumps, and a fill and drain pump. The primary coolant pump(s) is coupled to facilitate circulating coolant through the coolant circulation loop, and the fill and drain pump facilitates selective filling of the cooling system with the coolant, or draining of the coolant from the cooling system. The fill and drain pump is integrated with the cooling system as a backup coolant pump to the primary coolant pump(s), and circulates the coolant through the coolant circulation loop responsive to an error in the primary coolant pump(s). The primary coolant pump(s) and fill and drain pumps may be different types of pumps, and the cooling system further includes a control system for automatically activating the fill and drain pump upon detection of an error in the primary coolant pump(s).

Abstract: A cooling system is provided which includes, for instance, a coolant circulation loop, one or more primary coolant pumps, and a fill and drain pump. The primary coolant pump(s) is coupled to facilitate circulating coolant through the coolant circulation loop, and the fill and drain pump facilitates selective filling of the cooling system with the coolant, or draining of the coolant from the cooling system. The fill and drain pump is integrated with the cooling system as a backup coolant pump to the primary coolant pump(s), and circulates the coolant through the coolant circulation loop responsive to an error in the primary coolant pump(s). The primary coolant pump(s) and fill and drain pumps may be different types of pumps, and the cooling system further includes a control system for automatically activating the fill and drain pump upon detection of an error in the primary coolant pump(s).

Abstract: A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Abstract: An apparatus is provided which includes a changeable cover assembly sized to cover, at least in part, an air outlet side of an electronics rack. The cover assembly, when positioned at the air outlet side of the rack, redirects and vents airflow egressing from the air outlet side. The cover assembly includes a frame and at least one vent cover. The frame has at least one opening through which air egressing from the electronics rack passes, and the vent cover(s) is coupled to the frame and overlies, at least in part, the opening(s) in the frame to facilitate redirecting and venting the air passing through the frame. The at least one vent cover is changeable to change a direction of the vented air. For instance, the vent cover(s) may be reversible, or otherwise adjustable or changeable, to change the direction of vented air egressing from the cover assembly.

Abstract: A cooling system is provided which includes, for instance, a coolant circulation loop, one or more primary coolant pumps, and a fill and drain pump. The primary coolant pump(s) is coupled to facilitate circulating coolant through the coolant circulation loop, and the fill and drain pump facilitates selective filling of the cooling system with the coolant, or draining of the coolant from the cooling system. The fill and drain pump is integrated with the cooling system as a backup coolant pump to the primary coolant pump(s), and circulates the coolant through the coolant circulation loop responsive to an error in the primary coolant pump(s). The primary coolant pump(s) and fill and drain pumps may be different types of pumps, and the cooling system further includes a control system for automatically activating the fill and drain pump upon detection of an error in the primary coolant pump(s).

Abstract: An apparatus for a switchable filter assembly includes a first conduit coupled to a second and a third conduit, where a liquid has the ability to flow through the first conduit to the second conduit and the third conduit, and where the second conduit and the third conduit are arranged in parallel. A first assembly is capable of sliding inside the first conduit, such that a position of the first assembly determines an amount of liquid flowing to the third conduit. The first assembly includes a compressible member coupled to a first structure, where the first structure prevents the liquid from passing through the first conduit to the third conduit. An amount of compression of the compressible member coupled to the first structure is dependent on a pressure of the liquid flowing from the first conduit to the second conduit.

Abstract: Embodiments of the present invention provide efficient and cost-effective systems for a lidded electronic device. The lidded electronic device includes an electronic module including an integrated circuit chip built on a substrate. The lidded electronic device also includes a module lid having a heat transferring feature, which extends above the top surface of the module lid. A manifold structure can be placed over the top surface of the module lid using a variety of techniques.