Abstract: A reconfigurable server includes improved bandwidth connection to adjacent servers and allows for improved access to near-memory storage and for an improved ability to provision resources for an adjacent server. The server includes processor array and a near-memory accelerator module that includes near-memory and the near-memory accelerator module helps provide sufficient bandwidth between the processor array and near-memory. A hardware plane module can be used to provide additional bandwidth and interconnectivity between adjacent servers and/or adjacent switches.

Abstract: A connector holder includes a housing (configured to be secured within an aperture in a substrate), a first connector disposed within the housing and configured to provide a mating interface that extends above the support member and a cable that is connected to the connector and extends below the support member. The first connector is used to provide electrical connection with an associated electrical component and can provide for blind mating.

Abstract: A reconfigurable server includes improved bandwidth connection to adjacent servers and allows for improved access to near-memory storage and for an improved ability to provision resources for an adjacent server. The server includes processor array and a near-memory accelerator module that includes near-memory and the near-memory accelerator module helps provide sufficient bandwidth between the processor array and near-memory. A hardware plane module can be used to provide additional bandwidth and interconnectivity between adjacent servers and/or adjacent switches.

Abstract: A reconfigurable server includes improved bandwidth connection to adjacent servers and allows for improved access to near-memory storage and for an improved ability to provision resources for an adjacent server. The server includes processor array and a near-memory accelerator module that includes near-memory and the near-memory accelerator module helps provide sufficient bandwidth between the processor array and near-memory. A hardware plane module can be used to provide additional bandwidth and interconnectivity between adjacent servers and/or adjacent switches.

Abstract: A reconfigurable server includes improved bandwidth connection to adjacent servers and allows for improved access to near-memory storage and for an improved ability to provision resources for an adjacent server. The server includes processor array and a near-memory accelerator module that includes near-memory and the near-memory accelerator module helps provide sufficient bandwidth between the processor array and near-memory. A hardware plane module can be used to provide additional bandwidth and interconnectivity between adjacent servers and/or adjacent switches.

Abstract: A reconfigurable server includes improved bandwidth connection to adjacent servers and allows for improved access to near-memory storage and for an improved ability to provision resources for an adjacent server. The server includes processor array and a near-memory accelerator module that includes near-memory and the near-memory accelerator module helps provide sufficient bandwidth between the processor array and near-memory. A hardware plane module can be used to provide additional bandwidth and interconnectivity between adjacent servers and/or adjacent switches.

Abstract: A reconfigurable server includes improved bandwidth connection to adjacent servers and allows for improved access to near-memory storage and for an improved ability to provision resources for an adjacent server. The server includes processor array and a near-memory accelerator module that includes near-memory and the near-memory accelerator module helps provide sufficient bandwidth between the processor array and near-memory. A hardware plane module can be used to provide additional bandwidth and interconnectivity between adjacent servers and/or adjacent switches.

Abstract: Solid state memory modules are disclosed having increased density for module size/footprint. Different embodiments also provide for improved interconnect arrangements between the memory modules and the corresponding field programmable gate array (FPGA), micro-processor (?P), or application-specific integrated circuit (ASIC). These interconnects provide for greater module interconnect flexibility, operating speed and operating efficiency. Some memory module embodiments according to the present invention comprises a plurality of solid state memory devices arranged on a first printed circuit board. A second printed circuit board is on and electrically connected to the first printed circuit board, with the second printed circuit board having a pin-out for direct coupling to a host device.

Abstract: Solid state memory modules are disclosed having increased density for module size/footprint. Different embodiments also provide for improved interconnect arrangements between the memory modules and the corresponding field programmable gate array (FPGA), micro-processor (?P), or application-specific integrated circuit (ASIC). These interconnects can provide for greater module interconnect flexibility, operating speed and operating efficiency. Some memory module embodiments according to the present invention comprises a plurality of solid state memory devices arranged on a first printed circuit board. A second printed circuit board is on and electrically connected to the first printed circuit board, with the second printed circuit board having a pin-out for direct coupling to a host device.

Abstract: A module standard for integrated circuit such as FPGAs is provided in which power supply voltages for daughtercards are not fixed in advance. Instead programmable power supplies are provided and a method is provided in which each daughtercard can specify the required power supply voltage. Thus, unlike prior-art systems, this modular system is backward and forward compatible with chips, such as FPGAs, from many process generations allowing easy upgrading as new FPGA families become available. A motherboard or baseboard for use with this invention includes a plurality of module connectors into which compatible modules or “daughtercards” can be plugged and a plurality of programmable power supplies. In a preferred embodiment there are four sets of module connectors and sixteen programmable power supplies. This allows each module to have four independently specifiable power supply voltages. A module may also connect several power supplies together in order to obtain higher current at a single voltage.