Patents by Inventor Allan D. Abrams

Allan D. Abrams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer front side protection
    Patent number: 7288465
    Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: October 30, 2007
    Assignee: International Business Machines Corpoartion
    Inventors: Allan D. Abrams, Donald W. Brouillette, Joseph D. Danaher, Timothy C. Krywanczyk, Rene A. Lamothe, Ivan J. Stone, Matthew R. Whalen
  • Semiconductor wafer front side protection
    Patent number: 7001827
    Abstract: There is provided a method for making a wafer including the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: February 21, 2006
    Assignee: International Business Machines Corporation
    Inventors: Allan D. Abrams, Donald W. Brouillette, Joseph D. Danaher, Timothy C. Krywanczyk, Rene A. Lamothe, Ivan J. Stone, Matthew R. Whalen
  • Semiconductor wafer front side protection
    Publication number: 20040209444
    Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Application
    Filed: April 15, 2003
    Publication date: October 21, 2004
    Applicant: International Business Machines Corporation
    Inventors: Allan D. Abrams, Donald W. Brouillette, Joseph D. Danaher, Timothy C. Krywanczyk, Rene A. Lamothe, Ivan J. Stone, Matthew R. Whalen
  • Tailoring of via-hole sidewall slope
    Patent number: 4624740
    Abstract: A method of selectively tailoring the slope of via hole sidewalls. A first polyimide layer (in which the vias are to be formed) is covered by a strippable layer, and the two layers are isotropically etched. By varying the thickness of the strippable layer with respect to that of the polyimide layer, the slope of the via hole sidewalls can be controlled.
    Type: Grant
    Filed: January 22, 1985
    Date of Patent: November 25, 1986
    Assignee: International Business Machines Corporation
    Inventors: Allan D. Abrams, Robert C. Bausmith, Karey L. Holland, Steven P. Holland