Patents by Inventor Allan Gleason
Allan Gleason has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11921568Abstract: A computer-implemented method includes based on a calculated first estimated error rate, second estimated error rate, first uncertain rank count, second uncertain rank count, and target error rate, displaying a stopping point indication. A computing system includes a processor; and a memory storing instructions that, when executed, cause the computing system to: based on a calculated first estimated error rate, second estimated error rate, first uncertain rank count, second uncertain rank count, and target error rate, display a stopping point indication. A non-transitory computer readable medium includes program instructions that when executed, cause a computer system to: based on a calculated first estimated error rate, second estimated error rate, first uncertain rank count, second uncertain rank count, and target error rate, display a stopping point indication.Type: GrantFiled: August 4, 2022Date of Patent: March 5, 2024Assignee: RELATIVITY ODA LLCInventors: Jesse Allan Winkler, Elise Tropiano, Robert Jenson Price, Brandon Gauthier, Theo Van Wijk, Patricia Ann Gleason
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Patent number: 8795029Abstract: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.Type: GrantFiled: January 18, 2013Date of Patent: August 5, 2014Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
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Publication number: 20140038501Abstract: A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface.Type: ApplicationFiled: October 10, 2013Publication date: February 6, 2014Applicant: Applied Materials, Inc.Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
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Patent number: 8506356Abstract: An apparatus for chemical mechanical polishing (CMP) of a wafer has a rotatable platen to hold a polishing pad, a polishing head for holding the wafer against the polishing pad, an optical monitoring system and a position sensor. The platen has a hole therein, the optical monitoring system includes a light source to direct a light beam through the aperture toward the wafer from a side of the wafer contacting the polishing pad and a detector to receive reflections of the light beam from the wafer, and the position sensor senses when the hole is adjacent the wafer such that the light beam generated by the light source can pass through the hole and impinge on the wafer.Type: GrantFiled: August 4, 2010Date of Patent: August 13, 2013Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
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Publication number: 20130130413Abstract: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.Type: ApplicationFiled: January 18, 2013Publication date: May 23, 2013Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
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Publication number: 20100297917Abstract: An apparatus for chemical mechanical polishing (CMP) of a wafer has a rotatable platen to hold a polishing pad, a polishing head for holding the wafer against the polishing pad, an optical monitoring system and a position sensor. The platen has a hole therein, the optical monitoring system includes a light source to direct a light beam through the aperture toward the wafer from a side of the wafer contacting the polishing pad and a detector to receive reflections of the light beam from the wafer, and the position sensor senses when the hole is adjacent the wafer such that the light beam generated by the light source can pass through the hole and impinge on the wafer.Type: ApplicationFiled: August 4, 2010Publication date: November 25, 2010Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
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Patent number: 7775852Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.Type: GrantFiled: April 5, 2005Date of Patent: August 17, 2010Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
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Publication number: 20080227367Abstract: A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.Type: ApplicationFiled: August 14, 2007Publication date: September 18, 2008Applicant: APPLIED MATERIALS, INC.Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
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Patent number: 7255629Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.Type: GrantFiled: September 15, 2006Date of Patent: August 14, 2007Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
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Publication number: 20070021037Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.Type: ApplicationFiled: September 15, 2006Publication date: January 25, 2007Applicant: APPLIED MATERIALS, INC.Inventors: Manoocher Birang, Allan Gleason, William Guthrie
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Publication number: 20070015441Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.Type: ApplicationFiled: September 15, 2006Publication date: January 18, 2007Applicant: Applied Materials, Inc.Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
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Patent number: 7118450Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.Type: GrantFiled: September 12, 2005Date of Patent: October 10, 2006Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
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Patent number: 7011565Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.Type: GrantFiled: April 1, 2003Date of Patent: March 14, 2006Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
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Publication number: 20060014476Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.Type: ApplicationFiled: September 12, 2005Publication date: January 19, 2006Inventors: Manoocher Birang, Allan Gleason, William Guthrie
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Publication number: 20050170751Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.Type: ApplicationFiled: April 5, 2005Publication date: August 4, 2005Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
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Patent number: 6910944Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.Type: GrantFiled: May 22, 2001Date of Patent: June 28, 2005Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
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Patent number: 6876454Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.Type: GrantFiled: September 20, 1999Date of Patent: April 5, 2005Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
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Patent number: 6875078Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.Type: GrantFiled: March 25, 2003Date of Patent: April 5, 2005Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Allan Gleason
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Patent number: 6860791Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.Type: GrantFiled: November 25, 2003Date of Patent: March 1, 2005Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Allan Gleason
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Patent number: 6719818Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.Type: GrantFiled: February 24, 1998Date of Patent: April 13, 2004Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Nils Johansson, Allan Gleason