Patents by Inventor Allan Gleason

Allan Gleason has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8795029
    Abstract: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: August 5, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Publication number: 20140038501
    Abstract: A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface.
    Type: Application
    Filed: October 10, 2013
    Publication date: February 6, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
  • Patent number: 8506356
    Abstract: An apparatus for chemical mechanical polishing (CMP) of a wafer has a rotatable platen to hold a polishing pad, a polishing head for holding the wafer against the polishing pad, an optical monitoring system and a position sensor. The platen has a hole therein, the optical monitoring system includes a light source to direct a light beam through the aperture toward the wafer from a side of the wafer contacting the polishing pad and a detector to receive reflections of the light beam from the wafer, and the position sensor senses when the hole is adjacent the wafer such that the light beam generated by the light source can pass through the hole and impinge on the wafer.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: August 13, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Publication number: 20130130413
    Abstract: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.
    Type: Application
    Filed: January 18, 2013
    Publication date: May 23, 2013
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Publication number: 20100297917
    Abstract: An apparatus for chemical mechanical polishing (CMP) of a wafer has a rotatable platen to hold a polishing pad, a polishing head for holding the wafer against the polishing pad, an optical monitoring system and a position sensor. The platen has a hole therein, the optical monitoring system includes a light source to direct a light beam through the aperture toward the wafer from a side of the wafer contacting the polishing pad and a detector to receive reflections of the light beam from the wafer, and the position sensor senses when the hole is adjacent the wafer such that the light beam generated by the light source can pass through the hole and impinge on the wafer.
    Type: Application
    Filed: August 4, 2010
    Publication date: November 25, 2010
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 7775852
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: August 17, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Publication number: 20080227367
    Abstract: A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.
    Type: Application
    Filed: August 14, 2007
    Publication date: September 18, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
  • Patent number: 7255629
    Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: August 14, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
  • Publication number: 20070021037
    Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
    Type: Application
    Filed: September 15, 2006
    Publication date: January 25, 2007
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Manoocher Birang, Allan Gleason, William Guthrie
  • Publication number: 20070015441
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Application
    Filed: September 15, 2006
    Publication date: January 18, 2007
    Applicant: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 7118450
    Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: October 10, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
  • Patent number: 7011565
    Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: March 14, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
  • Publication number: 20060014476
    Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
    Type: Application
    Filed: September 12, 2005
    Publication date: January 19, 2006
    Inventors: Manoocher Birang, Allan Gleason, William Guthrie
  • Publication number: 20050170751
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Application
    Filed: April 5, 2005
    Publication date: August 4, 2005
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 6910944
    Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: June 28, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
  • Patent number: 6876454
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Grant
    Filed: September 20, 1999
    Date of Patent: April 5, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 6875078
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: April 5, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason
  • Patent number: 6860791
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: March 1, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason
  • Patent number: 6719818
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: April 13, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Publication number: 20040014395
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Application
    Filed: March 25, 2003
    Publication date: January 22, 2004
    Applicant: Applied Materials, Inc., a Delaware corporation
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason