Abstract: A semiconductor device may include a semiconductor substrate, a wire placed along at least a portion of a perimeter of the semiconductor substrate, and processing circuitry connected to the wire, the processing circuitry to, based on a signal from the wire, determine whether or not the semiconductor device is damaged.

Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.

Abstract: A circuit providing electrostatic discharge (ESD) protection and a method and an apparatus for testing ESD protection on an integrated circuit are described. The circuit includes a first ESD protection circuit and a test pad and a second ESD protection circuit and a second pad for the application, not probed during manufacturing of the integrated circuit. In some examples, the method includes providing a first, second, third, and fourth test current to the circuit providing ESD protection, measuring a first second, third, and fourth voltage drop across the circuit, and determining an operating condition for the first ESD protection circuit and the test pad and the second ESD protection circuit and the second bond pad based on expected values of the first voltage drop, the second voltage drop, the third voltage drop, and the fourth voltage drop.

Abstract: A circuit providing electrostatic discharge (ESD) protection and a method and an apparatus for testing ESD protection on an integrated circuit are described. The circuit includes a first ESD protection circuit and a test pad and a second ESD protection circuit and a second pad for the application, not probed during manufacturing of the integrated circuit. In some examples, the method includes providing a first, second, third, and fourth test current to the circuit providing ESD protection, measuring a first second, third, and fourth voltage drop across the circuit, and determining an operating condition for the first ESD protection circuit and the test pad and the second ESD protection circuit and the second bond pad based on expected values of the first voltage drop, the second voltage drop, the third voltage drop, and the fourth voltage drop.