Patents by Inventor Allan L Astbury, Jr.

Allan L Astbury, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shielded waferized connector
    Patent number: 6602095
    Abstract: A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: August 5, 2003
    Assignee: Teradyne, Inc.
    Inventors: Allan L Astbury, Jr., Thomas S. Cohen
  • Waferized power connector
    Patent number: 6592381
    Abstract: An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: July 15, 2003
    Assignee: Teradyne, Inc.
    Inventors: Thomas S. Cohen, Allan L Astbury, Jr., Steven J. Allen
  • Connector molding method and shielded waferized connector made therefrom
    Patent number: 6409543
    Abstract: A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: June 25, 2002
    Assignee: Teradyne, Inc.
    Inventors: Allan L Astbury, Jr., Thomas S. Cohen