Abstract: A fixture for securing a circuit chip substrate having on one side solder connections during wet processing using a pulse jet delivery cleaning system for removing solder flux residue on the solder connections. The fixture comprises a frame of sufficient size to at least partially surround and contact the substrate on a first side and a lid cooperating with the frame to at least partially cover the substrate on a second side containing the solder connections. A resilient polymeric separator is disposed on the lid and faces the substrate for contacting the substrate second side containing the solder connections. There are also openings in the frame for permitting circulation of a cleaner to contact the second side of the substrate.

Abstract: Method and apparatus for cleaning a workpiece such as a semiconductor element in which the element is placed on a chuck mounted on a rotation mechanism in which the rotation mechanism rotates around a first axis, and the element to be cleaned rotates around a second axis spaced from the first axis in a planetary manner. The cleaning process is programmed such that the element may be sprayed, immersed for a soak or pre-soak step, immersed while spinning, sprayed while spinning, and dried by heated gas, or any combination of these. The cleaning program is performed in a single chamber, which may be heated to a desired temperature.

Abstract: Method and apparatus for cleaning a workpiece such as a semiconductor element in which the element is placed on a chuck mounted on a rotation mechanism in which the rotation mechanism rotates around a first axis, and the element to be cleaned rotates around a second axis spaced from the first axis in a planetary manner. The cleaning process is programmed such that the element may be sprayed, immersed for a soak or pre-soak step, immersed while spinning, sprayed while spinning, and dried by heated gas, or any combination of these. The cleaning program is performed in a single chamber, which may be heated to a desired temperature.

Abstract: Method and apparatus for cleaning a workpiece such as a semiconductor element in which the element is placed on a chuck mounted on a rotation mechanism in which the rotation mechanism rotates around a first axis, and the element to be cleaned rotates around a second axis spaced from the first axis in a planetary manner. The cleaning process is programmed such that the element may be sprayed, immersed for a soak or pre-soak step, immersed while spinning, sprayed while spinning, and dried by heated gas, or any combination of these. The cleaning program is performed in a single chamber, which may be heated to a desired temperature.

Abstract: A paper roll holder has a paper roll enclosure for rigid partially embedded mounting of the paper roll enclosure into an aperture in a vertical wall, the aperture in a vertical wall defining an upper edge and opposed lower edge in the wall, a releasable cover for releasable mating onto an exposed front face of the paper roll enclosure, the paper roll enclosure having an opposed pair of generally vertical side walls, a lower trough extending laterally between the sidewalls for receiving a paper roll therein, the lower trough having a generally horizontal front lip extending laterally between the side walls, a channel extending downwardly from an undersurface of the lower trough for releasable mating of the channel over the lower edge in the wall, an upper mounting flange extending generally parallel to the channel and extending generally perpendicularly between, and generally upwardly from, the side walls, a rear wall extending upwardly and forwardly from a laterally extending rear-most extremity of the trough

Abstract: A phenolic moulding composition in solid form, such as a dough moulding composition or sheet moulding composition, comprises a phenol formaldehyde novolak resin; a phenol formaldehyde resole resin as cross linking agent for the novolak resin; fibrous reinforcement; and non-fibrous particulate filler in an amount greater than the combined amount of the novolak and resole resins; the weight proportions of the ingredients being in the ranges______________________________________ phenolic resins 20-40% fibrous reinforcement 20-50% non-fibrous particulate filler 25-50% ______________________________________Articles moulded from the compositions under heat and pressure have the flexural strength and impact strength required in certain precision parts for the automotive and engineering industries.

Abstract: An asbestos-free heat settable composition includes a fibrous reinforcement comprising aramid fibres in the form of a carded or needled non-woven web or felt, or a loosely woven or knitted fabric.

Abstract: A thermoplastic moulding material comprising (a) a synthetic thermoplastic polymer having a backbone comprising at least 50% of carbon atoms and selected from polypropylene, polyethylene, polystyrene, styrene/acrylonitrile copolymers, polyester, polyamides, ABS copolymers and acetal copolymers (b) from 0.05 to 10 percent by weight, based on the total weight of material, of polyimide pre-polymer (c) a reinforcing agent selected from glass fiber and mica.

Abstract: A mouldable thermoplastic material and process for making the same. The material comprises from 20% to 90% by weight of polypropylene, polyethylene or polyamide, from 80 to 10% by weight of glass fibre and from 0.05% to 15% by weight of an additive capable of coupling with the glass at a temperature in the range 180.degree. C to 300.degree. C and incapable of forming a homopolymer at that temperature.