Abstract: The invention is a connector which employs both surface mount technology as well as through-hole technology to connect one printed circuit board (PCB) to another. In one embodiment, the connector includes a pair of square prongs the length of which depends on the thickness of the PCB. The height of the connector depends on the needed stand-off height between the two PCBs. The prongs enable fastening of the connector to a first PCB using through-hole technology (THT) by creating an interference fit with the first PCB via holes formed in the first PCB. An predetermined surface of the connector opposite from the surface defined by the first PCB is co-planar with the surface of a second PCB, to enable fastening of the connector to a corresponding area on the surface of the second PCB using surface mount technology (SMT).

Abstract: A method and corresponding structure having conductors fastened in an offset fashion to appropriately patterned traces on the PCB to surround a single magnetic core positioned on the surface of the printed circuit board so as to create an inductor coil. The inventive method and structure reduces component and manufacturing cost by providing substantially pie-slice shaped conductors shaped for efficient automated production since the inventive shaped conductors can be soldered in place during the reflow process for the entire printed circuit board. As a result, a low profile surface mounted inductor is provided. Flux leakage is also reduced compared to known magnetic core winding structures.

Abstract: The present invention provides a metallic power connector for PCB-to-PCB attachment using surface mount technology. The connector has a cross section that is in the shape of a hollow trapezoid. Parallel sides of the trapezoid are adapted for connecting to contact pads on the PCBs with differently shaped footprints. The non-parallel sides of the trapezoid provide structural stability and rigidity not found in prior art SMT connectors. The inventive metallic SMT power connector allows for power and heat flow from a first PCB to a second PCB, and is compatible with automated SMT processes.