Abstract: Disclosed embodiments describe techniques for personal area network (PAN) enablement. PAIN connection uses an interconnection laminate substrate for connectivity of personal area network components. The interconnection laminate substrate may be flexible or rigid. In one preferred form of the invention, the interconnection laminate substrate is flexible. A plurality of personal area network components is provided. An interconnection laminate substrate is provided within a manufactured article (e.g., a soft good assembly), where the interconnection laminate substrate enables connectivity among the plurality of personal area network components, and where the interconnection laminate substrate comprises interconnection wiring encapsulated in at least one protective encapsulation layer, with the interconnection wiring being coupled to a plurality of exposed connectors.

Abstract: The present invention is directed to a synthetic patch application method and device in which synthetic patching material is kept cool while it is mixed in a static mixing tube, prior to application to plywood panels. The synthetic patching material is kept cool by means of a removable cooling jacket that is installed to remove the exothermic heat of reaction generated during the mixing process. The cooling jacket is removable and reusable, and may be easily dismounted and remounted when replacement, adjustment, or repair of the static mixing tube is necessary. The present invention thus provides an improved method of repairing plywood panels using thermosetting resin-based synthetic patching materials in which waste is minimized and time between replacement of static mixing tubes is significantly extended.