Abstract: A medical device system for providing sensor data capture includes a medical device that may include one or more removably coupled sensor hubs and that includes a display to provide sensor data and at least one data interface (DI) port that may be a sensor-agnostic DI (SA-DI) port and a data transfer cable that may be compatible with the sensor-agnostic DI port and includes a first electromechanical connector configured to detachably couple to the SA-DI port and a second electromechanical connector configured to couple to the sensor and that includes a cable memory and processor configured to execute stored software to format sensor data according to a protocol of the SA-DI port, an authentication circuit, and a cable isolation device to limit patient leakage current flow from the medical device to the sensor and to electrically isolate the authentication circuit from the cable processor and the cable memory.

Abstract: A removable electronic module of this invention includes an electronic device, such as a memory storage drive, having an electrical device connector for mating with an electrical bay connector in a computer. The module also includes a connector guide mounted about the electrical device connector. The connector guide is adapted to engage the electrical bay connector to align the electrical device connector with the electrical bay connector. The module further includes an auxiliary device guide positioned apart from the connector guide. The auxiliary device guide is adapted to engage an auxiliary bay guide to align the connector guide with the electrical bay connector.

Abstract: A heat dissipating arrangement in a portable computer uses a copper slug disposed between a heat-generating central processing unit (CPU) chip and the underside of a metallic keyboard baseplate. The slug also extends through a copper-plated hole in a printed circuit (PC) board, and is either soldered to the copper plating or press-fit into the hole to enhance heat transfer between the slug and the PC board. Small through-holes extend through the PC board and the copper plating next to the opening. These through-holes connect the copper plating to several layers of etch within the PC board, so that these layers act like fins on a heat sink to increase heat transfer away from the CPU.