Abstract: Microwaveable packing compositions exhibiting improved temperature control are provided. These compositions comprise a dielectric substrate having at least a portion of at least one of its surfaces coated with a matrix composition containing susceptor particles as well as particles of a blocking agent selected from the group consisting of calcium salts, zinc salts, zinc oxide, lithopone, silica and titanium dioxide. Also disclosed is a microwaveable ink composition useful for the preparation of such packaging compositions as well as a process for manufacturing such packaging compositions.