Patents by Inventor Allan Tungul Flores

Allan Tungul Flores has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless module with active devices
    Patent number: 9698143
    Abstract: In a general aspect, a wireless multichip module can include a leadframe structure with portions configured to receive at least one flip-chip mounted semiconductor die, including one or more of an integrated circuit, a high side MOSFET and/or a low side MOSFET, which can form a half-bridge circuit that is encapsulated in a molding compound. The module can be assembled without any bond wires (e.g., be wireless). The module may include carry passive components including an external input capacitor and/or an internal input capacitor.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: July 4, 2017
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Allan Tungul Flores, Romel N. Manatad
  • WIRELESS MODULE WITH ACTIVE AND PASSIVE COMPONENTS
    Publication number: 20140070329
    Abstract: A wireless multichip module has a leadframe structure 10 with potions for receiving flip-chip mounted dies, including an integrated circuit 20 and high and low side mosfets 30, 40 to form a half-bridge circuit encapsulated in molding compound 70. The module is assembled without any bond wires. The module may also carry passive components including an external input capacitor 150 or an internal input capacitor 350.
    Type: Application
    Filed: September 6, 2013
    Publication date: March 13, 2014
    Applicant: FAIRCHILD SEMICONDUCTOR CORPORATION
    Inventors: Allan Tungul Flores, Romel N. Manatad, Jan Vincent C. Mancelita
  • WIRELESS MODULE WITH ACTIVE DEVICES
    Publication number: 20140071650
    Abstract: A wireless multichip module has a leadframe structure 10 with potions for receiving flip-chip mounted dies, including an integrated circuit 20 and high and low side mosfets 30, 40 to form a half-bridge circuit encapsulated in molding compound 70. The module is assembled without any bond wires. The module may also carry passive components including an external input capacitor 150 or an internal input capacitor 350.
    Type: Application
    Filed: September 6, 2013
    Publication date: March 13, 2014
    Applicant: FAIRCHILD SEMICONDUCTOR CORPORATION
    Inventors: Allan Tungul Flores, Romel N. Manatad