Patents by Inventor Allan Vescovi

Allan Vescovi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anti-binding deposition ring
    Patent number: 6733829
    Abstract: A deposition ring which has a cut out on its interior circumferential edge. The deposition ring is configured to contact an edge of an electrostatic chuck and shield at least a portion of the electrostatic chuck during a deposition process wherein material is deposited onto an item, such as a semiconductor wafer, which is disposed on the electrostatic chuck. The interior circumferential edge of the deposition ring includes a surface portion which is configured to engage the edge of the electrostatic chuck, and includes the cut out portion which is configured to be spaced away and not contact the edge of the electrostatic chuck during the deposition process. As such, the deposition ring does not tend to bind with the electrostatic chuck during the deposition process.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: May 11, 2004
    Assignee: LSI Logic Corporation
    Inventors: Dave Stacey, Jonathan Allinger, Allan Vescovi
  • Anti-binding deposition ring
    Publication number: 20030177981
    Abstract: A deposition ring which has a cut out on its interior circumferential edge. The deposition ring is configured to contact an edge of an electrostatic chuck and shield at least a portion of the electrostatic chuck during a deposition process wherein material is deposited onto an item, such as a semiconductor wafer, which is disposed on the electrostatic chuck. The interior circumferential edge of the deposition ring includes a surface portion which is configured to engage the edge of the electrostatic chuck, and includes the cut out portion which is configured to be spaced away and not contact the edge of the electrostatic chuck during the deposition process. As such, the deposition ring does not tend to bind with the electrostatic chuck during the deposition process.
    Type: Application
    Filed: March 19, 2002
    Publication date: September 25, 2003
    Inventors: Dave Stacey, Jonathan Allinger, Allan Vescovi