Patents by Inventor Allen A.B. Hogan

Allen A.B. Hogan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT AND METHOD FOR TESTING INSULATING MATERIAL
    Publication number: 20120212245
    Abstract: An integrated circuit is disclosed. The integrated circuit includes an insulating material layer. The integrated circuit also includes a metal structure. Furthermore, the integrated circuit includes a via through the insulating material layer that is coupled to the metal structure for testing insulating material by applying dynamic voltage switching to two adjacent metal components of the metal structure.
    Type: Application
    Filed: February 1, 2012
    Publication date: August 23, 2012
    Applicant: QUALCOMM Incorporated
    Inventors: Angelo Pinto, Martin L. Villafana, You-Wen Yau, Homyar C. Mogul, Lavakumar Ranganathan, Rohan V. Gupte, Weijia Qi, Kent J. Pingrey, Carlos P. Aguilar, Paul J. Giotta, Leon Y. Leung, Jina M. Antosz, Bhupen M. Shah, Choh fei Yeap, Michael J. Campbell, Lawrence A. Elugbadebo, Allen A.B. Hogan