Patents by Inventor Allen B DOERR

Allen B DOERR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal management assembly
    Patent number: 10114433
    Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: October 30, 2018
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Thomas Robert Bowden, Allen B Doerr, John Franz, Melvin K Benedict, Joseph Allen, John Norton, Binh Nguyen
  • THERMAL MANAGEMENT ASSEMBLY
    Publication number: 20160357233
    Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.
    Type: Application
    Filed: April 30, 2014
    Publication date: December 8, 2016
    Inventors: Thomas Robert BOWDEN, Allen B DOERR, John FRANZ, Melvin K BENEDICT, Joseph ALLEN, John NORTON, Binh NGUYEN