Abstract: Apparatus and methods are disclosed, such as those involving an electronic device. One such apparatus includes a transmitter; a receiver; and a transmit/receive switch configured to electrically block the receiver from the transmitter during a transmit period. The transmit/receive switch includes one or more MOSFETs coupled between an input node and an output node, the input node being electrically coupled to the transmitter, the output node being electrically coupled to the receiver. The one or more MOSFETs are configured to be off during the transmit period. The transmit/receive switch further includes a clamp circuit configured to couple the output node to ground during the transmit period. This configuration effectively protects the receiver while minimizing switching artifacts.

Abstract: Apparatus and methods are disclosed, such as those involving an electronic device. One such apparatus includes a transmitter; a receiver; and a transmit/receive switch configured to electrically block the receiver from the transmitter during a transmit period. The transmit/receive switch includes one or more MOSFETs coupled between an input node and an output node, the input node being electrically coupled to the transmitter, the output node being electrically coupled to the receiver. The one or more MOSFETs are configured to be off during the transmit period. The transmit/receive switch further includes a clamp circuit configured to couple the output node to ground during the transmit period. This configuration effectively protects the receiver while minimizing switching artifacts.

Abstract: A method for applying solder paste on tape carrier package component sites of a printed circuit board is disclosed. In accordance with a method and system of the present invention, a stencil having multiple openings for each device pad on the printed circuit board is provided. Each of the openings is approximately 0.012".times.0.0053" in size. The stencil is then secured in a fixed position directly above a printed circuit board. Finally, solder paste is selectively applied to the printed circuit board through the stencil with an applicator.