Abstract: A MEMS thermal actuator device is provided that is capable of providing linear displacement in a plane generally parallel to the surface of a substrate. Additionally, the MEMS thermal actuator of the present invention may provide for a self-contained heating mechanism that allows for the thermal actuator to be actuated using lower power consumption and lower operating temperatures. The MEMS thermal actuator includes a microelectronic substrate having a first surface and at least one anchor structure affixed to the first surface. A composite beam extends from the anchor(s) and overlies the first surface of the substrate. The composite beam is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface of the microelectronic substrate. In one embodiment the composite beam comprises two or layers having materials that have correspondingly different thermal coefficients of expansion.

Abstract: In embodiments of the present invention, a microelectromechanical actuator includes a beam having respective first and second ends attached to a substrate and a body disposed between the first and second ends having a sinuous shape. The body includes a portion operative to engage a object of actuation and apply a force thereto in a direction perpendicular to the beam responsive to at least one of a compressive force and a tensile force on the beam. The sinuous shape may be sinusoidal, e.g., a shape approximating a single period of a cosine curve or a single period of a sine curve. The beam may be thermally actuated or driven by another actuator. In other embodiments, a rotary actuator includes first and second beams, a respective one of which has first and second ends attached to a substrate and a body disposed between the first and second ends. Each body includes first and second oppositely inflected portions.

Abstract: Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.

Abstract: A MEMS thermal actuator device is provided that is capable of providing linear displacement in a plane generally parallel to the surface of a substrate. Additionally, the MEMS thermal actuator of the present invention may provide for a self-contained heating mechanism that allows for the thermal actuator to be actuated using lower power consumption and lower operating temperatures. The MEMS thermal actuator includes a microelectronic substrate having a first surface and at least one anchor structure affixed to the first surface. A composite beam extends from the anchor(s) and overlies the first surface of the substrate. The composite beam is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface of the microelectronic substrate. In one embodiment the composite beam comprises two or layers having materials that have correspondingly different thermal coefficients of expansion.

Abstract: A MEMS thermal actuator device is provided that is capable of providing linear displacement in a plane generally parallel to the surface of a substrate. Additionally, the MEMS thermal actuator may provide for a self-contained heating mechanism that allows for the thermal actuator to be actuated using lower power consumption and lower operating temperatures. The MEMS thermal actuator includes a microelectronic substrate having a first surface and at least one anchor structure affixed to the first surface. A composite beam extends from the anchor(s) and overlies the first surface of the substrate. The composite beam is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface of the microelectronic substrate.